JPS61168298A - Electronic component mounting apparatus changeable in attitude electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

TECHNICAL FIELD The present invention relates to an electronic component mounting device that holds electronic components by a component holding section of a component holding head and automatically mounts them onto a component support member such as a printed circuit board. The present invention relates to a device that can be mounted in two ways by changing the rotational posture of an electronic component held by a component holding head about the center line of a component support.

Conventional technology The above-mentioned electronic component mounting device is disclosed in Japanese Patent Application Laid-Open No. 58-2134.
This is already known from Publication No. 96 G.

In the electronic component mounting apparatus described in this publication, as shown in FIG. 10, a suction head 230 serving as a component holding head is attached to a suction portion (component holding portion) of a suction tube 232 that suctions and holds electronic components. The electronic component 236 is attached to the head holder 234 in a state where it can rotate around the center line, and the rotational attitude of the electronic component 236 sucked into the suction tube around the center line of the suction tube is detected by the imaging device, and based on the detection result, A head rotation device 238 rotates the suction head 230 by a predetermined angle, thereby changing the posture of the electronic component 236, and then mounting the electronic component 236 on a printed circuit board or the like.

According to such an electronic component mounting apparatus, the suction head 23
Since the electronic component 236 can be mounted on a printed circuit board or the like after correcting the error in the holding posture of the electronic component 236 due to zero, the mounting accuracy can be improved.

Problems to be Solved by the Invention However, in the electronic component mounting apparatus described in the above publication, the head rotating device 238 is
Since it is provided on the head holder 234 that rotatably holds the head 0 and moves with it,
The mass that moves together with the suction head 230 is large, and it is difficult to move the suction head 230 at high speed to improve the efficiency of component mounting work.

In addition, in this electronic component mounting apparatus, the suction head 2
30 is provided with an arc-shaped held part 240 centered on the center line of the suction part of the suction tube 232, and this held part 240
is held by the head holder 234 via the guide roller 242, and the head rotating device 23
8 rotates the suction head 230 by bringing the driving arm 244 into contact with the end surface of the held part 240. Therefore, the rotatable angle of the suction head 230 is limited to a relatively small angle, and the electronic Although it is possible to correct errors in the rotational posture of the component 236 around the center line of the suction tube, it is also possible to rotate the electronic component 236 by a large angle such as 45 degrees, 90 degrees, or 180 degrees to attach the electronic component 236 to the printer 1 to the board, etc. Cannot be installed.

Furthermore, since the rotatable angle of the suction head 230 is limited, the suction head 230 must be returned to a predetermined reference phase position for each component mounting operation. If you do not do this, a large number of electronic components 236
If the suction head 230 is continuously held in the same direction with an attitude error, the suction head 230 is rotated in the same direction by small angles in order to correct the error, and reaches one limit of the rotatable angle range. This is because problems may occur.

Means for Solving the Problems In order to solve the above-mentioned problems, the first invention of the present application has a component holding head that holds an electronic component in a component holding section that is aligned with the center line of the component holding section by a head holder. In an electronic component mounting device that is rotatably held around the electronic component and rotated by a head rotation device, the component holding head changes the posture of the electronic component held by the component holding head and then mounts the electronic component on a component support such as a printed circuit board. The head holder is configured to move the component holding head from the component receiving position to the component mounting position by applying a motion including a component in a direction perpendicular to the center line of the component holder, and to move the component holding head to the component mounting position. A driven rotary body having a circular cross section centered on the center line of the holding part is provided, and is located close to a single stop position in the movement path of the component holding head from the component receiving position to the component mounting position, The drive rotor has a circular cross section that frictionally engages with the driven rotor, a contact/separation device that brings the drive rotor into contact with and separates it from the driven rotor, and a rotational drive device that rotationally drives the drive rotor. It is equipped with a head rotation device.

Further, in order to similarly solve the above-mentioned problem, the second invention of the present application is such that a component holding head that holds electronic components in a component holding section is held rotatably around the center line of the component holding section by a head holder. , and in an electronic component mounting device that changes the posture of the electronic component held by the component holding head by being rotated by a head rotation device and then mounts the electronic component on a component support such as a printed circuit board, the head holder is rotated by the component holding head. The head shall be moved from the component receiving position to the component mounting position by giving a motion including a component in a direction perpendicular to the center line of the component holding part, and the head holder shall be rotated integrally with the component holding head or it. A brake device that frictionally engages with the member to prevent rotation of the component holding head is provided, and the component holding head is provided with a driven rotary body having a circular cross section centered on the center line of the component holding portion. A drive rotor with a circular cross section that frictionally engages with the driven rotor and the drive rotor relative to the driven rotor near a stop position on the movement path from the component receiving position to the component mounting position. A head rotation device including a contact/separation device for contacting and separating the parts and a rotary drive device for rotationally driving a drive rotating body, and a brake release device for releasing a brake device while the head rotation device rotates the component holding head. It is something that

In the preferred embodiments of the first and second inventions, the driven rotating body has a cylindrical inner peripheral friction surface, and the driving rotating body expands radially outward to form an inner circumferential friction surface. It includes an expansion part that frictionally engages with the friction surface, and the contact/separation device moves the driving rotating body in the axial direction to fit inside the inner circumferential friction surface and expands the expansion part. It is said that

In a further preferred embodiment, the drive rotor has a hollow shaft shape, and a ring-shaped member made of an elastic material such as rubber is fitted on the outside of a portion of the drive rotor that fits inside the inner circumferential friction surface. A plurality of radial through holes are formed at equal angular intervals in the part where the shaped member is fitted, and a ball is movably accommodated in each of these through holes, and is also slidable in the axial direction within the driving rotor. An inclined surface formed at an angle of 1 in the axial direction on the expansion member fitted to the can act on each hole, and as the expansion member moves relative to the driving rotor in the axial direction, the expansion member The expanded portion consisting of the ring-shaped member is expanded to frictionally engage with the inner circumferential friction surface.

Furthermore, in a more desirable embodiment, an elastic member is provided "between the expansion member and the drive rotor" for urging the expansion member to a non-acting position where the inclined surface does not act on the ball. , and the contact/separation device acts on the drive rotating body through the expansion member and the elastic member to cause the expansion part to fit inside the inner circumferential friction surface,
After the axial movement of the drive rotary body is blocked at the inserted position, the expansion portion is expanded by moving the expansion portion relative to the rotary drive body against the biasing force of the elastic member. It is said that

Functions and Effects In the electronic component mounting device according to the first invention, the head rotating device for rotating the component holding belly button F is provided at a fixed position, and since it is not supported by the head holder, it moves together with the head holder. Since the head holder has a small mass and the vibrations and noise generated when the head holder starts and stops moving are reduced, the head holder can be moved at high speed and the efficiency of component mounting work can be improved.

In addition, both the driving rotating body on the head rotation device side and the driven single rotating body on the component holding head side have circular cross sections.
Moreover, since they are supposed to engage with each other by friction,
It is possible to engage and disengage at any relative phase. Therefore, the head rotating device only needs to rotate the component holding head by the angle necessary to change the posture of the electronic component, and as in the head rotating device described in the above publication, one component mounting operation is required. There is no need to return the component holding head to the reference phase position every time.

Further, in the electronic component mounting device according to the second invention, the same effects as in the electronic component mounting device according to the first invention can be obtained, and the component holding head is usually prevented from rotating by a brake device, and the head When being rotated by the rotating device, the brake device is released by the brake release device, so there is no fear that the component holding head will rotate freely due to vibrations, shocks, etc. caused by the movement of the head holding body. Since it rotates easily when it needs to rotate, it has the effect of further improving the accuracy of changing the posture of electronic components.

Furthermore, in a desirable embodiment in which the driving rotary body is frictionally engaged with the inner circumferential friction surface of the driven rotary body in the extended portion, the frictional engagement force between the driving rotary body and the driven rotary body is Because the internal force of the system consisting of the driving rotary body does not act on other members that support them, even if the driving rotary body and the driven rotary body are frictionally engaged with a sufficiently large force, the component holding head and There is no risk of relative movement occurring between the head rotation device and the head rotation device. Therefore, the rigidity of the apparatus can be reduced, and costs can be reduced, and the mass that moves together with the head holder is reduced, making it possible to move the head holder at high speed.

In addition, in a preferred embodiment in which the expansion part is composed of a ball and a ring-shaped member, the structure is simple and has a unique effect that can reduce costs. In a further improved embodiment in which the member is provided, the contact/separation device fits the extended portion of the driving rotary body inside the inner circumferential friction surface of the driven rotary body by simply moving the expanded portion) 1 in the axial direction, and The expansion part can be expanded, the structure is simple, and further cost reduction effects can be obtained.

EXAMPLE Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 shows an external appearance of an electronic component mounting system including an electronic component mounting apparatus according to an embodiment of the present invention.

This electronic component mounting system includes a main body frame 101, a component supply device 12. 1ul board, 1 person device14. Board IM output device 1
6. Board positioning device 18 and electronic component mounting device 20
(hereinafter simply referred to as a mounting device). The component supply device 12 includes a plurality of component supply units 32 arranged adjacent to each other in the moving direction of the movable base 30 on a movable base 30 supported movably along a straight line by the main body frame 10. Each component supply unit 32 holds one type of taped electronic component, and is moved to a position directly facing the mounting device 20 by movement of the moving table 30, and supplies each electronic component one by one. Since this is well known, a detailed explanation will be omitted.

A printed circuit board to which electronic components are attached is loaded by a board 1 general loading device 14, and is taken to a board positioning device 18 by a loading device (not shown). The substrate positioning device 18 includes a substrate support stand 36, and the substrate support stand 36 is installed on an XY table that is movable in the X-axis direction parallel to the movement direction of the moving table 30 and in the Y-axis direction perpendicular thereto. The printed circuit board is supported at an accurate position and positioned at an arbitrary position on the XY plane. and,
The mounting device 20 sequentially mounts the electronic components received from the component supply device 12 onto the positioned printed circuit board, and the printed board on which all the components have been mounted is removed by an unloading device (not shown), and the board unloading device 16
It will be carried out by These operations are controlled by the control device 22.

The control device 22 is mainly a computer,
Each device is controlled based on programs stored in the memory of the computer and information provided from the outside via magnetic disks, VA tapes, etc. Attached to this control device 22 are an operation panel 40, The control panel 4
A display 42 for displaying operation instructions for the 0, input data, operating status of each device, etc., and a monitor for an operator to monitor the posture of an electronic component held by a suction head (described later) that is a component holding head. A television 44 is provided. These board loading devices 14. Substrate) Squeezing device 16. Substrate positioning device 18. Control device 22° operation panel 40. Display 42. Since the monitor television 44 and the like are well known, a detailed description thereof will be omitted, and the mounting device 20 will be described below.

As is clear from FIG. 2, the mounting device 20 includes a rotating shaft 50 rotatably held by the main body frame 10 about a vertical axis. A rotating plate 52 is fixed to one end of the rotating shaft 50, and twelve cam followers 54 are attached to the outer circumference of the rotating plate 52 at equal angular intervals, and these cam followers 54 rotate around the horizontal axis. It is adapted to engage with a rotating cam 56. As a result, the rotary plate 52 and the rotary shaft 50 are intermittently rotated by 30 degrees each time the cam 56 rotates once.

An intermittent rotating disk 58 is fixed to the upper end of the rotating shaft 50.
Twelve sets of suction head units 60 are mounted on this intermittent rotary disk 58 at equal angular intervals. All of these adsorbate 60 are shown in Figures 3 and 4.
It has the structure shown in the figure. As is clear from FIG. 3, two pairs of ports 7F62 are provided on the outer periphery of the intermittent rotary disk 58 in a vertical position and movable in the axial direction, and both ends of the ports 7F62 are vertically movable. are connected to each other by connecting members 63 and 64. Upper connecting member 63
A cam follower 65 is attached to the cam follower 65, and the cam follower 65 is engaged with a cam 66 shown in FIG. Since the cam 66 is fixed to the main body frame 10 and has an annular cam groove 67 formed on its outer peripheral surface at an angle with respect to the horizontal plane, the rod 62 is raised and lowered as the intermittent rotary disk 58 rotates. Further, an arm 69 is fixed to the lower connecting member 64 by a shaft member 68, and a suction head 70 as a component holding head is attached to this arm 69. The arm 69 is designed to function as a head holder.

As shown most clearly in FIG. 4, each suction head 70 has a head main body portion 86 made of a metal cylindrical member 80 and transparent plates 82 and 84 made of glass or synthetic resin fixed to both ends thereof. We are prepared. A substantially airtight space is formed inside the head main body section 86, and a transparent plate 8 below is formed.
4 is formed with a vertical through hole communicating with this space,
A suction tube 88 functioning as a component holding portion of the suction head 70 is press-fitted into this through hole. The head main body part 86 is fitted into the outer cylinder 90 so as to be non-rotatable and slidable in the axial direction, and is normally held against the stopper 9 by a spring 92.
4 is held at the lower end position where it abuts. The outer cylinder 90 is rotatably and axially slidably fitted into a through hole formed in the arm 69 in the vertical direction, and is normally held at the upper end position where the flange 98 abuts the arm 69 by a spring 96. Further, at the upper end of the outer cylinder 90, a driven rotating body 102 is provided with a cylindrical inner peripheral friction surface 100 centered on the center line of the suction head 70, that is, the center line of the suction tube 88. are fixed by screwing, and the driven rotating body 102 and the spring 96 are covered by a cover 104.

The suction head 7 is attached to the arm 69 as the head holder.
0. Specifically, a brake device 110 is provided to prevent rotation of the outer cylinder 90 and the head main body portion 86. The brake device 110 includes a friction member 112, a lever 114. It is equipped with a spring 115 and the like. Lever 114 is arm 69
A friction member 112 is fixed to one end, and a spring 115 is installed between the other end and the arm 69. The friction member 112 is fitted into a through hole formed in the arm 69, and its tip is pressed against the outer peripheral surface of the outer cylinder 90 by the biasing force of the spring 115 to prevent the suction head 70 from rotating.

The suction tube 88 is connected to a space formed in the head main body 86 , a connection passage 117 formed in the cylinder member 80 , a connection passage 118 formed in the outer cylinder 90 . The passages 119 and 120 formed in the arm 69 and the shaft member 68 are communicated with the passages 122 and 124 formed in the intermittent rotating disk 58 and the rotating shaft 50, and the joint 1
It is connected to a vacuum device (not shown) in the boat 128 via 26. A switching valve 130 is provided at the connection between the passages 120 and 122, and when switched by a valve operating device (not shown), the adsorption pipe 88 can be selectively communicated with the vacuum device and the atmosphere. .

Each suction head 70 is stopped at 12 positions A to L shown in FIG. 5 as the intermittent rotary disk 58 rotates intermittently. Then, at position A, an electronic component is received from the component supply device 12, and at position G, it is mounted on a printed circuit board. Position A is the parts receiving position, and position G is the parts mounting position. Further, at positions C and E, an attitude detection device 140 and a head rotation device 14 are provided, respectively.
2 are provided, position C is an attitude detection position, and position E is an attitude change position. Further, in the position, if the electronic component detected at position C is different from the expected one, the switching valve 130 is switched so that the erroneous electronic component is released from the suction head 70. Since the posture detection device 140 detects the outline of the electronic component, it is possible to detect not only the posture of the electronic component but also the type of the electronic component.

As is clear from FIG. 6, the attitude detection device 140 includes a projector 146 assembled to an auxiliary frame 144 fixed to the main body frame 10. A prism device 148 and an imaging device 150 are provided. The floodlight 146 is attached to the bracket 15
2 to the auxiliary frame 144, and is positioned directly above the suction head 70 stopped at the attitude detection position C. After the light projected from the light projector 146 passes through the suction head 70, the direction is changed by 90 degrees by two prisms 154 of the prism device W148, and enters the imaging device 150. The imaging device 150 includes a lens 156, which converts a projected image of the electronic component W onto a solid-state imaging device (not shown) into a binary signal.

The imaging device 150 is attached to the auxiliary frame 144 by a bracket 160.
The focal length can be adjusted by adjusting the height with an adjustment screw 162. Note that 164 is a power unit of the imaging device 150.

As shown in FIG. 7, the head rotating device 142 includes a drive rotating body 174 that is rotatably and axially slidably held by a guide bush 172 fixed to an auxiliary frame 170. The driving rotary body 174 includes a gear 176, which is connected to a servo motor 182 shown in FIG. 8 via a gear 178 and a timing bell 180. Therefore, the drive rotating body 174 can be rotated by an arbitrary angle by the servo motor 182.

As shown in FIG. 9, the drive rotor 174 is a hollow shaft-shaped member, and a wide annular groove 184 is formed on the outer peripheral surface of its lower end, into which a rubber friction ring 186 is fitted. It is being Further, a plurality of through holes are formed in the bottom wall of the annular groove 184 and extend through the bottom wall in the radial direction, and one ball 188 is movably accommodated in each through hole. A rod-shaped expansion member 192 having a plurality of inclined grooves 190 at its lower end is slidably inserted into the drive rotor 174, and a pin 194 fixed to the expansion member 192 and a pin 194 formed on the drive rotor 174 are inserted into the drive rotor 174. The engagement with the elongated hole 196 prevents the expansion member 192 from rotating relative to the drive rotary body 174, and also defines the limit of the relative movement of the two in the axial direction.

A stopper ring 200 is fixed to the upper end of the drive rotor 174, and the stopper ring 200 comes into contact with the upper end surface of the guide bush 172 to define the lower end position of the drive rotor 174. Further, a NAND 202 is fixed near the upper end of the expansion member 192, and this NAND 202
A spring 203 serving as an elastic member is installed between the upper end surface of the drive rotor 174 and the expansion member 192 upwardly with respect to the drive rotor 174 . A tapered portion 204 is formed at the upper end of the expanding member 192, and an elevating member 206 is engaged with the tapered portion 204 via a bearing 208. An engaging member 210 is also attached to the elevating member 206 and engages with the NAND 202 to raise and lower the expanding member 192 together with the elevating member 206.

As is clear from FIG. 7, the elevating member 206 is held movably by the auxiliary frame 170 via two rods 212 and a guide block 214, and is connected to a cam device (not shown) for elevating and lowering by the connecting rod 216. is connected to.

In addition, the elevating member 206. Rod 212. The guide block 214 and the connecting rod 216 are shown rotated by a certain angle about the axis of the drive rotor 174 in FIG. 8 for ease of understanding.

The head rotation device 142 is provided at a position where the drive rotor 174 is concentric with the suction head 70 when the suction head 70 is stopped at position E, and when the elevating member 206 is lowered, the elevating member 206 and the drive The rotor 174 is lowered together with the drive rotor 174, and the lower end of the drive rotor 174, that is, the part where the friction ring 186 is attached, is the suction head 70.
into the driven rotating body 102 shown in FIG. Then, the stopper ring 200 is attached to the guide bush 1.
After the drive rotor 174 stops descending upon contact with the upper end surface of the drive rotor 172, the expansion member 19
2 relatively descends against the biasing force of the spring 203, and the action of the inclined groove 190 pushes the ball 188 outward in the radial direction, causing the friction ring 186 to partially bulge out, causing the inside of the driven rotating body 102 to be pushed out. It is brought into frictional engagement with the circumferential friction surface 100.

That is, the bottom surface of the inclined groove 190 functions as an inclined surface formed on the expansion member 192 to be inclined with respect to the axial direction thereof, and the friction ring 186 functions as a ring-shaped member that is expanded via the ball 188 by the inclined surface. The ball 188 and friction ring 186 constitute an extension of the drive rotor. Further, the driving rotary body 17 is controlled by the lifting member 206 acting on the expansion member 192 and the cam device for driving the lifting member 206 to drive the lifting member 206.
4 into the inside of the driven rotating body 102, and
A contact/separation device is configured that expands its extended portion to bring the driving rotary body 174 and the driven rotary body 102 into frictional engagement.

As is clear from FIG. 7, a release lever 220 of a brake release device 218 for releasing the brake device 110 is provided in the auxiliary frame 170. Release lever 2
One arm of 20 is connected to the cam arrangement by a connecting rod 222, and the other arm has an active member 224.
is installed. The connecting rod 222 is raised and lowered by a cam device in relation to the connecting rod 216, whereby the driving rotor 174 is lowered and the friction ring 186 is moved against the inner circumferential friction surface of the driven rotor 102. After being pressed, the action part +A224 acts on the lever 114 to release the brake device 110, and after the suction head 70 is rotated by a predetermined angle, the drive rotor 174 is released from the driven rotor 102. Prior to disengagement, the brake device 110 is returned to its operating state.

Next, the operation of the entire electronic component mounting system will be explained. While the suction head 70 that has stopped at position A (component receiving position) in FIG.
0, the rotational attitude of the electronic component W around the axis of the suction heel l'70 is detected, and at position E (attitude change position), the suction head 70 is rotated by the head rotation device 142.
is rotated, the rotational posture of the electronic component W around the axis of the suction head is changed, and furthermore, the electronic component W is mounted on the printed circuit board at position G (mounting position).

Although the operations at each of these positions are performed in parallel on different suction heads 70, the operations at each position will be described in detail below, focusing on one suction head F70.

When the suction head 70 is stopped at the position, a selected one of the many component supply units 32 of the component supply device 12 is positioned directly below the suction head 70, and is held by the component supply unit 32. The cover tape is peeled off from the component holding tape, and the electronic component W can now be taken out. Therefore, in FIG. 4, the head pressing device (not shown)
When the head main body part 86 and the suction tube 88 are moved downwards against the biasing force of the spring 96, the lower end surface of the suction tube 88 comes into contact with the upper surface of the electronic component W. Although the driven rotating body 102 and the outer cylinder 90 are pushed down thereafter, the head main body part 86 and the suction tube 88 are allowed to remain stopped by the compression of the spring 92. In this state, the suction tube 88 is communicated with the vacuum device, so the electronic component W is suctioned by the suction tube 88, and when the action of the head pressing device is released and the suction head 70 rises, the electronic component W also goes up. The component supply device 1 by the mounting device 20
The receipt of the electronic component W from 2 is completed.

When the suction head 70 that has received and picked up the electronic component W in this way is stopped at position C, the suction head 70 is positioned between the light projector 146 and the prism device 148 as shown in FIG. Therefore, a projected image of the electronic component W is formed on the solid-state imaging device surface of the imaging device 150 by the light projected from the light projector 146. The imaging device 150 converts this projected image into a binary signal and outputs it to the control device 22. The control device 22 compares the binary signal with a binary signal indicating the position of the regular electronic component W, which is stored in advance in the memory of the control device 22 itself, and determines the attitude of the electronic component W with respect to the regular position. Calculate the error Δθ.

After the attitude is detected as described above, if the suction head 70 stops at position E, the suction head 70 will be located directly below the drive rotating body 174 of the head rotation device 142 as shown in FIG. becomes.

Therefore, when the elevating member 206 is lowered by the cam device, the lower end of the driving rotor 174 fits into the driven rotor 102 shown in FIG. 4.

If the elevating member 206 is further lowered from this state,
In FIG. 9, the expansion portion 192 is lowered relative to the driving rotor 174, expanding the expansion portion consisting of the hole 188 and the friction ring 186, and applying it to the inner periphery of the driven rotor 102. Press it against the surface 100. Subsequently, the brake release device 218 is activated to release the brake device 110, so the suction head 70 becomes rotatable.
In this state, the servo motor 182 is operated to rotate the suction head 70. The servo motor 182 uses the attitude error Δθ determined by the control device 22 as described above.
Accordingly, the suction head 70 and the electronic component W held therein are rotated by an angle necessary to cancel out the attitude error.

Thereafter, the brake device 110 is activated again, the elevating part H206 is raised, the driving rotary body 174 is separated from the driven rotary body 102, and the attitude change of the electronic component W is completed.

After the posture error is removed as described above, the suction head 7
0 stops at position G, the printed circuit board is positioned at a predetermined position by the printed circuit board positioning device 18. Therefore, when the suction head 7° is pressed down by a head pressing device (not shown), the electronic component W held by the suction tube 88 is pressed against a predetermined position on the printed circuit board and fixed by adhesive or the like. In this state, the switching valve 130 is switched and the suction tube 88 is communicated with the atmosphere, thereby releasing the electronic component W from the suction head 70. Thereafter, when the suction head 70 is raised, the electronic component W is mounted on the printed circuit board. Complete.

As is clear from the above description, in this electronic component mounting system, the suction head 7o receives the electronic component W, detects its posture, changes its posture, and mounts it on the printed circuit board in parallel at multiple positions. Cycle time is shortened and efficiency of electronic component mounting work is improved.

Additionally, a posture detection device 140 and a head rotation device 142
Since only one suction head is required for each of the 12 suction heads 70, the structure of the device is simplified and the manufacturing cost can be reduced.

In addition, since the head/seven drive rotation device 142 is separated from the intermittent rotary disk 58 and provided at a fixed position, the moment of inertia of the intermittent rotary disk 58 is reduced, and the vibration and noise accompanying its intermittent rotation are reduced. However, it becomes possible to rotate the intermittent rotary disk 58 at high speed.

Furthermore, since the image formed on the solid-state image sensor surface of the imaging device 150 is a projected image of the electronic component W, it may be affected by the surface roughness, color, etc. of the electronic component W, like an image of the electronic component W caused by reflected light. Therefore, the attitude of the electronic component W can be detected accurately.

In the embodiment described in detail below, the component holding head is a suction head 70 that sucks electronic components using a vacuum.
Since the suction tube periphery of the head main body 86 is formed of a transparent material, it has the advantage of being able to obtain a projected image over the entire circumference of the electronic component W, but the component holding head is limited to this. Instead of a holding head that can hold the electronic component W in a state where the posture of the electronic component W can be detected, any holding head can be used. For example, it is possible to hold the electronic component W in a component holding head equipped with a pair of gripping claws together with or in place of the suction tube 88. In other words, it is possible to hold the electronic component W in a component holding head equipped with a pair of gripping claws. Any component holding head that can hold the electronic component in a state where a projected image of the part necessary for detecting the position of the electronic component, such as two sides, can be obtained can be used. In this case, if the members that support and operate the gripping claws get in the way of obtaining a projected image of the electronic component, the direction of light emitted from the projector may be tilted at a certain angle with respect to the center line of the electronic component. is also possible.

In addition, in the above embodiment, in order to facilitate understanding, only the posture error of the electronic component is corrected at the posture change position. If it is necessary to mount the electronic component on the printed circuit board at this position, it is also possible to rotate the electronic component by the necessary angle at this position. It becomes possible to mount electronic components in any position without having to move them.

Further, in the above embodiment, only the error in the rotational posture of the electronic component was detected at the posture detection position, but the center line of the electronic component W and the reference line of the component holding head (
For example, it also detects the deviation from the center line of the suction head 7o,
If the substrate positioning device 18 is operated based on this,
It is possible to improve not only the mounting posture of the electronic component but also the accuracy of the absolute mounting position.

In addition, in the above embodiment, the attitude detection position and the attitude change position are separate from the component receiving position and the mounting position, but these positions can be changed as appropriate, for example by aligning the attitude change position with the component mounting position. It is also possible to change.

Further, in the above embodiment, the expansion portion of the driving rotor 174 is expanded mechanically, but it is possible to make appropriate changes, such as expanding by fluid pressure, for example. Furthermore, it is not essential to engage the drive rotor 174 and the driven rotor 102 by pressing the extended portion of the drive rotor 174 against the inner circumferential friction surface 100 of the driven rotor 102. For example, it is also possible that the driving rotary body 174 is fitted on the outside of the driven rotary body 102, and the contracted portion of the driving rotary body frictionally engages with the outer peripheral friction surface of the driven rotary body. Furthermore, it is also possible to frictionally engage the drive rotor and the driven rotor by concentrically abutting the end faces of the drive rotor and the driven rotor, or by connecting the drive rotor and the driven rotor in the radial direction. It is also possible to cause local frictional engagement between the outer peripheral surfaces of the two or between the outer peripheral surface of one and the inner peripheral surface of the other by relative movement. In this case, it goes without saying that the contact/separation device also needs to be changed according to each aspect.

Further, in the embodiment described above, a large number of suction heads 70 as component holding heads are attached to one intermittent rotary disk 58, and as the suction head 70 rotates, the suction heads 70 are moved from the component receiving position to the component mounting position. However, it is also possible that one component holding head is held by a moving body 1 (11i1) and moved along an arbitrary movement path such as a circumference or a straight line.

In addition, although no specific examples will be given, it goes without saying that the present invention can be implemented with various modifications and improvements based on the knowledge of those skilled in the art.

[Brief explanation of drawings]

FIG. 1 is a perspective view schematically showing an entire electronic component mounting system including an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a front sectional view showing the main parts of the electronic component mounting device of the electronic component mounting system shown in FIG. FIG. 3 is a sectional view taken along the line ■-■ in FIG. 2. FIG. 4 is a front sectional view showing the suction head shown in FIG. 2 and its surroundings. FIG. 5 is an explanatory diagram showing the relative positional relationship between the main part of the electronic component mounting apparatus shown in FIG. 2, the attached attitude detection device, and the head rotation device, and is an explanatory diagram showing the relative positional relationship between the main part of the electronic component mounting apparatus shown in FIG. It is a V sectional view. 6 is a front view of the attitude detection device shown in FIG. 5. FIG. 7 is a front view of the brake release device and the head rotating device shown in FIG. 5. FIG. FIG. 8 is a bottom view of the brake release device and head rotation device shown in FIG. 7. FIG. 9 is a sectional view taken along line IX-IX in FIG. 7. FIG. 10 is a plan view showing an example of a conventional electronic component mounting apparatus. 20: Electronic component mounting device 58: Intermittent rotary disk 60: Suction head unit 69: Arm (head holder) 70: Suction head 80; Cylindrical member 82. 84: Transparent plate 86: Head main body 88: Suction tube 90: Outside Cylinder 100: Inner peripheral friction surface 102; Driven rotating body 110 Nibrake device 140: Attitude detection device 142: Head rotation device 146; Floodlight 148 Nibrism device 15
0: Imaging device 174: Drive rotating body 192; Extension shrine

Claims (5)

[Claims] (1) A component holding head that holds an electronic component in a component holder is rotatably held around the center line of the component holder by a head holder, and is rotated by a head rotation device, so that the component In an electronic component mounting device that mounts an electronic component held by a holding head on a component supporter such as a printed circuit board after changing its posture, the head holder is attached to the component holding head in a direction perpendicular to the center line of the component holder. The component holding head is provided with a driven rotary body having a circular cross section centered on the center line of the component holding portion, and
A driving rotary body with a circular cross section that frictionally engages with the driven rotary body and the driving rotary body are placed close to a stop position in the moving path of the component holding head from the component receiving position to the component mounting position. An electronic device capable of changing the posture of an electronic component, characterized in that a head rotation device is provided, which includes a contact/separation device that brings the driven rotating body into contact with and separates it from the driven rotating body, and a rotational drive device that rotationally drives the drive rotating body. Parts mounting device. (2) The driven rotating body has a cylindrical inner circumferential friction surface, and the driving rotating body includes an expanded portion that extends radially outward and frictionally engages with the inner circumferential friction surface. In addition, the approaching/separating device moves the driving rotating body in the axial direction to fit inside the inner circumferential friction surface thereof, and expands the expanding portion.
Electronic component mounting device described in Section 1. (3) the drive rotating body has a hollow shaft shape, and
A ring-shaped member made of an elastic material is fitted to the outside of the portion of the drive rotor that fits inside the inner circumferential friction surface, and a plurality of radial through holes are formed in the portion where the ring-shaped member is fitted. A ball is movably accommodated in each of the through holes formed at equal angular intervals, and is formed at an angle with respect to the axial direction in an expansion member fitted in the drive rotor so as to be movable in the axial direction. The inclined surface can act on each of the balls, and as the expansion member moves relative to the driving rotary body in the axial direction, the inclined surface expands the ring-shaped member through the balls and expands the inner periphery. 3. The electronic component mounting device according to claim 2, wherein the expanded portion is configured by the ball and the ring-shaped member so as to be frictionally engaged with a friction surface. (4) An elastic member is provided between the expansion member and the drive rotating body, and the elastic member biases the expansion member to a non-acting position where the inclined surface does not act on the ball, and the contact/separation device is configured to The expanded portion is fitted inside the inner circumferential friction surface by acting on the driving rotating body through the expanding member and the elastic member, and axial movement of the driving rotating body is prevented at the fitted position. After that, the expansion member is moved relative to the rotational drive body against the biasing force of the elastic member to expand the expansion portion. Device. (5) The component holding head that holds the electronic component in the component holding section is held rotatably around the center line of the component holding section by the head holder, and is rotated by the head rotation device, so that the component In an electronic component mounting device that mounts an electronic component held by a holding head on a component supporter such as a printed circuit board after changing its posture, the head holder is attached to the component holding head in a direction perpendicular to the center line of the component holder. In addition, the head holder is frictionally engaged with the component holding head or a member that rotates integrally with it to move the component holding head from the component receiving position to the component mounting position. A brake device for preventing rotation is provided on the component holding head, and a driven rotary body having a circular cross section centered on the center line of the component holding portion is provided on the component holding head. A driving rotary body having a circular cross section that frictionally engages with the driven rotary body in the vicinity of a stop position on the movement route to the position, and an contact that brings the driving rotary body into contact with and separating from the driven rotary body. A head rotation device including a separating device and a rotation drive device for rotationally driving the driving rotary body, and a brake release device for releasing the brake device while the head rotation device rotates the component holding head. An electronic component mounting device that is capable of changing the posture of electronic components.