JPS6116431B2 - - Google Patents
Info
- Publication number
- JPS6116431B2 JPS6116431B2 JP19942682A JP19942682A JPS6116431B2 JP S6116431 B2 JPS6116431 B2 JP S6116431B2 JP 19942682 A JP19942682 A JP 19942682A JP 19942682 A JP19942682 A JP 19942682A JP S6116431 B2 JPS6116431 B2 JP S6116431B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- hole
- substrate
- liquid
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 81
- 239000007788 liquid Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 37
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920001875 Ebonite Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19942682A JPS5989783A (ja) | 1982-11-13 | 1982-11-13 | 電気メツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19942682A JPS5989783A (ja) | 1982-11-13 | 1982-11-13 | 電気メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5989783A JPS5989783A (ja) | 1984-05-24 |
| JPS6116431B2 true JPS6116431B2 (enrdf_load_stackoverflow) | 1986-04-30 |
Family
ID=16407609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19942682A Granted JPS5989783A (ja) | 1982-11-13 | 1982-11-13 | 電気メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5989783A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002079548A1 (fr) * | 2001-03-28 | 2002-10-10 | Fujitsu Limited | Cuve de galvanoplastie |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63248197A (ja) * | 1987-04-03 | 1988-10-14 | 株式会社 山田メツキ工業所 | スル−ホ−ルプリント回路基板の製造方法 |
| CN103403228A (zh) * | 2011-03-02 | 2013-11-20 | 名幸电子有限公司 | 贯通孔镀敷方法以及利用该贯通孔镀敷方法制造的基板 |
-
1982
- 1982-11-13 JP JP19942682A patent/JPS5989783A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002079548A1 (fr) * | 2001-03-28 | 2002-10-10 | Fujitsu Limited | Cuve de galvanoplastie |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5989783A (ja) | 1984-05-24 |
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