JPS61162101U - - Google Patents
Info
- Publication number
- JPS61162101U JPS61162101U JP4380085U JP4380085U JPS61162101U JP S61162101 U JPS61162101 U JP S61162101U JP 4380085 U JP4380085 U JP 4380085U JP 4380085 U JP4380085 U JP 4380085U JP S61162101 U JPS61162101 U JP S61162101U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- microwave integrated
- ohm
- conductor wire
- insulating tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4380085U JPH048642Y2 (ru) | 1985-03-28 | 1985-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4380085U JPH048642Y2 (ru) | 1985-03-28 | 1985-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61162101U true JPS61162101U (ru) | 1986-10-07 |
| JPH048642Y2 JPH048642Y2 (ru) | 1992-03-04 |
Family
ID=30555798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4380085U Expired JPH048642Y2 (ru) | 1985-03-28 | 1985-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048642Y2 (ru) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011111605A1 (ja) * | 2010-03-09 | 2011-09-15 | 日立化成工業株式会社 | 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法 |
-
1985
- 1985-03-28 JP JP4380085U patent/JPH048642Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011111605A1 (ja) * | 2010-03-09 | 2011-09-15 | 日立化成工業株式会社 | 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法 |
| JP2011211170A (ja) * | 2010-03-09 | 2011-10-20 | Hitachi Chem Co Ltd | 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH048642Y2 (ru) | 1992-03-04 |