JPS61160243A - Bonded body of metallic plate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an adhesive body of metal plates, and particularly to cards used in banks, financial circles, and other organizations as cashier cards, credit cards, and identification cards. It is related to the bonding of metal plates, which can be applied to the manufacture of thin calculators, keyboard panels for computer input, etc.

(Prior Art) It is generally more difficult to firmly adhere metal plates than to adhere paper or synthetic resin. In particular, cards, thin calculators, keyboard keys, etc. are difficult to adhere to because they are made of rust-resistant and inert surfaces such as stainless steel.

Conventionally, as an example of a method for adhering metal plates, a primer resin that can improve the adhesive strength of both the metal plate and the adhesive layer is applied to the entire surface of the metal plate by spray coating, roll coating, etc., and then Bonding was done using adhesive.

(Problems to be Solved by the Invention) With this type of primer treatment, if there is an unnecessary part of the primer coat layer, it is necessary to scrape it off after coating the entire surface, otherwise it will be removed during primer coating. It is necessary to mask and apply it locally. The disadvantage of this type of brimer treatment is that it increases the number of steps.

There are also disadvantages in that the useful life of the primer coat layer is limited, the storage period of the metal plate after coating with the primer resin is limited, and the adhesive strength varies depending on the storage period and is difficult to maintain constant.

Moreover, there is one card and a slim calculator to which the present invention is applied.

Keyboards and the like contain electrical parts such as integrated circuits, switches, and wiring, so there are areas where these parts are housed, and the adhesive must be applied in areas that avoid these areas. , the above-mentioned brimer treatment is not suitable.

Moreover, cards, thin calculators, keyboards, etc. are used for many years, so when bonding metal plates,
Accidents such as peeling are a serious problem.

(Object of the Invention) Based on the above-mentioned points, the present invention is an adhesive body of metal plates that has high adhesive strength and excellent durability, is simple in terms of process, and can be used for metal plates such as cards and keyboards. The present invention provides an adhesive body useful for manufacturing products.

(Means for Solving the Problems) That is, the present invention provides a bonded body of a metal plate in which a metal plate is bonded to another material via a pressure-sensitive or heat-sensitive pressure-sensitive adhesive layer. This is a bonded body of metal plates characterized in that a recess is not formed by mechanical or chemical means, and a part of the adhesive layer is pushed into the recess by pressure or heat and pressure during bonding.

(Function) In the present invention, before adhering metal plates, a recess is formed at an appropriate location, and an adhesive layer is pushed into the recess, thereby achieving strong adhesion.

(Embodiments of the Invention) The present invention will be described in detail below, taking as an example the bonding of metal members for cards. In Figures 1 and 2 of the drawings, a metal plate (1) is provided with a half-etched pattern (4) and a through hole (5), and an adhesive layer (2) allows it to be bonded to another material 1, such as a metal plate or synthetic resin. It is attached to a board etc. In the illustrated embodiment, the other material (3) is the metal plate (1
) is a flat plate without half-etching or through-holes, but it is not limited to separate metal plates (
Processing similar to 1) may be applied.

Figure 2 K Glue 1m to VC1 metal plate (1) as shown.
When (2) is applied, the adhesive layer (2) is not required within the broken line in the area including the half-etched putter 7 (4) and the through hole (5). Therefore, the adhesive layer (2) is formed in advance to match this shape.

The adhesive layer (2) may be formed thickly by printing or coating, or may be formed by applying a film-like adhesive tape to a metal plate.

As shown in FIG. 1, in the periphery of the metal plate (1).

Since the recess (6) is formed by etching or cutting, a portion of the adhesive layer (2) is pushed into the recess (6) by pressure or heat and pressure during the bonding process, improving adhesive strength.

In this embodiment, the recess (6) is provided at the periphery of the card metal plate (+). The reason for this is that various parts are built in or attached to the center of the card, so it is important to avoid that area, and when considering peeling of the adhesive, peeling will occur from the periphery. In most cases, this happens, and in order to prevent this, it is practical to provide a recess (6) in the periphery to strengthen the adhesion.

As another example, as shown in Fig. 3, metal plate f7) (7)
A case will be described in which `` are glued vertically through another window frame-shaped material (8).

In FIGS. 6 and 4, the metal plate (force') is provided with a half-etched pattern (9).

It adheres to other materials from above and below through film-like adhesive layers (10) (10)'. metal plate ('t)
A film-like adhesive layer (I rl) is formed in the concave part (11) (old)' of +7)' by pressure or heat pressure during the bonding process.
(10) The fact that a portion of ' is pushed in and the adhesive strength is improved is the same as in the previous example.

As is already clear, the adhesive body of the present invention can be applied to any metal plate at least on one side.
Other materials that can be bonded together include:

Metal plate 1 Synthetic resin body, glass, ceramic, etc.47-). When the plate 14 to be bonded together is a metal plate, the recess may be formed in only one metal plate or both may be formed ().

(Effects) The present invention is as described above. According to the present invention, since the adhesive layer is pushed into the recessed portion, the adhesive strength is improved and accidents such as peeling can be prevented as much as possible. In addition, there is no change in adhesive strength over time, which is the case with brimer treatment, and the quality remains constant.

Furthermore, when forming a recess in a metal plate, if there is a need to provide a through hole or a recess in the metal plate, the recess can be formed at the same time, reducing the complexity of the process.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the bonded body of metal plates of the present invention, FIG. 2 is a plan view showing the metal plate used in the bonded body of FIG. 1, and FIG. FIG. 4 is a sectional view showing another embodiment of the bonded body of metal plates of the present invention, and FIG. 4 is a plan view showing the metal plate used in the bonded body of FIG. 6. (1) (force...metal plate (2) t'I O)・
...adhesive layer (3) (81...other materials

Claims (5)

[Claims] (1) In a bonded body of metal plates in which a metal plate is bonded to another material via a pressure-sensitive or heat-sensitive pressure-sensitive adhesive layer, a recess is formed by mechanical or chemical means on the bonding surface of the metal plate, and the bond is bonded. 1. A bonded body of metal plates, characterized in that a part of the adhesive layer is pushed into the recessed part by the pressure of time or heat and pressure. (2) An adhesive body of metal plates according to claim 1, wherein the metal plate and the other material adhered to the metal plate are the front and back bodies constituting the card. (3) The other material to be bonded to the metal plate is a metal plate,
The bonded body of metal plates according to claim 1, wherein the recess is formed in one of the metal plates. (4) The other material to be bonded to the metal plate is a metal plate,
The bonded body of metal plates according to claim 1, wherein recesses are formed in both metal plates. (5) The bonded body of metal plates according to claim 1, wherein the other material to be bonded to the metal plate is one selected from synthetic resin, glass, and ceramic.