JPS61157498A - Heat dissipating device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a heat dissipation device used for controlling the temperature of a heat generating element such as an electronic device mounted on an artificial satellite.

[Technical background of the invention and its problems]

Conventionally, in this type of heat dissipation device, a fixed conductance type heat pipe with good heat transport performance is attached to the equipment panel on which the heating element is mounted, and temperature control is performed via this heat pipe.

However, the heat dissipation device described above does not have thermal controllability, and is configured to constantly transfer the amount of heat from the heating element. However, it had the disadvantage that the heating element cooled too much.

Therefore, a heat dissipation device using a variable conductance heat nozzle (VCHP) or a thermal looper, which has heat controllability in the heat nozzle, has been considered.

However, the above-mentioned heat dissipation device has various problems due to the structure of its VCHP or thermal looper, such as being heavy and having poor heat insulation properties or poor mounting performance.

For this reason, recently, as shown in Figure 3, equipment channels 1
At the same time as burying heat mother f2 in , this heat a)
A thermal switch 4 for heat transport control is sandwiched between the equipment panel 1 and the heating element 3 in accordance with the 4th idea 2, and this thermal switch! Heat dissipation devices configured to perform thermal control have appeared.

However, due to the structure of the heat dissipation device, the weight of the heat generating element 3 is directly applied to the heat switch 2, so if there is a risk that the heat switch 4 may malfunction, the button or the heat generating body 3 may be pressed. There were 5 problems with implementation: □Very poor.

[Purpose of the invention]

This invention has been made in view of the above circumstances, and has a simple configuration, which can improve the mounting efficiency as much as possible, and also improves the reliability of thermal control as much as possible, and improves heat dissipation efficiency. It is an object of the present invention to provide a heat dissipation device that can be improved.

[Summary of the invention]

That is, the present invention achieves the intended purpose by embedding a thermal switch in the equipment panel on which the heating element is mounted, and by configuring the thermal switch to control the heat of the heating element according to the amount of heat generated. This has been achieved.

[Embodiments of the invention]

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 shows a heat dissipation device according to an embodiment of the present invention, and in the figure, reference numeral 10 indicates an equipment channel formed of a honeycomb panel. A heating element, such as an electronic device 11, is attached to a predetermined position of the equipment panel 10 via a pace plate 12, and a heat switch 13 and a heat arm ide 14 are embedded in the interior corresponding to the pace plate 12. .

That is, the heat switch 13 has its first end plate 15 connected to the honeycomb skin 16 on one side of the device panel 10.
is glued directly below the pace plate I2 attached to the
One end of a bellows 17, which is hermetically sealed with a working fluid (not shown) such as ammonia, is fixed to the first end plate 15. This bellows 17 has a second end plate 1 at the other end.
8 is fixed to the second end plate 18 and the first end plate 1.
5, a spring member 19 is engaged so as to apply a biasing force in the direction of arrow (B). Further, a third end plate 21 is provided on the first end plate 15 via a support rod 20 to face the second end plate 18, and this third end plate 2
1 is a honeycomb skin 22 on the other side of the equipment panel 10;
The above-mentioned Heat No. FZ4 was buried while being supported by
connected to.

Therefore, in the heat dissipation device, when the electronic device 11 is in a low temperature state where it is not operating, the working fluid (not shown) of the bellows 17 is in a low pressure state, and the second end plate 18 is attached to the spring member 19. It is separated from the third end plate 21 to which the peat plate 9 is connected by force, and the transport of its heat is stopped. Then, the electronic device 11 is operated,
When the temperature rises, the pressure of the bellows 17 increases accordingly, causing the second end plate 18 to move in the direction of arrow (A) against the biasing force of the spring member 19. , and brought into contact with the third end plate 2. Here, the electronic device 11 is thermally coupled to the heat pie f14 via the pace plate 12, the first end plate 15, the bellows 17, the second end plate 18, and the third end plate 21, and the amount of heat is is efficiently dissipated.

Then, in the thermally coupled state, when the operation of the electronic device 1 is stopped again and its temperature is lowered, the bellows e12 are moved by the arrow (arrow) by the biasing force of the spring member 19.
B), the second end plate 18 is moved away from the third end plate 2 to break the thermal coupling and stop heat transport.

〔Effect of the invention〕

As detailed above, according to the present invention, a thermal switch is embedded in a device panel on which a heating element is mounted, and the thermal switch is configured to thermally control the heating element according to the amount of heat generated. Therefore, the mounting efficiency of the heating element can be improved as much as possible,
Moreover, it is possible to provide a heat dissipation device that can improve the reliability of heat control as much as possible.

Further, in the above embodiment, the present invention has been explained in the case where the heat hose 14 is buried in the equipment channel 11, but the present invention is not limited to this, and as shown in FIG.
4 can be arranged on the other side of the device panel 10 corresponding to the electronic device 11, substantially the same effect can be expected.

Furthermore, although each of the above embodiments has been described using a heat pie fx4 as a heat transfer element, the present invention is not limited to this, and it is also possible to configure a heat transfer element such as a fluid luno.

It goes without saying that the present invention is not limited to the above embodiments, and that various modifications can be made without departing from the spirit of the invention.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a heat dissipation device according to an embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG.
The figure is a sectional view showing a conventional heat dissipation device. 10...equipment panel, 1no...electronic equipment, 12...
・Pace plate, 13... Heat switch, 14...
Heat pipe, 15...first end plate, 16.22...
・Honeycomb skin, 17... Bellows, 18... Second end plate, 19... Spring member, 20... Support rod, 2
No...Third end plate.

Claims (1)

[Claims] A device panel on which a heating element is mounted, and a thermal switch that is embedded in the device panel and is thermally coupled to a heat transfer element provided on the device panel according to the amount of heat generated by the heating element. A heat dissipation device characterized by comprising: