JPH0228961A - Thick-film hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To increase the contact area between a ferrite connected in a circuit and a heat dissipating plate or an insulating substrate and to improve the heat dissipating properties by applying a high heat-conducting resin on the contact part where the ferrite is mounted in contact with the insulating substrate or with the heat dissipating plate. CONSTITUTION:A signal transmitted through a conductor pattern 5 is conducted by a lead 2 passing through a ferrite 1 and again transmitted through the conductor pattern 5. While the signal contains various noises, a part of which is converted into heat by the ferrite 1. The ferrite 1 is in contact with a heat dissipating plate 4 formed of Cu or the like, and the contact area between the ferrite 1 and the heat dissipating plate 4 is increased by applying a paste- type high heat-conducting resin 6. According to such arrangement, heat generated by the ferrite 3 can be dissipated at high efficiency and the reliability of the device can be improved. Though the cylindrical ferrite 1 has been shown in the disclosed embodiment, similar effects can be obtained also by ferrites having other configurations. Further, the ferrite 1 may be secured in contact with an insulating substrate 3 to obtain similar effects.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a structure for bonding a thick film hybrid integrated circuit device to an insulating substrate, particularly when ferrite is used.

[Conventional technology]

FIGS. 2(a) and 2(b) are a sectional view and a perspective view showing a conventional thick film hybrid integrated circuit device using ferrite.

In FIG. 2, 1 is a ferrite, 2 is a lead of this ferrite 1, 3 is an insulating substrate, 4 is a heat sink, 5 is a conductor pattern formed on the insulating substrate 3, and 5 is a conductor pattern formed on the insulating substrate 3. Leads 2 of ferrite 1 are bonded to.

Since the ferrite 1 performs its function by converting noise contained in a signal into heat, it must have good heat dissipation. If the temperature continues to rise and exceeds a certain temperature specific to the material of ferrite 1, in the worst case, ferrite 1
It also leads to the destruction of the equipment, which poses a reliability problem.

Conventionally, the above reliability problem has been dealt with by placing the ferrite 1 on an insulating substrate 3 and causing the heat generated in the ferrite 1 to flow through the insulating substrate 3. However, the heat dissipation was not sufficient due to the small contact area with the insulating substrate 3 and the poor thermal conductivity of the insulating substrate 3.

[Problem to be solved by the invention]

As described above, when ferrite 1 is used in a thick film hybrid integrated circuit device, heat dissipation is not sufficient and reliability is a problem.

This invention was made to solve the above problems, and improves heat dissipation when using ferrite.
The objective is to obtain a highly reliable thick film hybrid integrated circuit device.

(Means for Solving the Problems) A thick film hybrid integrated circuit device according to the present invention has a high heat conductive resin applied to the contact portion where the ferrite in the circuit is placed in contact with an insulating substrate or a heat sink. It is something.

[Effect]

In this invention, heat dissipation is improved because a high heat conductive resin is applied to the portion where the ferrite is in contact with the insulating substrate or the heat sink.

〔Example〕

An embodiment of the present invention is shown in FIG. 1(a) below.

(b) will be explained.

FIGS. 1(a) and 1(b) show an embodiment of the thick film hybrid integrated circuit device of the present invention, FIG. 1(a) being a sectional view and FIG. 1(b) being a perspective view. .

In FIG. 1, 1 is a ferrite, 2 is a lead, 3 is an insulating substrate, 4 is a heat sink, and 5 is a conductor pattern printed on the insulating substrate 3, to which the lead 2 is bonded. Reference numeral 6 denotes a paste-like high heat conductive resin coated on the contact portion between the ferrite 1 and the heat sink 4.

The signal passes through the conductor pattern 5, travels through the lead 2 through the ferrite 1, and then passes through the conductor pattern 5 again. The signal contains various noises, some of which are converted into heat by the ferrite 1. The ferrite 1 is in contact with a heat sink 4 made of Cu or the like, and by applying paste-like high heat conductive resin 6 to this contact area, the contact area between the heat sink 4 and the ferrite 1 is increased. .

With the above structure, the heat generated in the ferrite 1 is efficiently dissipated, and the reliability of the device is improved.

In the above embodiment, the ferrite 1 has a cylindrical shape, but similar effects can be obtained with other shapes.

Further, in the above embodiment, the case where the ferrite 1 is brought into contact with the heat dissipation plate 4 to which the insulating substrate 3 is adhered is shown, but the above-mentioned method can also be carried out when the ferrite 1 is brought into contact with and fixed on the insulating substrate 3. It has the same effect as the example.

(Effects of the Invention) As explained above, in this invention, a high heat conductive resin is applied to the contact portion where the ferrite in the circuit is placed in contact with the insulating substrate or the heat sink, so that the ferrite and the heat sink or The contact area with the insulating substrate is increased, heat dissipation is extremely good, and a highly reliable thick film hybrid integrated circuit device is effective.

[Brief explanation of the drawing]

FIG. 1(a) is a sectional view of a ferrite mounting part of a thick film hybrid integrated circuit device according to an embodiment of the present invention, FIG. 1(b) is a perspective view of the same, and FIG. 2(a) is a conventional thick film The cross-sectional view of the hybrid integrated circuit device, FIG. 2(b), is also a perspective view. In the figure, 1 is a ferrite, 2 is a lead, 3 is an insulating substrate, 4 is a heat sink, 5 is a conductive pattern, and 6 is a paste-like high heat conductive resin. Figure 1(a)

Claims (1)

[Claims] In a thick film hybrid integrated circuit device in which a circuit using ferrite is configured on an insulating substrate provided on a heat sink, the ferrite in the circuit is placed in contact with the insulating substrate or the heat sink. A thick film hybrid integrated circuit device characterized in that the contact portion is coated with a highly thermally conductive resin.