JPS61157363U - - Google Patents
Info
- Publication number
- JPS61157363U JPS61157363U JP3992185U JP3992185U JPS61157363U JP S61157363 U JPS61157363 U JP S61157363U JP 3992185 U JP3992185 U JP 3992185U JP 3992185 U JP3992185 U JP 3992185U JP S61157363 U JPS61157363 U JP S61157363U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- circuit board
- substrate
- integrated circuit
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3992185U JPS61157363U (de) | 1985-03-22 | 1985-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3992185U JPS61157363U (de) | 1985-03-22 | 1985-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61157363U true JPS61157363U (de) | 1986-09-30 |
Family
ID=30548322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3992185U Pending JPS61157363U (de) | 1985-03-22 | 1985-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61157363U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015151433A1 (ja) * | 2014-04-01 | 2015-10-08 | パナソニックＩｐマネジメント株式会社 | 部品実装基板 |
-
1985
- 1985-03-22 JP JP3992185U patent/JPS61157363U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015151433A1 (ja) * | 2014-04-01 | 2015-10-08 | パナソニックＩｐマネジメント株式会社 | 部品実装基板 |