JPS61156900A - Lead detection system - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead detection method for detecting the insertion state of a component in an automatic insertion machine that automatically inserts components into a printed board.

Recently, factory automation (FA)
With the advancement of automation, automatic insertion of parts into a temporary print has become commonplace.

In such automatic insertion work, detection of the inserted state of the component is extremely important, and it is desired to establish an error-free detection method.

[Conventional technology]

FIG. 3 is a cross-sectional view explaining the structure of the RC lead detection jig, FIG. 4 is a cross-sectional view showing the operating state of the detection jig in FIG.
FIG. 5 is a block diagram showing the configuration of the detection device, and FIG. 6 is an I
FIG. 7 is a plan view showing the numbers of C leads, and is a flowchart of FIG. 5.

As shown in FIG. 3, the lead detection jig 1 includes a jig main body 3 having a mounting table 13 for a temporary print 12, and a lead detecting jig 1 which is provided in the jig main body 3 and is in contact with the leads 2a of the IC 2 mounted on the printed board 12. A loosely inserted detection pin 4, a coil spring 5 that causes the detection pin 4 to protrude, a lever 7 that contacts the other end of the detection pin 4 and rotates around a fulcrum 8 when the detection pin 4 is pressed down, and a lever. The sensor consists of a light emitting element 9 and a light receiving element 10 arranged so that the optical path is blocked by the rotation of the lever 7, and when the detection pin 4 is not pressed down, the lever 7 pulls the lever 7 so as not to block the sensor. It is composed of a coil spring 6 and the like.

In order to detect the inserted state of the lead 2a of the IC 2 using the lead detection jig 1 having such a configuration, as shown in FIG.
With the IC2 inserted into the printed board 12, the lead 2a
The printed circuit board 12 is placed closely on the mounting table 13 of the jig main body 3 so that it contacts the detection pin 4.

In the figure, the lead 2a on the right side of the figure is normally inserted into the printed board 12, and the lead 2a'' on the left side is bent and not inserted.

Therefore, the right-hand side board 2a in the figure protrudes from the back surface of the printed board 12, presses down the detection pin 4, and rotates the lever 7, which is in contact with the detection pin 4, about the fulcrum 8.

The lever 7 is formed in a Z-shape, and when the end is pressed down, the lever 7 rotates around a fulcrum 8 in the vicinity of the pressed part by expanding its motion.

On the other hand, in the figure, the left glue plate 2a' is bent and not inserted into the hole in the printed board 12, so the detection bin 4
is not pressed down, and therefore the optical path of the sensor consisting of the light emitting element 9 and the light receiving element 10 is not interrupted.

If even one such non-inserted part is detected, it is determined that the insertion is defective and the work is stopped. However, if it is confirmed that both leads are correctly inserted as shown in the right glue 2a. It is OK to insert it.

Such a lead detection jig 1 is provided facing each lead individually, and can detect the leads without moving them relative to the IC 2.

As shown in FIG. 5, the detection device controls an insertion machine 11 that automatically inserts an IC, and an insertion detection circuit 14 that is provided in the insertion machine 11 and uses, for example, a microswitch or the like to detect that an IC has been inserted into a printed circuit board. It is controlled by a control section 15 that operates.

The detection device is composed of a lead detection circuit 16 and a determination circuit 17.
A sensor 18 consisting of a light emitting element 9 and a light receiving element 10 shown in FIG. 4 are connected, and the lead detection jig 1 described in FIGS. 3 and 4 is configured to detect the sensor 18.

Detection of an IC lead by the detection device having such a configuration will be explained with reference to the flowchart shown in FIG.

If the lead 2a of the IC2 is, for example, 20 pins as shown in FIG. 6, the lead 2a on one side (left side in the figure)
are numbered from 1 to 10 from the top, and the other lead 2aC (on the right side in the figure) is numbered from 11 to 10 from the bottom.
20 (numbered).

As shown in FIG. 5, the insertion of the IC inserted into the printed circuit board by the insertion machine 11 driven by the instruction of the control unit 15 is detected by the insertion detection circuit 14 of the insertion machine 11, and the insertion information is is manually controlled by the control section 15.

Then, the control unit 11 drives the lead detection circuit 16 according to the input information, and the lead detection circuit 16 drives the sensor 18.
is driven to detect the lead 2a using the lead detection jig 1 described in FIGS. 3 and 4.

The detection signal of the sensor 18 is input to the lead detection circuit 16, and the next determination circuit 17 determines the insertion state of the lead.

As shown in FIG. 7, the determination is started based on the lowest opposing leads, for example, 10 and 11 of IC2 shown in FIG. 6.

Here, as explained in FIG.
If the optical path of the sensor is blocked by the lever 7 on both sides of 1, it is judged to be OK (normally inserted), and if only one is detected, it is judged as an error, and the display shown in Fig. 5 is displayed. The error is displayed in section 20.

If the leads of 10 and 11 are OK, the next lead is 9,
The opposing leads 12 are detected at the same time, and if both are OK, then leads 8 and 13 are detected, and all opposing leads are detected one after another until the detection of leads 1 and 20 is completed. .

At this time, there are several types of ICs, such as 18 pins, 16 pins, 14 pins, and 8 pins, in addition to the 20-bin one shown in Figure 6. For example, the 18-pin IC has only leads up to lead 2 and lead 19. In this case, lead 1 and the sensor 18 corresponding to the lead 20 do not detect the lead, but even in such a case, O
I decided to judge it as K.

That is, this decision was made based on the judgment that a situation where both leads are bent and do not protrude from the back surface of the printed board is extremely rare and can be ignored.

When it is determined that everything is OK, the determination circuit 17 outputs a termination signal to the control section 15.

Upon receiving the end signal, the control unit 15 issues a command to the insertion machine 11 to instruct the insertion of the next IC.

[Problem that the invention seeks to solve]

As explained above, a lead is judged to be OK if the detection results of the opposing leads match, so even if this is rare, a situation may occur where the opposing leads are bent and cannot be detected. There was a problem that it was judged as OK.

[Means for solving problems]

The above problem is solved by sequentially detecting the leads with a predetermined end of the IC as a reference to detect the total number of IC leads, and also detecting the presence or absence of each lead based on the detected number of leads. This problem is solved by the lead detection method of the present invention, which includes a determination section that determines whether or not the IC is inserted in accordance with the presence/absence detection result.

[Operation] That is, the type of IC is detected at the beginning of lead detection and the IC is
By detecting the leads according to the detection pattern, even if both of the opposing leads are bent and do not protrude to the back of the printed board and are not detected by the sensor, such a state can be easily detected. It becomes like this.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a block diagram showing the configuration of the detection device of the present invention, and FIG. 2 is a flowchart of FIG. 1.

In the figure, 15' is a control section, and 19 is a detection pattern generation circuit. Identical parts are designated by the same reference numerals throughout the figures.

As shown in FIG. 1, the detection device includes an insertion machine 11 that automatically inserts a tC, and an insertion detection circuit 14 that is installed in the insertion machine 11 and detects that an IC is inserted into a printed board using, for example, a microsinch. It is controlled by a control section 15'.

The detection device includes a lead detection circuit 16, a detection pattern generation circuit 19, and a determination circuit 17. The lead detection circuit 16 includes a light emitting element 9 shown in FIGS. 3 and 4.
A sensor 18 composed of a light receiving element 10 is connected to the sensor 18, and is configured to be detected by the lead detection jig 1 described in FIGS. 3 and 4.

Detection of an IC lead by the detection device having such a configuration will be described below with reference to the flowchart shown in FIG.

As explained in FIG. 6, the lead 2a of IC2 is, for example, 2
If it is a 0-pin one, glue it on one side (left side in the diagram).
The doors 2a are numbered from 1 to 10 from the top.
The other leads 2a (on the right side in the figure) are numbered 11 to 20 from the bottom.

As shown in FIG. 1, the IC is inserted into the printed board by the insertion machine 11 driven according to instructions from the control section 15'.
The insertion is detected by the insertion detection circuit 14 of the insertion machine 11, and the insertion information is input to the control section 15'.

Then, the control unit 11 drives the lead detection circuit 16 according to the input information, and the lead detection circuit 16 drives the sensor 18.
is driven to detect the lead 2a using the lead detection jig 1 described in FIGS. 3 and 4.

The detection signal of the sensor 18 is input to the lead detection circuit 16, and the number of leads specific to the detection IC is detected.

When the lead detection circuit 16 detects the number of leads specific to the detection rc, it issues a command to the next detection pattern generation circuit 19 to generate a detection pattern corresponding to the IC.

Then, detection is performed according to the detection pattern, and the next determination circuit 17 determines the insertion state of the lead.

The judgment is as shown in Fig. 2, regardless of the number of tC reads.
The opposite leads at the bottom end, for example 1 of IC2 shown in FIG.
It starts with 0 and 11 as the reference.

Further, detection is performed one side at a time as in 10-1, 11-20, and all are performed based on the maximum 20-bin IC.

Therefore, as shown in FIG. 2, the detection pattern generation circuit 19 first generates detection patterns for 20 bins, and
, leads 11→20 are detected, and when all the leads are confirmed to be protruding (ON), it is determined that it is OK.

Next, for example, when detecting an 18-bin IC, the detection device itself does not know the number of bins of the detection IC, so first, the detection pattern generation circuit 19 generates a detection pattern for 20 pins, and -1, lead 11 → 20
Detection is performed as follows. Then, since there are no leads 1 and 20, the sensor 18 does not detect the same group (OFF), and the determination circuit 17 determines No, and the control section 15' sends the signal to the detection pattern generation circuit 19 via the lead detection circuit 16. command 18
Generate a bin detection pattern.

Then, it detects leads 10-2 and 11-19, and if all the leads are ON, it is determined as YES, and then it checks again whether or not leads 1 and 20 are OFF. If it is OFF, it is judged as OK.

Below, detection is performed in the same way as for 16 pins, 14 pins, and 8 pins, and if Satoshi'C/lKNO is O, it is judged as an error.
If YES, it is determined that IJ l' has been correctly inserted.

If an error occurs, the control section 15' displays an error message on the display section 20 shown in FIG. 1, and the apparatus (insertion machine 11 and lead detection circuit 16) stops.

The worker then marks the IC where the error occurred,
FIG. 71 <Press the omitted reset switch to restore the device.

The restored device continues IC insertion and lead detection based on the commands from the control unit 15'.

〔Effect of the invention〕

As explained above, by applying the lead detection method of the present invention to an automatic insertion machine, it is possible to accurately detect the insertion of an IC into a printed board. It is now possible to detect insertion defects, which has an extremely large effect on quality improvement.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing the configuration of the detection device of the present invention, FIG. 2 is a flowchart of FIG. 1, FIG. 3 is a sectional view explaining the structure of an IC lead detection jig, and FIG. 5 is a block diagram showing the configuration of the detection device, and FIG.
FIG. 7 is a plan view showing the numbers of C leads, and is a flowchart of FIG. 5. In the figure, 1 is a lead detection jig, and 2 is an IC. 7 is a lever, 9 is a light emitting element, 10 is a light receiving element, 11 is an insertion machine, 12 is a printed board, 1
4 is an insertion detection circuit, 15.15' is a control circuit, 16 is a read detection circuit, 17 is a determination circuit, 18 is a sensor, 19 is a detection pattern generation circuit, and 20 is a display section. Hōlkaku Luri' Vertical 2 Uta 3 f

Claims (1)

[Claims] In a lead detection device that detects whether or not each lead of an IC inserted into a printed board can be inserted, the lead detection device sequentially detects the leads based on a predetermined end of the IC to detect the total number of leads of the IC, A lead detection method characterized by detecting the presence or absence of each lead based on the number of detected leads, and determining whether or not an IC is inserted in accordance with the result of detecting the presence or absence of protrusion of each lead.