JPS61156750A - Manufacturing device for light emitting element - Google Patents

Abstract

PURPOSE:To contrive improvement in the yield of production by a method wherein light emitting element arrays are adsorbed by the vacuum sucking holes provided in lattice form on an elastic board, and a light emitting element chip is divided by performing an edge pressing, thereby enabling to easily and accurately divide the chip at the dividing line of the chip boundary. CONSTITUTION:A plurality of lattice-shaped vacuum sucking holes 51 are provided on t vacuum sucking board 52 of an elastic plate. After light emitting element arrays are placed on the slit of the sucking holes 1 at a right angle to it, a vacuum leakage is completely prevented by covering a transparent cellophane paper 6 on the arrays 1, and the arrays 1 are fixed to the vacuum sucking board 52. When a chip splitting wire 12 is pressed by an edge 3 under the above-mentioned condition, the lattice part of the sucking board is curved, bending stress is applied, and the arrays 1 are easily divided accurately at the deviding line 12, thereby enabling to suppress the generation of an abnormal dividing wherein shippings, burrs and the like are generated, and also to improve the yield of production of the light emitting element chip.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an apparatus for manufacturing light emitting devices, and in particular, a rectangular light emitting device array in which a plurality of light emitting devices are arranged in parallel in a row is manufactured into individual light emitting device chips. This invention relates to a chip cutting device for dividing into chips (abbreviated as chips).

Light-emitting elements such as semiconductor lasers and light-emitting diodes generally have a structure in which light is emitted from the sides of the element, and it is extremely important to divide them into individual chips in order to expose the sides.

In particular, after epitaxial growth of double heterojunctions and other completed wafers, characteristic tests are conducted to inspect the light emitting characteristics and determine the quality of individual chips.
For this purpose, the side surfaces must be folded during the process to expose the light emitting layer (active layer). For this reason, we first formed a rectangular light-emitting element array (column) with multiple chips lined up in a row, and after conducting a test to determine efficient light-emitting characteristics, we folded both sides. Separated into individual chips.

Therefore, it is important to pay particular attention to cutting out the chips and to divide the chips so as not to damage them.

[Prior Art] FIG. 3 shows a perspective view of the main parts of such a conventional chip cutting device, in which 1 is a light emitting element array.

1) is a light emitting part, 2 is a vacuum suction plate, 21 is a vacuum suction hole, and 3 is an edge.

When dividing a light emitting element array, as shown in the figure, the light emitting element array l is attracted to the vacuum suction hole 21, and a sharp blade or point is placed on the dividing line (scribe line) at the chip boundary from above. The shaped edges are pressed and separated into chips.

As mentioned above, this is cut into strips before the testing process, and is shaped into a light-emitting element array with a length of 10 to 15 fi and a width of 300 μm, for example, several tens of 300 μm square chips lined up. This is because it is difficult to perform scribing and slicing in the same manner as in the wafer state.

[Problems to be Solved by the Invention] By the way, the vacuum suction hole 21 described above is a circular hole with a hole diameter of 50 to 150 μmφ smaller than the chip, and such a circular hole is made of a metal plate (molybdenum) with a thickness of 50 to 200 μm. is etched to form a suction plate 22, and a frame 23 is provided on this to form a vacuum suction plate 2.

For this reason, the vacuum suction disk 2 is made of a material with high hardness and poor elasticity. Furthermore, since the light emitting element array 1 is also made of a compound semiconductor material and is a hard and brittle crystal, even if the light emitting element array 1 is pressed with the edge 3, it will not be divided correctly along the chip dividing line, and the divided chips will not be separated. However, there is a problem in that many chips and cracks occur, which reduces chip yield.

Figure 2 is a front view of the chip. Figure (a) shows such a defective chip 10', Figure 2) shows a good chip 10, and the defective chip has cracks extending to the active part as shown in the figure. ing.

Furthermore, in order to eliminate these defective chips and improve yield,
A scribe line 1 is placed at the dividing position on the back surface of the light emitting element array 1.
2 (see Figure 3) in addition to additional auxiliary means, such as
Although we are trying to ensure accurate division, it is still very difficult to do so reliably.

The present invention proposes a chip cutting device to solve such problems.

[Means for solving the problem] The problem consists of an elastic plate made of an elastic material on which a rectangular light emitting element array in which a plurality of light emitting elements are formed in a row is placed, and a plate provided on the elastic plate. A light-emitting element manufacturing apparatus having a plurality of suction holes for attracting the light-emitting element array, and pressing an edge onto a chip dividing line of the light-emitting element array placed on the elastic plate to divide the light-emitting element chips. solved by.

For example, a manufacturing apparatus is used in which the suction holes are provided in a lattice shape and a rectangular light emitting element array is placed at right angles to the lattice shape.

[Function] That is, the manufacturing device (chip cutting device) according to the present invention imparts elasticity to the vacuum suction disk so that when pressed, bending stress is applied to the device so that it can easily break correctly at the parting line at the chip boundary.

By doing so, abnormal parting lines such as chips and cracks will be less likely to occur, and the chip yield will improve.

[Example] Examples will be described in detail below with reference to nine drawings.

FIG. 1 shows a perspective view of the main parts of the chip cutting device according to the present invention, in which 1 is a light emitting element array, 1) is a light emitting part, 12 is a scribe line on the back side, 3 is an edge, and 5 is a vacuum. It is a suction board. The vacuum suction board 5 has suction holes 5 in a lattice shape.
1 will be provided.

For example, like the suction plate 52 shown in FIG.
Using a μm molybdenum plate, a lattice-like slit width W (
The width of the suction hole 51 is 150 μm, and the slit interval is 30 μm.
0μm, slit length 10. Form to about n. The vacuum suction plate 5 is created by incorporating the suction plate 52 into the frame 53. The lattice-shaped portion of such a vacuum suction disk becomes flexible and elastic.

Then, as shown in FIG. 1, the light emitting element array 1 is placed perpendicularly to the slit of the suction hole 51 and held by suction. Next, transparent cellophane paper 6 is covered from above to completely prevent vacuum leakage and the light emitting element array 1 is fixed to the suction plate 52.

After this, when the chip dividing line is pressed by the edge 3, the lattice-shaped portion of the vacuum suction plate 5 is curved, stress is applied downward, and the chip is divided into chips by accurately and easily folding. be done. Therefore, the number of defective chips is significantly reduced,
Chip yield can be increased.

Note that the usage example described above is a method in which the light emitting element array 1 is placed directly on the lattice-shaped portion of the vacuum suction plate 5.
A method may also be adopted in which an elastic porous filter is placed on the lattice-shaped portion and the light emitting element array is adsorbed through the filter.

[Effects of the Invention] As is clear from the above description, according to the present invention, the light emitting element array can be separated into chips with high precision, so the yield rate is improved, and the light emitting elements, especially the optical communication This contributes to cost reduction.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the main parts of a chip cutting device according to an embodiment of the present invention, FIG. 2 is a front view of its suction cup, FIG. 3 is a perspective view of the main parts of a conventional chip cutting device, and FIG. 4 (Al is a front view of a defective chip, and FIG. 4(b) is a front view of a good chip. In the figure, l is a light emitting element array, 1) is a light emitting part, 12 is a scribe line on the back surface, 2. 5 is a vacuum suction board, 2L 51 is a vacuum suction hole, 22
, 52 is a suction plate, 23.53 is a frame, 3 is an edge,
6 indicates cellophane paper, and 10.10' indicates a chip state. Figure 1 Figure 2-■ Figure 3 flik Figure

Claims (2)

[Claims] (1) An elastic plate made of an elastic material on which a rectangular light emitting element array in which a plurality of light emitting elements are formed in a row is placed, and a plurality of suction holes provided in the elastic plate to attract the light emitting element array. An apparatus for manufacturing a light emitting element, comprising: pressing an edge onto a chip dividing line of the light emitting element array placed on the elastic plate to divide the light emitting element chips. (2) The light emitting device manufacturing apparatus according to claim 1, wherein the suction holes are provided in a grid shape.