JPS61156244U - - Google Patents
Info
- Publication number
- JPS61156244U JPS61156244U JP1985037899U JP3789985U JPS61156244U JP S61156244 U JPS61156244 U JP S61156244U JP 1985037899 U JP1985037899 U JP 1985037899U JP 3789985 U JP3789985 U JP 3789985U JP S61156244 U JPS61156244 U JP S61156244U
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor chip
- chip carrier
- terminal parts
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037899U JPH0322915Y2 (US08063081-20111122-C00044.png) | 1985-03-16 | 1985-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037899U JPH0322915Y2 (US08063081-20111122-C00044.png) | 1985-03-16 | 1985-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61156244U true JPS61156244U (US08063081-20111122-C00044.png) | 1986-09-27 |
| JPH0322915Y2 JPH0322915Y2 (US08063081-20111122-C00044.png) | 1991-05-20 |
Family
ID=30544405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985037899U Expired JPH0322915Y2 (US08063081-20111122-C00044.png) | 1985-03-16 | 1985-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322915Y2 (US08063081-20111122-C00044.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299370A (ja) * | 1987-05-29 | 1988-12-06 | Shinko Electric Ind Co Ltd | 高周波用半導体装置 |
| JPH02235351A (ja) * | 1989-01-30 | 1990-09-18 | Internatl Business Mach Corp <Ibm> | 半導体チップの組立体 |
| JPH09260551A (ja) * | 1996-03-19 | 1997-10-03 | Nec Corp | 半導体装置 |
-
1985
- 1985-03-16 JP JP1985037899U patent/JPH0322915Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299370A (ja) * | 1987-05-29 | 1988-12-06 | Shinko Electric Ind Co Ltd | 高周波用半導体装置 |
| JPH02235351A (ja) * | 1989-01-30 | 1990-09-18 | Internatl Business Mach Corp <Ibm> | 半導体チップの組立体 |
| JPH09260551A (ja) * | 1996-03-19 | 1997-10-03 | Nec Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322915Y2 (US08063081-20111122-C00044.png) | 1991-05-20 |
