JPS61156239U - - Google Patents
Info
- Publication number
- JPS61156239U JPS61156239U JP1985038188U JP3818885U JPS61156239U JP S61156239 U JPS61156239 U JP S61156239U JP 1985038188 U JP1985038188 U JP 1985038188U JP 3818885 U JP3818885 U JP 3818885U JP S61156239 U JPS61156239 U JP S61156239U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- integrated circuit
- circuit chip
- light shielding
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985038188U JPS61156239U (cg-RX-API-DMAC7.html) | 1985-03-19 | 1985-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985038188U JPS61156239U (cg-RX-API-DMAC7.html) | 1985-03-19 | 1985-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61156239U true JPS61156239U (cg-RX-API-DMAC7.html) | 1986-09-27 |
Family
ID=30544958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985038188U Pending JPS61156239U (cg-RX-API-DMAC7.html) | 1985-03-19 | 1985-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61156239U (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000002244A1 (en) * | 1998-07-01 | 2000-01-13 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| JP2003023035A (ja) * | 2001-07-05 | 2003-01-24 | Sharp Corp | 半導体装置 |
| KR100498848B1 (ko) * | 1998-12-21 | 2005-07-04 | 세이코 엡슨 가부시키가이샤 | 회로 기판 및 회로 기판을 사용한 표시 장치 및 전자 기기 |
-
1985
- 1985-03-19 JP JP1985038188U patent/JPS61156239U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000002244A1 (en) * | 1998-07-01 | 2000-01-13 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| KR100498848B1 (ko) * | 1998-12-21 | 2005-07-04 | 세이코 엡슨 가부시키가이샤 | 회로 기판 및 회로 기판을 사용한 표시 장치 및 전자 기기 |
| JP2003023035A (ja) * | 2001-07-05 | 2003-01-24 | Sharp Corp | 半導体装置 |