JPS61155430A - Plasma treatment - Google Patents

Abstract

PURPOSE:To give different surface modifications to respective surfaces of an object simultaneously by a simple operation, by simultaneously feeding respective different plasma gases to the respective surfaces of the object, e.g., a polymeric material. CONSTITUTION:Referring to, for example, the type where the formation of plasmas is performed outside a plasma treatment chamber, and object 15 to be treated is set in the predetermined position in the plasma treatment chamber 4 and a door 4' is shut. After valves 6, 6', 7 and 9 are shut and a valve 8 is opened, a vacuum pump 5 is operated to evacuate the plasma treatment chamber 4. After the pressure within the chamber 4 is reduced to a predetermined value, valves 6 and 6' are opened to feed different reaction gases from gas cylinders 1 and 1' to the chamber 4 and the pressure within the chamber 4 is kept ata predetermined value while generators 11 and 11' are being operated. The plasmas of the different reaction gases are fed to different surfaces of the object 15 from plasma shower pipes 14 and 14'. As said reaction gases, O2, N2, He, Ar, H2, CO, CF4, etc., can be used.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for subjecting different surfaces of polymeric materials and the like to different plasma treatments.

[Prior Art] A method of performing plasma treatment is known as one of the surface modification methods for polymeric materials and the like.

Plasma processing methods can be roughly divided into two methods: methods in which the reaction gas is turned into plasma inside the plasma processing chamber, and methods in which the reaction gas is turned into plasma outside the plasma processing chamber.

These plasma processing methods will be explained based on FIGS. 8 and 9.

Figure 8 shows a type of device that converts gas into plasma inside the processing chamber, and Figure 9 shows a type of device that converts gas into plasma outside the processing chamber and introduces the plasma gas into the processing chamber. In the apparatus, 1 is a gas cylinder, 2 is a pressure reducing valve, 3 is a flow rate adjustment valve, 4 is a processing chamber, 4' is a door of the processing chamber, 5 is a vacuum pump, 6 valves for reaction gas, 7 valves for purging, 8 vacuum exhaust valves, 9 leak valves, 10 gaskets, 11 generators, 15 objects to be processed, and in Fig. 8 12V'! In FIG. 9, 15 is a waveguide, and 14 is a plasma shower tube.

When plasma processing a workpiece, first place the workpiece 15 in a predetermined position in the plasma processing chamber 4, close the door 4' and close the valves 6, 7, and 9, open the valve 8, and then turn the vacuum on. Turn on the pump 5 to evacuate the plasma processing chamber. When the plasma processing chamber reaches a predetermined pressure, open the valve 6, supply the reaction gas from the gas cylinder 1 while maintaining the predetermined pressure inside the processing chamber, and turn on the generator 11 to turn the gas into plasma in the processing chamber, or By introducing plasma gas into the processing chamber through the plasma shower pipe 14, the object to be processed is subjected to plasma processing for a predetermined period of time. When the plasma processing of the object to be processed is completed, the generator 11 is turned off, and the valves 6 and 8 are turned off.
After closing, the pulp 7 is opened to return the inside of the processing chamber to atmospheric pressure, and the door 4' is opened to take out the object 15 to be processed.

Furthermore, when plasma processing is performed, it is known that the effect of modifying the surface of the object to be processed differs depending on the type of reaction gas (plasmaization gas) used.

There are also known methods in which one part is sequentially subjected to plasma treatment using two or more types of gas, or a method in which plasma treatment is performed using a mixed gas of 2S or more. Regarding the plasma treatment using different pressures of different types of gases, first mask the hind leg masking area where the plasma treatment with the first gas was performed, then mask the part where the plasma treatment with the first gas was performed, and The only method available is to perform plasma treatment using gas, which requires complicated operations.

[Purpose of the invention]

The present invention provides a method for performing different surface modifications on different parts of a part by supplying different gases separately and simultaneously to a plasma processing chamber.

[Structure of the invention]

The present invention is a method for plasma processing a surface of a polymeric material, etc., which is characterized in that different plasma gases are simultaneously supplied to different surfaces of the object. .

Hereinafter, the method of the present invention will be explained in detail based on the drawings.

FIG. 1 is a schematic flow diagram of an apparatus for carrying out the method of the present invention in which gas is turned into plasma outside the processing chamber, in which numerals 1 and 1' are gas cylinders, 2 and 2' are pressure reducing valves, and 3
, 3' is a flow rate adjustment valve, 4 is a processing chamber, 4' is a door of the processing chamber, 5 is a vacuum cylinder 7', 6.6' is a reaction gas valve,
7 is a purge valve, 8 vacuum exhaust valves, 9 is a leak valve, 10 is a gasket, 11.11' is a generator, 13 and 15' are waveguides, 14 and 14' are plasma shower tubes, and 15 is a Indicates the object to be processed.

A method of plasma processing a workpiece using the apparatus, after the inside of the processing apparatus reaches a predetermined pressure, different reaction gases are supplied to different surfaces of the workpiece from two plasma shower tubes 14 and 14'. The rest is the same as that described with reference to FIG. 9.

That is, after the inside of the processing chamber reaches a predetermined pressure, 0!, which is turned into plasma as a reaction gas, is emitted from the plasma shower pipe 14'. A gas is supplied to the upper surface of the object to be treated, and from the plasma shower pipe 14, Ar gas turned into plasma is supplied to the lower surface of the object to be treated, so that the upper and lower surfaces of the object to be treated are treated with different plasma gases. .

The pressure inside the processing chamber, the flow rate of the plasma gas, the output of the generator, the processing time, etc. should be determined as appropriate depending on the size of the processing chamber, the combination of the material and gas of the object to be processed, or the desired degree of plasma processing. Can be done.

Radio waves of 1556 MHz, microwaves of about 2450 MHBI, etc. can be used as the high frequency of the generator, and OMr N2* can be used as the reaction gas.
H@ rAr r l'hr Cor CIP4y
An appropriate gas can be selected from among all the gases usable for plasma processing, such as CCl41PN.

Further, the structure of the plus 1 processing chamber is not limited to the patch type one shown in FIG. 1, but the present invention is applicable to all types of processing chambers, such as a continuous processing chamber.

Next, specific examples will be explained based on the drawings, but the present invention is not limited to the specific examples described below.

Example 1 Using the apparatus shown in FIG. 2, the outer surface of a polyolefin resin fuel tank was subjected to plasma treatment with Of gas, and the inner surface was subjected to plasma treatment with fluorohydrocarbon gas. In FIG. 2, each reference numeral has the same meaning as the reference numeral explained in connection with FIG. The plasma shower pipe 14' is located in the processing chamber 4, and the tank is arranged so that it is located outside to the plasma shower pipe 14. ,
A fluorinated hydrocarbon plasma gas was supplied from the plasma shower pipe 14', and a zero plasma gas was supplied from the plasma shower pipe 14. As a result, C-F on the inside of the tank
Although bonding occurs and painting and adhesion are difficult and time-consuming, it imparts properties that prevent fuel permeability, while the outer surface of the tank
Polar groups such as C=0 bonds or 100OH bonds are formed, improving secondary processability such as painting and adhesion.

In the case of the apparatus shown in FIG. 2, it is preferable to provide one partition plate 18 as shown in FIGS. 3 and 4 to prevent two or more types of gases from coming into contact with each other.

FIG. 4 shows a cross-sectional view taken along the line A-A in FIG.
Reference numeral 19 indicates a jack, 8' indicates a vacuum exhaust valve, and the other symbols have the same meanings as those explained in Figure M2, and in Figures 5 and 4, only the processing chamber portion is shown in cross section. shows.

When performing plasma processing on a workpiece using the equipment shown in Figures 3 and 4, the rail 1 installed in the processing equipment
7 is placed on the trolley, and when the opening of the tank and the hole provided in the partition plate 18 are located, by raising the jack 19 provided on the trolley, the tank is placed in the hole area. Plasma treatment is performed after positioning the plate so that the opening is inserted.

The gap between the hole in the plate 18 and the opening of the object to be treated may be completely sealed with a rubber seal or the like, but as shown in FIG. If the area is made large, the plasma gas will be deactivated as it passes through the gap, so it is not necessary to completely seal it.

Furthermore, if the distance over which the plasma-converted gas is deactivated is known, the partition can be omitted by adjusting the distance between the plasma-converted gas shower tube and the partition to the above-mentioned distance.

Alternatively, instead of providing a partition plate, a plate provided with a joint 20 that can be fitted into the opening of the workpiece 15 is fitted into the opening of the plate-shaped partitioning jig 18' as shown in FIG. After that, you may enter the processing chamber.

In addition, in order to reduce the mixing of the two types of gases, it is desirable to devise the relative positions of the evacuation pipe and the shower pipe so that the gases flow so that the respective gases do not mix.

When subjecting a workpiece to plasma treatment using the method described above, if the processing times for each plasma gas are different, only one plasma gas may be introduced for a long time and the other plasma gas may be introduced for a short time.

In this case, if the introduction of the plasma gas that is introduced for a short time is stopped and only one plasma gas is continued to be sent, the pressure in the processing chamber may fluctuate and the balance of the processing effect may be lost. For the plasma gas, it is preferable to stop only the generator at the stage where the treatment is completed and continue to supply the gas that does not turn into plasma.

Also, if you want to partially treat a surface using the above device, introduce plasma gas only to the side facing the surface you want to treat, and introduce non-plasma gas to the side you don't want to treat. Therefore, only the surface to be treated can be efficiently plasma-treated.

Example 2 Based on FIG. 7, an example is shown in which the front and back surfaces of a polyvinyl chloride tape are subjected to plasma treatment using different reaction gases, respectively.

In FIG. 7, reference numeral 15' indicates a polyvinyl chloride tee 7'.
, 21 is a supply port for the polyvinyl chloride tape, 22 is a take-up roll, and other symbols have the same meanings as those explained in FIG.

When the processing chamber is reduced to a predetermined pressure, an organosilicon compound such as vinyltrimethoxysilane or a mixed plasma gas of this with ammonia or a rare gas is supplied from the plasma shower pipe 14 while supplying the polyvinyl chloride tape at a constant rate. 0 from the plasma shower pipe 14'.
．． Plasma gas was supplied to perform plasma treatment on the front and back surfaces of the polyvinyl chloride tape with different gases, and the tape was wound up into a roll-up tape. The surface was given stain resistance and antistatic properties, and the back surface (the surface treated with zero gas) had improved adhesive strength with the adhesive. Therefore, an adhesive layer or a pressure-sensitive adhesive layer can be provided on the back side to form an adhesive tape.

[Brief explanation of the drawing]

1, 2, 5, and 7 are schematic diagrams for explaining the method of the present invention, FIG. 4 is a sectional view taken along line A-A in FIG. 3, and FIGS. The figure shows the state of connection between the partition plate and the opening, and FIGS. 8 and 9 are diagrams for explaining the conventional method.

Claims (1)

[Claims] 1. A method for plasma treatment of a surface of a polymeric material or the like, characterized in that different plasma gases are simultaneously supplied to different surfaces of the object.