JPS61151395U - - Google Patents
Info
- Publication number
- JPS61151395U JPS61151395U JP3318985U JP3318985U JPS61151395U JP S61151395 U JPS61151395 U JP S61151395U JP 3318985 U JP3318985 U JP 3318985U JP 3318985 U JP3318985 U JP 3318985U JP S61151395 U JPS61151395 U JP S61151395U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- structural member
- plate
- nozzle
- water supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3318985U JPS61151395U (ko) | 1985-03-08 | 1985-03-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3318985U JPS61151395U (ko) | 1985-03-08 | 1985-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61151395U true JPS61151395U (ko) | 1986-09-18 |
Family
ID=30535407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3318985U Pending JPS61151395U (ko) | 1985-03-08 | 1985-03-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61151395U (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
JP2020107785A (ja) * | 2018-12-28 | 2020-07-09 | 富士通株式会社 | 冷却システム |
-
1985
- 1985-03-08 JP JP3318985U patent/JPS61151395U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
JP2020107785A (ja) * | 2018-12-28 | 2020-07-09 | 富士通株式会社 | 冷却システム |