JPS61150360A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS61150360A
JPS61150360A JP27204484A JP27204484A JPS61150360A JP S61150360 A JPS61150360 A JP S61150360A JP 27204484 A JP27204484 A JP 27204484A JP 27204484 A JP27204484 A JP 27204484A JP S61150360 A JPS61150360 A JP S61150360A
Authority
JP
Japan
Prior art keywords
resin
electrode lead
electrode
lead plate
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27204484A
Other languages
Japanese (ja)
Inventor
Tetsuo Masuda
増田　哲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP27204484A priority Critical patent/JPS61150360A/en
Publication of JPS61150360A publication Critical patent/JPS61150360A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent defective connection to an electrode pad by forming a bending section in the thickness direction of an electrode lead plate between a fixing section to the pad of the electrode lead plate and a sealing section. CONSTITUTION:Electrode lead plates 1a, 1b... have L-shaped bending sections 11a, 21a..., 11b, 21b... in the direction of thickness of the plates among fixing sections to pads 107 and a sealing section for a resin board 104 for holding leads. Since the electrode plates are bent and extended vertically in parallel with a package, the device is fitted to the absorption of stress, and the direction of height of a resin case 2 can be lowered sufficiently, thus making the height of filling of a resin low, then economizing the quantity of the resin. Accordingly, the prevention of peelings among the electrode leads and the pads due to a difference between thermal expansion, the miniaturization of the case and the economization of the quantity of the resin are realized.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は樹脂封止型の半導体装置における電極リード
板の構造に適用されるものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention is applied to the structure of an electrode lead plate in a resin-sealed semiconductor device.

〔発明の技術的背景〕[Technical background of the invention]

従来１例えば樹脂封止型のジャイアントトランジスタ等
の半導体装置における構成は第２図に示されるようにな
っている。すなわち、図において、（１０１）は樹脂ケ
ース、（１０２）は放熱基台、（１０３ａ。The structure of a conventional semiconductor device such as a resin-sealed giant transistor is shown in FIG. That is, in the figure, (101) is a resin case, (102) is a heat dissipation base, and (103a).

１０３ｂ・・・）は電極接続用リード板（以下、電極リ
ード板と称する）、　（１０４）は上記電極リード板を
封着して支持するリード保持用樹脂板、（１０５）は上
記放熱基台（１０２）に絶縁板（１０６）を介してマウ
ントされた素子配設基台で、その上面に設けられた配線
パターンの電極パッド（１０７）に上記電極リード板（
１０３ａ、　１０３ｂ・・・）の端部が例えばはんだで
接続されている。また、上記の如く形成された外囲器内
には素子を保護するためシリコンのゲル状樹脂（１０８
）が充填樹脂として充填され、この上部に上記リード保
持用樹脂板（１０４）と樹脂ケース（１０１）とを封止
する例えばエポキシ樹脂の封止樹脂（１０９）がリード
保持用樹脂板（１０４）の開孔（１０４ａ）から注入さ
れ、加熱硬化されてなる。103b...) is a lead plate for electrode connection (hereinafter referred to as an electrode lead plate), (104) is a lead holding resin plate that seals and supports the electrode lead plate, and (105) is the heat dissipation base. (102) via an insulating plate (106), and the electrode lead plate (107) of the wiring pattern provided on the top surface of the element mounting base is
103a, 103b...) are connected, for example, by solder. In addition, a silicone gel-like resin (108
) is filled as a filling resin, and a sealing resin (109) such as epoxy resin is placed on top of the lead holding resin plate (104) to seal the lead holding resin plate (104) and the resin case (101). It is injected through the opening (104a) and cured by heating.

また、上記電極リード板（１０３ａ、　１０３ｂ）は、
外囲器内において板幅方向に交互に切欠（１１３・・・
）が設けられて長さ方向に伸縮が可能に形成されている
。In addition, the electrode lead plates (103a, 103b) are
Notches (113...
) so that it can be expanded and contracted in the length direction.

これは、半導体装置の作動装置の作動に伴なう温度上昇
によって、最も熱膨張係数の大きいゲル状樹脂（１０８
）はその膨張係数は７．８　Ｘ　１０−５で、外囲器の
樹脂ケースや電極リード板（１０３ａ、　１０３ｂ・・
）の膨張係数の１．６　Ｘ　１０−’を大幅に上回るこ
とにより、電極リード板に生ずる変型、切断や、電極リ
ード板と電極パッドとの接続部に生ずる剥離等を防止す
るために設けられたものである。This gel-like resin, which has the largest coefficient of thermal expansion (108
) has an expansion coefficient of 7.8 x 10-5, and is suitable for the resin case of the envelope and the electrode lead plates (103a, 103b...
) is provided to prevent deformation and cutting of the electrode lead plate and peeling of the connection between the electrode lead plate and the electrode pad by significantly exceeding the expansion coefficient of 1.6 It is something that

〔背景技術の問題点〕[Problems with background technology]

上記従来の構造は電極リード板が平面状であるので、こ
れに切欠を設けて膨張差により発生する応力の吸収をは
かっている。従って、切欠の設けられている部分が封止
樹脂で被覆されないことが必要であり、このためにゲル
状樹脂の上面が切欠の上端まで充填されなくてはならな
い。また、このようにしても平面上での対策に過ぎない
ので不充分である。また、上記ゲル状樹脂は封止樹脂に
比し価格が１０倍以上であって経済的でなく、また、充
填量が多いため充填工程でも樹脂ケースの内側面に沿っ
て這い上がるため、樹脂漏洩不良が多発する欠点もある
。さらに、切欠を多量に（大型。In the conventional structure described above, since the electrode lead plate is planar, a notch is provided in the electrode lead plate in order to absorb the stress generated due to the difference in expansion. Therefore, it is necessary that the portion where the notch is provided is not covered with the sealing resin, and for this reason, the upper surface of the gel-like resin must be filled up to the upper end of the notch. Further, even if this is done, it is insufficient because it is only a planar measure. In addition, the above-mentioned gel-like resin is more than 10 times as expensive as the sealing resin, making it uneconomical.Also, since the amount of filling is large, it creeps up along the inner surface of the resin case during the filling process, resulting in resin leakage. It also has the disadvantage of frequent defects. Furthermore, there are many notches (large size).

多数）設けると応力の吸収は良くなるが、リードの電気
抵抗が増加する欠点も生じてくる。If a large number of lead wires are provided, stress absorption becomes better, but it also has the disadvantage of increasing the electrical resistance of the leads.

〔発明の目的〕[Purpose of the invention]

この発明は背景技術の問題点に鑑み、改良された電極リ
ード線構造を有する半導体装置を提供するものである。In view of the problems of the background art, the present invention provides a semiconductor device having an improved electrode lead wire structure.

〔発明の概要〕[Summary of the invention]

この発明にかかる半導体装置は、電極リード板における
電極パッドへの固着部と封着部との開にその板厚方向に
折曲部が設けられていることを特徴とする。The semiconductor device according to the present invention is characterized in that a bent portion is provided in the thickness direction of the electrode lead plate at the opening between the portion fixed to the electrode pad and the sealing portion.

（発明の実施例〕 以下この発明を一実施例につき、第１図を参照して詳細
に説明する。なお、説明において従来と変わらない部分
については図面に従来と同じ符号を付けて示し、説明を
省略する。(Embodiment of the Invention) Hereinafter, one embodiment of the present invention will be described in detail with reference to FIG. omitted.

第１図に示されるように、電極リード板（Ｉａ、ｌｂ・
・・）は電極パッド（１０７，１０７・・・）への固着
部とリード保持用樹脂板（１０４）の封着部との間に板
厚方向に一例のＬ字型折曲部（ｌｌａ、２１ａ−、ｌｌ
ｂ、２１ｂ−）が設けられている。そして、電極リード
板は折曲され。As shown in Figure 1, electrode lead plates (Ia, lb/
) is an example of an L-shaped bent part (lla, 21a-,ll
b, 21b-) are provided. Then, the electrode lead plate is bent.

これと垂直方向（図示の外囲器に対し水平方向）に伸び
るので応力の吸収にきわめて有効であり、かつ外囲器の
樹脂ケース（２）の高さに占める部分を充分小にするこ
とができる。すなわち、ゲル状樹脂の充填高さを低減で
きる。これにより、外囲器の高さを従来に比し約１７２
に、充填樹脂量を約１７３に低減できた。Since it extends in the vertical direction (horizontal direction with respect to the illustrated envelope), it is extremely effective in absorbing stress, and the portion occupied by the height of the resin case (2) of the envelope can be made sufficiently small. can. That is, the filling height of the gel-like resin can be reduced. As a result, the height of the envelope has been increased by approximately 172 mm compared to the conventional one.
In addition, the amount of filled resin could be reduced to about 173.

〔発明の効果〕〔Effect of the invention〕

この発明によれば、電極リード板に充分な緩衝が与えら
れるので電極パッドへの接続不良（オープン不良）が皆
無になるという顕著な利点がある。According to the present invention, sufficient buffering is provided to the electrode lead plate, so there is a remarkable advantage that there is no connection failure (open failure) to the electrode pad.

次に、ケースを小型に、また充填樹脂量を減少すること
ができ１作業性も向上した。この結果を次の第１表に示
す。Next, the case can be made smaller and the amount of resin filled can be reduced, improving workability. The results are shown in Table 1 below.

第１表Table 1

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の半導体装置にかかり、図（ａ）は断
面図、図（ｂ）は上面図、図（Ｃ）は電極リード部の斜
視図、第２図は従来の半導体装置にかかり、図（、）は
断面図、図（ｂ）は上面図１図（Ｃ）は電極リード部の
斜視図である。 ｌａ、　ｌｂ　　　　　電極リード板 １１ａ、２１ａ−、ｌｌｂ、２１ｂ−電極リード板の折
曲部２、１０１　　　　　樹脂ケース １０２　　　　　　放熱基台 １０４　　　　　　リード保持用樹脂板ｔＯＳ　　　　
　　素子配設基台 １０６　　　　　　絶縁板 １０７　　　　　　電極パッドFIG. 1 shows a semiconductor device of the present invention, FIG. , Figure ( ) is a sectional view, Figure (b) is a top view, and Figure (C) is a perspective view of the electrode lead portion. la, lb electrode lead plates 11a, 21a-, llb, 21b-bending portions 2, 101 of electrode lead plates resin case 102 heat dissipation base 104 lead holding resin plate tOS
Element placement base 106 Insulating plate 107 Electrode pad

Claims (1)

【特許請求の範囲】[Claims] 外囲器の一つの面に垂直に封着された電極リード板が、
この外囲器内の端部を電極パッドに固着し、前記外囲器
内に該外囲器の構成材よりも膨張係数の大きい充填樹脂
が充填された半導体装置において、電極リード板におけ
る電極パッドへの固着部と封着部との間にその板厚方向
に折曲部が設けられていることを特徴とする半導体装置
。An electrode lead plate is vertically sealed on one side of the envelope.
In a semiconductor device in which an end portion inside the envelope is fixed to an electrode pad, and the envelope is filled with a filling resin having a larger coefficient of expansion than the constituent material of the envelope, the electrode pad on the electrode lead plate A semiconductor device characterized in that a bent part is provided in the thickness direction between a part fixed to the semiconductor device and a sealed part.
JP27204484A 1984-12-25 1984-12-25 Semiconductor device Pending JPS61150360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27204484A JPS61150360A (en) 1984-12-25 1984-12-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27204484A JPS61150360A (en) 1984-12-25 1984-12-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS61150360A true JPS61150360A (en) 1986-07-09

Family

ID=17508329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27204484A Pending JPS61150360A (en) 1984-12-25 1984-12-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS61150360A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223141A (en) * 2004-02-05 2005-08-18 Toyota Industries Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223141A (en) * 2004-02-05 2005-08-18 Toyota Industries Corp Semiconductor device

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