JPS61149335U - - Google Patents
Info
- Publication number
- JPS61149335U JPS61149335U JP3254585U JP3254585U JPS61149335U JP S61149335 U JPS61149335 U JP S61149335U JP 3254585 U JP3254585 U JP 3254585U JP 3254585 U JP3254585 U JP 3254585U JP S61149335 U JPS61149335 U JP S61149335U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- solder
- semiconductor pellet
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000013022 venting Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第1図はこの考案による半導体装置の一実施例
を示す断面図、第2図は第1図のロ―ロ線方向に
見た図、第3図はこの考案による半導体装置の電
気的、特性のばらつき状態の一例を示す図、第4
図は従来の半導体装置の一例の断面図、第5図は
第4図のイーイ線方向に見た図、第6図は従来の
半導体装置の電気的特性のばらつき状態の一例を
示す図である。 1……半導体ペレツト、2……半導体素子、3
,41……金属被膜、5……半田、6……導電性
接続体、8……溝。
を示す断面図、第2図は第1図のロ―ロ線方向に
見た図、第3図はこの考案による半導体装置の電
気的、特性のばらつき状態の一例を示す図、第4
図は従来の半導体装置の一例の断面図、第5図は
第4図のイーイ線方向に見た図、第6図は従来の
半導体装置の電気的特性のばらつき状態の一例を
示す図である。 1……半導体ペレツト、2……半導体素子、3
,41……金属被膜、5……半田、6……導電性
接続体、8……溝。
Claims (1)
- 半導体素子を含む半導体ペレツトを導電性接続
体に半田付けして構成され、上記半導体ペレツト
の半田と接触する面にはその中央部より周辺に達
するガス抜き用の溝が形成されていることを特徴
とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3254585U JPS61149335U (ja) | 1985-03-06 | 1985-03-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3254585U JPS61149335U (ja) | 1985-03-06 | 1985-03-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61149335U true JPS61149335U (ja) | 1986-09-16 |
Family
ID=30534157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3254585U Pending JPS61149335U (ja) | 1985-03-06 | 1985-03-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61149335U (ja) |
-
1985
- 1985-03-06 JP JP3254585U patent/JPS61149335U/ja active Pending