JPS61149334U - - Google Patents

Info

Publication number
JPS61149334U
JPS61149334U JP3103885U JP3103885U JPS61149334U JP S61149334 U JPS61149334 U JP S61149334U JP 3103885 U JP3103885 U JP 3103885U JP 3103885 U JP3103885 U JP 3103885U JP S61149334 U JPS61149334 U JP S61149334U
Authority
JP
Japan
Prior art keywords
substrate
circuit
recess
hybrid integrated
circuit components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3103885U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3103885U priority Critical patent/JPS61149334U/ja
Publication of JPS61149334U publication Critical patent/JPS61149334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP3103885U 1985-03-05 1985-03-05 Pending JPS61149334U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3103885U JPS61149334U (zh) 1985-03-05 1985-03-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3103885U JPS61149334U (zh) 1985-03-05 1985-03-05

Publications (1)

Publication Number Publication Date
JPS61149334U true JPS61149334U (zh) 1986-09-16

Family

ID=30531279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3103885U Pending JPS61149334U (zh) 1985-03-05 1985-03-05

Country Status (1)

Country Link
JP (1) JPS61149334U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010073994A (ja) * 2008-09-19 2010-04-02 Powertech Technology Inc ウインドウ型ｂｇａパッケージ及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010073994A (ja) * 2008-09-19 2010-04-02 Powertech Technology Inc ウインドウ型ｂｇａパッケージ及びその製造方法

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