JPS61146976U - - Google Patents

Info

Publication number
JPS61146976U
JPS61146976U JP1985029660U JP2966085U JPS61146976U JP S61146976 U JPS61146976 U JP S61146976U JP 1985029660 U JP1985029660 U JP 1985029660U JP 2966085 U JP2966085 U JP 2966085U JP S61146976 U JPS61146976 U JP S61146976U
Authority
JP
Japan
Prior art keywords
electronic component
adhesive
mounting member
view
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985029660U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985029660U priority Critical patent/JPS61146976U/ja
Publication of JPS61146976U publication Critical patent/JPS61146976U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の電子部品装置の１実施例であ
り、Ａは模式的平面図、Ｂは模式的断面図を示す
、Ｃは接着剤がかたよつて塗布された場合の模式
的断面図、Ｄはコレツトによつて密着された場合
の模式的断面図である。第２図は従来の電子部品
装置であり、Ａは模式的平面図、Ｂは模式的断面
図、Ｃは接着剤がかたよつて塗布された場合の模
式的断面図、Ｄはコレツトによつて密着された場
合の模式的断面図を示す。 １…電子部品、２…接着剤、３…装着部材、４
…コレツト、５…穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電子部品と、該電子部品を接着剤を介して取り
    付ける為の装着部材とを有する電子部品装置にお
    いて、前記装着部材の前記電子部品装着部分に１
    個以上の前記接着剤導出用の穴が形成された事を
    特徴とする電子部品装置。
JP1985029660U 1985-03-04 1985-03-04 Pending JPS61146976U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985029660U JPS61146976U (ja) 1985-03-04 1985-03-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985029660U JPS61146976U (ja) 1985-03-04 1985-03-04

Publications (1)

Publication Number Publication Date
JPS61146976U true JPS61146976U (ja) 1986-09-10

Family

ID=30528672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985029660U Pending JPS61146976U (ja) 1985-03-04 1985-03-04

Country Status (1)

Country Link
JP (1) JPS61146976U (ja)

Similar Documents

Publication Publication Date Title
JPS61146976U (ja)
JPS62172811U (ja)
JPS6129217U (ja) 面状採暖具
JPS5892509U (ja) 自動車用テルテ−ルレンズの取付装置
JPH0336114U (ja)
JPS61119957U (ja)
JPS628307U (ja)
JPS63153489U (ja)
JPS6245876U (ja)
JPS5925128U (ja) 押釦と軸の接着構造
JPS63133827U (ja)
JPS62150735U (ja)
JPS61132284U (ja)
JPH0169769U (ja)
JPS6186446U (ja)
JPS617777U (ja) 太陽熱集熱器
JPS6190836U (ja)
JPS63140696U (ja)
JPS61140538U (ja)
JPS61102074U (ja)
JPS6131211U (ja) 指輪の形状
JPS6181180U (ja)
JPS6294648U (ja)
JPS6174891U (ja)
JPS6454327U (ja)