JPS6114637B2 - - Google Patents
Info
- Publication number
- JPS6114637B2 JPS6114637B2 JP9707381A JP9707381A JPS6114637B2 JP S6114637 B2 JPS6114637 B2 JP S6114637B2 JP 9707381 A JP9707381 A JP 9707381A JP 9707381 A JP9707381 A JP 9707381A JP S6114637 B2 JPS6114637 B2 JP S6114637B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- outer ring
- metal outer
- lead wire
- nickel plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 53
- 238000007747 plating Methods 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 229910052759 nickel Inorganic materials 0.000 claims description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229910000531 Co alloy Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000005388 borosilicate glass Substances 0.000 claims description 5
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 7
- 229910000833 kovar Inorganic materials 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
【発明の詳細な説明】
この発明は気密端子の製造方法に関し、特に線
膨脹係数が75×10-7／℃以下の材料よりなる金属
外環と鉄・ニルケル・コバルト合金よりなるリー
ド線をホウケイ酸ガラスを介して封着した気密端
子の仕上げメツキ層の形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an airtight terminal, and in particular to a method for manufacturing an airtight terminal, in which a metal outer ring is made of a material having a coefficient of linear expansion of 75×10 -7 /°C or less, and a lead wire is made of an iron-Nilkel-cobalt alloy. The present invention relates to a method for forming a finishing plating layer of an airtight terminal sealed via acid glass.
気密端子は各種の分野に広く用いられている。
圧力センサに用いられる気密端子は、第１図およ
び第２図に示す構造を有している。図において、
１はコバールと称される鉄・ニツケル・コバルト
合金（Fe53％、Ni28％、Co38％）よりなる金属
外環で、複数個のガラス封着用の透孔２と、中心
部の圧力伝達用の透孔３と、この透孔３に連なる
パイプ部４とを有する。前記各透孔２にはホウケ
イ酸ガラス５を介してコバール製のリード線６が
気密絶縁的に封着されている。 Hermetic terminals are widely used in various fields.
An airtight terminal used in a pressure sensor has a structure shown in FIGS. 1 and 2. In the figure,
1 is a metal outer ring made of an iron-nickel-cobalt alloy called Kovar (53% Fe, 28% Ni, 38% Co), with multiple through holes 2 for glass sealing and a transparent hole in the center for pressure transmission. It has a hole 3 and a pipe portion 4 connected to the through hole 3. A lead wire 6 made of Kovar is hermetically and insulatively sealed to each of the through holes 2 via a borosilicate glass 5.
上記の構成の気密端子において、金属外環１お
よびリード線６を素地のまま露出させておくと、
発錆の原因となるのみならず、金属外環１の上面
への感圧素子のマウント性やリード線６への金属
細線のボンデイング性等に問題が生ずるので、仕
上げメツキ層が形成されている。すなわち、従来
は第３図および第４図に示すように、金属外環１
にガラス５を介してリード線６を気密絶縁的に封
着したのち、金属外環１およびリード線６の露出
部分に仕上げメツキ層７，８を形成している。こ
の仕上げメツキ層７，８としては、一般に電気ニ
ツケルメツキ層、化学ニツケルメツキ層または金
メツキ層が行なわれている。 In the airtight terminal with the above configuration, if the metal outer ring 1 and the lead wire 6 are left exposed as they are,
A finishing plating layer is formed because it not only causes rust, but also causes problems in mounting the pressure-sensitive element on the top surface of the metal outer ring 1 and bonding the thin metal wire to the lead wire 6. . That is, conventionally, as shown in FIGS. 3 and 4, the metal outer ring 1
After the lead wires 6 are hermetically and insulatively sealed via the glass 5, finishing plating layers 7 and 8 are formed on the metal outer ring 1 and the exposed portions of the lead wires 6. The finishing plating layers 7, 8 are generally an electric nickel plating layer, a chemical nickel plating layer or a gold plating layer.
しかしながら、電気ニツケルメツキ層を形成す
るためには、金属外環１とリード線６とがガラス
５を介して絶縁されているため、これら金属外環
１とリード線６とを線縛等によつて同電位にする
必要があり、線縛やその取り外し等の作業が極め
て煩雑である。また、製造容易なバレルメツキを
実施すると、リード線６が折れ曲つたり、ガラス
５にクラツクが生じる。さらにパイプ４の内面は
外面に比較してメツキ層が薄くなるといつた問題
点がある。また化学ニツケルメツキ層を形成する
場合は、線縛等の煩雑な作業が不要であり、パイ
プ部４の内面にも均一なメツキ層が形成される
が、化学ニツケルメツキ層はニツケル塩を次亜リ
ン酸塩で還元して形成するためメツキ層中に数〜
10数％のリンを含んでおり、後の感圧素子のマウ
ント工程等で加熱されると硬度が増し、かつ線膨
脹係数が約130×10-7／℃程度もあるので、線膨
脹係数が47×10-7／℃の金属外環１との線膨脹係
数差によつてメツキ層に割れが生じやすく、この
部分から気密洩れになるという問題がある。さら
に金メツキ層を形成することは、材料費が高くて
原価高になるし、原価低減のためにメツキ厚を薄
くすると耐食性劣化による発錆の問題があり、ま
た、コバールの上に直接金メツキ層を形成すると
応力腐蝕によるリード線６の折れが発生しやすい
といつた問題点を含む。 However, in order to form the electric nickel plating layer, since the metal outer ring 1 and the lead wire 6 are insulated through the glass 5, the metal outer ring 1 and the lead wire 6 must be connected by wire binding or the like. It is necessary to have the same potential, and the work of tying and removing wires is extremely complicated. Further, when barrel plating is performed, which is easy to manufacture, the lead wire 6 may be bent and the glass 5 may be cracked. Another problem is that the plating layer on the inner surface of the pipe 4 is thinner than on the outer surface. In addition, when forming a chemical nickel plating layer, there is no need for complicated work such as wire binding, and a uniform plating layer is also formed on the inner surface of the pipe section 4. Because it is formed by reduction with salt, there are several ~
It contains over 10% phosphorus, and when heated during the subsequent mounting process of the pressure-sensitive element, its hardness increases, and the coefficient of linear expansion is about 130 x 10 -7 /℃, so the coefficient of linear expansion is Due to the linear expansion coefficient difference with the metal outer ring 1 of 47×10 −7 /° C., cracks tend to occur in the plating layer, and there is a problem in that airtightness leaks from this portion. Furthermore, forming a gold plating layer increases the cost due to high material costs, and if the thickness of the plating is made thinner to reduce costs, there is a problem of rust due to deterioration of corrosion resistance. If a layer is formed, there is a problem that the lead wire 6 is likely to break due to stress corrosion.
そのため、この発明の主な目的は、コバール等
の450℃以下の温度範囲における線膨脹係数が75
×10-7／℃以下の材料よりなる金属外環とリード
線とをホウケイ酸ガラスを介して気密絶縁的に封
着した気密端子に容易にしかも各種問題の発生し
ない仕上げメツキ層を形成する気密端子の製造方
法を提供することである。 Therefore, the main purpose of this invention is to achieve a linear expansion coefficient of 75 in the temperature range of 450℃ or less, such as Kovar.
The metal outer ring made of a material with a temperature of ×10 -7 /℃ or less and the lead wire are sealed in an airtight and insulating manner through borosilicate glass to form an airtight finish plating layer that easily and without causing various problems. An object of the present invention is to provide a method for manufacturing a terminal.
この発明の上記の目的およびその他の目的と特
徴は、図面を参照して行なう以下の詳細な説明か
ら一層明らかとなろう。 The above objects and other objects and features of the present invention will become more apparent from the following detailed description with reference to the drawings.
第５図はこの発明の製造方法を説明するための
工程ブロツク図を示し、第６図は上記方法によつ
て製造された気密端子の要部拡大断面図を示す。
まず、コバールと称される鉄・ニツケル・コバル
ト合金（Fe53％、Ni28％、Co18％）よりなる金
属外環１の各透孔２にホウケイ酸ガラス５を介し
てコバールよりなるリード線６を気密絶縁的に封
着したのち、金属外環１のみに電気ニツケルメツ
キ層９を形成し、次いで金属外環１およびリード
線６に化学ニツケルメツキ層１０，１１を形成す
る。 FIG. 5 shows a process block diagram for explaining the manufacturing method of the present invention, and FIG. 6 shows an enlarged sectional view of the main part of the airtight terminal manufactured by the above method.
First, lead wires 6 made of Kovar are airtightly inserted through borosilicate glass 5 into each through hole 2 of a metal outer ring 1 made of an iron-nickel-cobalt alloy called Kovar (53% Fe, 28% Ni, 18% Co). After insulatively sealing, an electric nickel plating layer 9 is formed only on the metal outer ring 1, and then chemical nickel plating layers 10 and 11 are formed on the metal outer ring 1 and the lead wire 6.
上記の製造方法によれば、まず金属外環１のみ
に電気ニツケルメツキ層９を形成するので、煩雑
な線縛作業が不要であり、簡単に実施できる。ま
た化学ニツケルメツキ層１０，１１は線縛作業を
することなくガラス５を介して絶縁された金属外
環１とリード線６とに均一に形成することがで
き、特にパイプ部４の内面にも均一な厚さに形成
できる。さらに金属外環１には電気ニツケルメツ
キ層９を介在して化学ニツケルメツキ層１１を形
成しているので、金属外環１上に感圧素子をマウ
ントする等の加熱工程において化学ニツケルメツ
キ層１１の硬度が増し、金属外環１との線膨脹係
数差による応力が生じても、この応力は柔軟な電
気ニツケルメツキ層９で吸収されるので、この応
力で化学ニツケルメツキ層１１に割れが発生する
こともない。 According to the above manufacturing method, since the electric nickel plating layer 9 is first formed only on the metal outer ring 1, complicated wire binding work is not necessary and can be easily carried out. Furthermore, the chemical nickel plating layers 10 and 11 can be uniformly formed on the metal outer ring 1 and the lead wire 6, which are insulated through the glass 5, without any wire binding work, and especially on the inner surface of the pipe portion 4. It can be formed to a certain thickness. Furthermore, since the chemical nickel plating layer 11 is formed on the metal outer ring 1 with the electric nickel plating layer 9 interposed therebetween, the hardness of the chemical nickel plating layer 11 is reduced during a heating process such as mounting a pressure sensitive element on the metal outer ring 1. Even if stress occurs due to the difference in coefficient of linear expansion with the metal outer ring 1, this stress is absorbed by the flexible electric nickel plating layer 9, so this stress will not cause cracks in the chemical nickel plating layer 11.
なお、上記実施例ではパイプ部４を金属外環１
と一体に形成する場合について説明したが、金属
外環１とは別に製作し金属外環１に抵抗溶接また
はロウ付けにより固着一体化するようにしてもよ
い。この場合、金属外環１とパイプ部４とを固着
一体化したのち仕上げメツキ層を形成するように
してもよいが、別々に電気ニツケルメツキ層を形
成後に固着一体化し、しかるのちに化学ニツケル
メツキ層を形成するようにしてもよい。そのよう
な場合、透孔３の長さ寸法が実質的に減少するこ
とにより、パイプ部４の内面への電気ニツケルメ
ツキ層９の形成が容易になる利点がある。 In the above embodiment, the pipe portion 4 is connected to the metal outer ring 1.
Although the case has been described in which it is formed integrally with the metal outer ring 1, it may be manufactured separately from the metal outer ring 1 and fixedly integrated with the metal outer ring 1 by resistance welding or brazing. In this case, a finish plating layer may be formed after the metal outer ring 1 and the pipe portion 4 are fixed and integrated, but an electric nickel plating layer is separately formed and then fixed and integrated, and then a chemical nickel plating layer is formed. You may form it. In such a case, there is an advantage that the length dimension of the through hole 3 is substantially reduced, thereby making it easier to form the electrolytic nickel plating layer 9 on the inner surface of the pipe portion 4.
また、上記実施例は、金属外環１を比較的厚肉
の板材をコイニング成型して製作した場合につい
て説明したが、第７図に示すように薄肉の板材を
絞り成型して製作した場合でも同様に実施でき
る。 Further, in the above embodiment, the metal outer ring 1 was manufactured by coining a relatively thick plate material, but as shown in FIG. It can be implemented similarly.
さらに、金属外環１はコバールと称される鉄・
ニツケル・コバルト合金のみならず、42合金と称
される鉄・ニツケル合金（Fe58％、Ni42％、線
膨脹係数52×10-7／℃）のように450℃以下の温
度範囲における線膨脹係数が75×10-7／℃以下の
金属材料を用いて構成する場合も同様に実施でき
る。 Furthermore, the metal outer ring 1 is made of iron called Kovar.
Not only nickel-cobalt alloys, but also iron-nickel alloys called 42 alloys (58% Fe, 42% Ni, coefficient of linear expansion 52×10 -7 /°C) have a linear expansion coefficient in the temperature range below 450°C. The same method can be used when a metal material having a temperature of 75×10 -7 /°C or less is used.
この発明は以上のように、450℃以下の温度範
囲における線膨脹係数が75×10-7／℃以下の材料
よりなる金属外環にホウケイ酸ガラスを介して
鉄・ニツケル・コバルト合金よりなるリード線を
気密絶縁的に封着したのち、金属外環およびリー
ド線の露出部分に仕上げメツキ層を形成する気密
端子の製造方法において、前記仕上げメツキ層と
してまず金属外環のみに電気ニツケルメツキ層を
形成し、しかるのちに金属外環およびリード線に
化学ニツケルメツキ層を形成するものであるか
ら、従来の電気ニツケルメツキ層を形成する場合
に比較してメツキ作業が容易であり、化学ニツケ
ルメツキ層を形成する場合に比較して後の加熱工
程で化学ニツケルメツキ層の硬化および金属外環
との線膨脹係数差による応力に基因する化学ニツ
ケルメツキ層の割れの問題がなく、しかも金メツ
キ層を形成する場合に比較して著しく原価低減が
図れるという効果を奏する。 As described above, this invention provides a metal outer ring made of a material with a linear expansion coefficient of 75×10 -7 /°C or less in a temperature range of 450°C or less, and a lead made of iron-nickel-cobalt alloy via borosilicate glass. In a method for manufacturing an airtight terminal in which a finish plating layer is formed on the metal outer ring and the exposed portion of the lead wire after the wire is hermetically and insulatively sealed, an electric nickel plating layer is first formed only on the metal outer ring as the finish plating layer. However, since a chemical nickel plating layer is then formed on the metal outer ring and the lead wire, the plating work is easier than when forming a conventional electric nickel plating layer. Compared to the case of forming a gold plating layer, there is no problem of hardening of the chemical nickel plating layer in the subsequent heating process and cracking of the chemical nickel plating layer due to stress due to the difference in coefficient of linear expansion with the metal outer ring. This has the effect of significantly reducing costs.
第１図はこの発明の背景となる気密端子の一例
の平面図、第２図は第１図の―線に沿う断面
図、第３図はこの発明に先行する製造方法を説明
するための工程ブロツク図、第４図はその方法に
よつて製造された気密端子の要部拡大断面図、第
５図はこの発明の製造方法について説明するため
の工程ブロツク図、第６図は上記方法によつて製
造された気密端子の要部拡大断面図、第７図はこ
の発明が好適する他の気密端子の断面図である。
１…金属外環、２，３…透孔、４…パイプ部、
５…ガラス、６…リード線、９…電気ニツケルメ
ツキ層、１０，１１…化学ニツケルメツキ層。
Fig. 1 is a plan view of an example of an airtight terminal which is the background of this invention, Fig. 2 is a sectional view taken along the line - - in Fig. 1, and Fig. 3 is a process for explaining the manufacturing method prior to this invention. A block diagram, FIG. 4 is an enlarged cross-sectional view of the main part of an airtight terminal manufactured by the method, FIG. 5 is a process block diagram for explaining the manufacturing method of the present invention, and FIG. FIG. 7 is an enlarged cross-sectional view of a main part of the airtight terminal manufactured by the method, and FIG. 7 is a cross-sectional view of another airtight terminal to which the present invention is suitable. 1...Metal outer ring, 2, 3...Through hole, 4...Pipe part,
5... Glass, 6... Lead wire, 9... Electric nickel plating layer, 10, 11... Chemical nickel plating layer.
Claims (1)
75×10-7／℃以下の材料よりなる金属外環にホウ
ケイ酸ガラスを介して鉄・ニツケル・コバルト合
金よりなるリード線を気密絶縁的に封着したの
ち、金属外環およびリード線の露出部分に仕上げ
メツキ層を形成する気密端子の製造方法におい
て、前記仕上げメツキ層としてまず金属外環のみ
に電気ニツケルメツキ層を形成し、しかるのちに
金属外環およびリード線に化学ニツケルメツキ層
を形成することを特徴とする気密端子の製造方
法。1 The coefficient of linear expansion in the temperature range below 450℃ is
After a lead wire made of an iron-nickel-cobalt alloy is hermetically and insulated sealed to a metal outer ring made of a material with a temperature of 75×10 -7 /℃ or less via borosilicate glass, the metal outer ring and lead wire are exposed. In the method for manufacturing an airtight terminal in which a finish plating layer is formed on a portion, an electric nickel plating layer is first formed only on the metal outer ring as the finish plating layer, and then a chemical nickel plating layer is formed on the metal outer ring and the lead wire. A method for manufacturing an airtight terminal characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707381A JPS57210585A (en) | 1981-06-22 | 1981-06-22 | Method of producing airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707381A JPS57210585A (en) | 1981-06-22 | 1981-06-22 | Method of producing airtight terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57210585A JPS57210585A (en) | 1982-12-24 |
| JPS6114637B2 true JPS6114637B2 (en) | 1986-04-19 |
Family
ID=14182458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9707381A Granted JPS57210585A (en) | 1981-06-22 | 1981-06-22 | Method of producing airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57210585A (en) |
-
1981
- 1981-06-22 JP JP9707381A patent/JPS57210585A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57210585A (en) | 1982-12-24 |
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