JPS61144697U - - Google Patents
Info
- Publication number
- JPS61144697U JPS61144697U JP2645185U JP2645185U JPS61144697U JP S61144697 U JPS61144697 U JP S61144697U JP 2645185 U JP2645185 U JP 2645185U JP 2645185 U JP2645185 U JP 2645185U JP S61144697 U JPS61144697 U JP S61144697U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat dissipation
- heat
- element mounting
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2645185U JPS61144697U (de) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2645185U JPS61144697U (de) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144697U true JPS61144697U (de) | 1986-09-06 |
Family
ID=30522472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2645185U Pending JPS61144697U (de) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144697U (de) |
-
1985
- 1985-02-27 JP JP2645185U patent/JPS61144697U/ja active Pending
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