JPS61144650U - - Google Patents
Info
- Publication number
- JPS61144650U JPS61144650U JP2852385U JP2852385U JPS61144650U JP S61144650 U JPS61144650 U JP S61144650U JP 2852385 U JP2852385 U JP 2852385U JP 2852385 U JP2852385 U JP 2852385U JP S61144650 U JPS61144650 U JP S61144650U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- stage
- semiconductor device
- resin
- support rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2852385U JPS61144650U (pt) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2852385U JPS61144650U (pt) | 1985-02-28 | 1985-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144650U true JPS61144650U (pt) | 1986-09-06 |
Family
ID=30526476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2852385U Pending JPS61144650U (pt) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144650U (pt) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0375630U (pt) * | 1989-11-21 | 1991-07-30 | ||
| JPH05226548A (ja) * | 1991-11-27 | 1993-09-03 | Samsung Electron Co Ltd | 半導体装置用リードフレーム |
| JP2013016819A (ja) * | 2004-12-16 | 2013-01-24 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | パッケージングされた電子デバイス及びその製作方法 |
| JP2013162009A (ja) * | 2012-02-07 | 2013-08-19 | Hitachi Industrial Equipment Systems Co Ltd | モールド変圧器 |
| JP2018064051A (ja) * | 2016-10-14 | 2018-04-19 | 株式会社トーキン | 電気二重層コンデンサ |
-
1985
- 1985-02-28 JP JP2852385U patent/JPS61144650U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0375630U (pt) * | 1989-11-21 | 1991-07-30 | ||
| JPH05226548A (ja) * | 1991-11-27 | 1993-09-03 | Samsung Electron Co Ltd | 半導体装置用リードフレーム |
| JP2013016819A (ja) * | 2004-12-16 | 2013-01-24 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | パッケージングされた電子デバイス及びその製作方法 |
| JP2013162009A (ja) * | 2012-02-07 | 2013-08-19 | Hitachi Industrial Equipment Systems Co Ltd | モールド変圧器 |
| JP2018064051A (ja) * | 2016-10-14 | 2018-04-19 | 株式会社トーキン | 電気二重層コンデンサ |
| US10566146B2 (en) | 2016-10-14 | 2020-02-18 | Tokin Corporation | Electric double-layer capacitor including a terminal having a protruding portion in an exterior body thereof |