JPS61144648U - - Google Patents
Info
- Publication number
- JPS61144648U JPS61144648U JP2815485U JP2815485U JPS61144648U JP S61144648 U JPS61144648 U JP S61144648U JP 2815485 U JP2815485 U JP 2815485U JP 2815485 U JP2815485 U JP 2815485U JP S61144648 U JPS61144648 U JP S61144648U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- flush
- semiconductor wafer
- ring
- dicer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Description
第１図は本考案の実施例を示す側断面図、第２
図はダイシング装置の従来例を示す側断面図であ
る。
１……半導体ウエハ、２……シート、４……リ
ング、５……ダイサ、６……支持台。
Fig. 1 is a side sectional view showing an embodiment of the present invention;
The figure is a side sectional view showing a conventional example of a dicing device. 1... Semiconductor wafer, 2... Sheet, 4... Ring, 5... Dicer, 6... Support stand.
Claims (1)
グを同心的かつ面一に粘着したシートをウエハ部
分とリング部分とが面一になるように支持する支
持台と、支持台上でリングを跨ぎかつウエハをス
ルーカツトして往復動するダイサを具備したこと
を特徴とするウエハのダイシング装置。 A support stand that supports a semiconductor wafer and a sheet concentrically and flush-adhered with a ring having a diameter larger than the semiconductor wafer so that the wafer part and the ring part are flush with each other; A wafer dicing device characterized by being equipped with a dicer that cuts through and reciprocates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2815485U JPS61144648U (en) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2815485U JPS61144648U (en) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144648U true JPS61144648U (en) | 1986-09-06 |
Family
ID=30525774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2815485U Pending JPS61144648U (en) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144648U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56126937A (en) * | 1980-03-11 | 1981-10-05 | Toshiba Corp | Cutting apparatus for semiconductor wafer |
| JPS59219376A (en) * | 1983-05-27 | 1984-12-10 | Hitachi Hokkai Semiconductor Kk | Adhesive tape for wafer |
-
1985
- 1985-02-27 JP JP2815485U patent/JPS61144648U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56126937A (en) * | 1980-03-11 | 1981-10-05 | Toshiba Corp | Cutting apparatus for semiconductor wafer |
| JPS59219376A (en) * | 1983-05-27 | 1984-12-10 | Hitachi Hokkai Semiconductor Kk | Adhesive tape for wafer |