JPS61204710U - - Google Patents
Info
- Publication number
- JPS61204710U JPS61204710U JP8804085U JP8804085U JPS61204710U JP S61204710 U JPS61204710 U JP S61204710U JP 8804085 U JP8804085 U JP 8804085U JP 8804085 U JP8804085 U JP 8804085U JP S61204710 U JPS61204710 U JP S61204710U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- ring
- attaching
- adhesive tape
- circumference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 2
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の一実施例による半導体ウエハ
貼付用リングの外観図で第２図は本考案の一実施
例による半導体ウエハ貼付用リングによる切断部
の断面図である。第３図は従来構造による半導体
ウエハ貼付用リングによる切断部の断面図である
。
１，５……半導体ウエハ貼付用リング、２……
窪み部、３……粘着テープ、４……カツタ。
FIG. 1 is an external view of a ring for attaching a semiconductor wafer according to an embodiment of the present invention, and FIG. 2 is a sectional view of a cut portion of the ring for attaching a semiconductor wafer according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a cut portion by a semiconductor wafer attachment ring according to a conventional structure. 1, 5...Semiconductor wafer attachment ring, 2...
Hollow portion, 3...Adhesive tape, 4...Katsuta.
Claims (1)
導体ウエハ貼付用リングにおいて、該貼付用リン
グの円周上に窪みを設けたことを特徴とする半導
体ウエハ貼付用リング。 A ring for attaching a semiconductor wafer to which a semiconductor wafer is attached using an adhesive tape, characterized in that a recess is provided on the circumference of the ring for attaching a semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8804085U JPS61204710U (en) | 1985-06-11 | 1985-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8804085U JPS61204710U (en) | 1985-06-11 | 1985-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61204710U true JPS61204710U (en) | 1986-12-24 |
Family
ID=30640806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8804085U Pending JPS61204710U (en) | 1985-06-11 | 1985-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61204710U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010177566A (en) * | 2009-01-30 | 2010-08-12 | Disco Abrasive Syst Ltd | Annular frame for supporting work and work transfer method |
| JP2012178471A (en) * | 2011-02-25 | 2012-09-13 | Lintec Corp | Sheet pasting apparatus and pasting method |
-
1985
- 1985-06-11 JP JP8804085U patent/JPS61204710U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010177566A (en) * | 2009-01-30 | 2010-08-12 | Disco Abrasive Syst Ltd | Annular frame for supporting work and work transfer method |
| JP2012178471A (en) * | 2011-02-25 | 2012-09-13 | Lintec Corp | Sheet pasting apparatus and pasting method |