JPS61144648U - - Google Patents

Info

Publication number
JPS61144648U
JPS61144648U JP2815485U JP2815485U JPS61144648U JP S61144648 U JPS61144648 U JP S61144648U JP 2815485 U JP2815485 U JP 2815485U JP 2815485 U JP2815485 U JP 2815485U JP S61144648 U JPS61144648 U JP S61144648U
Authority
JP
Japan
Prior art keywords
wafer
flush
semiconductor wafer
ring
dicer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2815485U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2815485U priority Critical patent/JPS61144648U/ja
Publication of JPS61144648U publication Critical patent/JPS61144648U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP2815485U 1985-02-27 1985-02-27 Pending JPS61144648U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2815485U JPS61144648U (cs) 1985-02-27 1985-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2815485U JPS61144648U (cs) 1985-02-27 1985-02-27

Publications (1)

Publication Number Publication Date
JPS61144648U true JPS61144648U (cs) 1986-09-06

Family

ID=30525774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2815485U Pending JPS61144648U (cs) 1985-02-27 1985-02-27

Country Status (1)

Country Link
JP (1) JPS61144648U (cs)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126937A (en) * 1980-03-11 1981-10-05 Toshiba Corp Cutting apparatus for semiconductor wafer
JPS59219376A (ja) * 1983-05-27 1984-12-10 Hitachi Hokkai Semiconductor Kk ウエハ粘着テ−プ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126937A (en) * 1980-03-11 1981-10-05 Toshiba Corp Cutting apparatus for semiconductor wafer
JPS59219376A (ja) * 1983-05-27 1984-12-10 Hitachi Hokkai Semiconductor Kk ウエハ粘着テ−プ

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