JPS61142446U - - Google Patents
Info
- Publication number
- JPS61142446U JPS61142446U JP1985025143U JP2514385U JPS61142446U JP S61142446 U JPS61142446 U JP S61142446U JP 1985025143 U JP1985025143 U JP 1985025143U JP 2514385 U JP2514385 U JP 2514385U JP S61142446 U JPS61142446 U JP S61142446U
- Authority
- JP
- Japan
- Prior art keywords
- container
- semiconductor device
- organic
- bonded
- melt adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
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- H10W70/682—
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- H10W72/07353—
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- H10W72/321—
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- H10W72/334—
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- H10W72/931—
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- H10W90/734—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985025143U JPS61142446U (enExample) | 1985-02-23 | 1985-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985025143U JPS61142446U (enExample) | 1985-02-23 | 1985-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61142446U true JPS61142446U (enExample) | 1986-09-03 |
Family
ID=30519954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985025143U Pending JPS61142446U (enExample) | 1985-02-23 | 1985-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61142446U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281739A (ja) * | 1989-04-24 | 1990-11-19 | Fujitsu Ltd | 半導体装置 |
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1985
- 1985-02-23 JP JP1985025143U patent/JPS61142446U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281739A (ja) * | 1989-04-24 | 1990-11-19 | Fujitsu Ltd | 半導体装置 |