JPS61141204A - Manufacture of waveguide - Google Patents

Abstract

PURPOSE:To use silver for a conductor layer by eliminating a nickel plating layer and a copper plating layer without using an acid in the core bar melting metallic face transfer method. CONSTITUTION:An aluminum or aluminum alloy made matrix 1 applied sequentially with nickel plating 2 and copper plating 3 is used as a core bar. After silver plating 4 is applied to the core bar, a fiber reinforced plastic 5 is formed to be bonded with the silver plating layer 4. Then the matrix 1 is molten and removed by using alkali and the nickel plating layer 2 exposed to the inner face is removed by immersing the layer into a copper sulfate water solution and replacing the silver with copper. Then the copper deposited on the inner face and the copper of the copper plating layer 3 at the outside are being oxidized, and they are solved as ammonium complex ions. Through the processes above, silver having a small electric resistance is used for the conductor layer.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a fiber-reinforced plastic waveguide using silver as the conductive layer metal on the inner surface of the tube.

(Conventional technology 1 As a manufacturing method for fiber-reinforced plastic waveguides, a meltable material is used as a matrix, the matrix is used as a core metal, and the metal that will become the conductive layer of the waveguide is plated, and the metal is bonded to the conductive layer.) There is a method of melting and removing the mandrel after molding the fiber-reinforced plastic in such a manner (mandrel melting/metal surface transfer method 1).

Traditionally, this type of method has used aluminum or an aluminum alloy as the meltable host material and gold as the conductive layer metal. However, since it is difficult to directly plate an aluminum or aluminum alloy mother die, generally, nickel plating is first performed, then copper plating is applied, and then gold plating is applied on top of that. In addition, the mother mold nickel plating layer and steel plating layer can be removed by dissolving with acid, or by dissolving and removing the mother mold with alkali, and then dissolving the nickel plating layer and copper plating layer with acid such as nitric acid. It was by After most of the nickel plating layer was dissolved and removed, the remaining steel plating layer was sometimes dissolved with an acidic etching solution mainly composed of ferric chloride. ) - 10,000 Since the transmission loss of a waveguide decreases as the electrical resistance of the conductive layer decreases, silver is more desirable than gold as the metal for the conductive layer.

However, since silver is attacked by rII for dissolving the nickel plating layer and the copper plating layer (and the etching solution mentioned above), the conventional method has the disadvantage that it cannot be used as a metal for the conductive layer.

(Problems to be Solved by the Invention) An object of the present invention is to make it possible to use silver, which has a low electrical resistance, which cannot be used in the conductive layer in conventional waveguide manufacturing methods.

(c) Means for Solving Problems) The present invention, in the production of fiber-reinforced plastic waveguides, uses an aluminum or aluminum alloy mother die that is sequentially plated with nickel and then plated with steel as a core metal. After plating gold with silver and molding fiber-reinforced plastic to adhere to the silver plating layer, the matrix is dissolved and removed with alkali, and the nickel plating layer exposed on the inner surface is immersed in a copper nitrate aqueous solution to form steel. Dissolve and remove by replacing with.

While oxidizing the deposited copper and copper plating layer, it is dissolved and removed as ammonia complex ions.

The present invention will be explained in detail below with reference to the drawings.

The figure is a flowchart showing the manufacturing process of the present invention by changing the cross-sectional shape of a rectangular waveguide, in which 1 is a matrix, 2 is a nickel plating layer, 8 is a copper plating layer, 5 is a silver plating layer,
is fiber reinforced plastic.

Further, (a) to (b) are the following manufacturing steps.

(a) Mold manufacturing process: In order to obtain the specified dimensions when the waveguide is completed, the dimensions are determined by taking into account the thickness of the matte layer and the effects of thermal expansion and curing contraction during molding of fiber-reinforced plastic. Manufacture a mother mold with a determined value. Note that the matrix may be hollow.

tbl Nickel plating process: After the mother mold is immersed in an electroless galvanizing solution at 20 to 25°C to replace zinc - by a normal method (for example, bright nickel plating with a content of 45 to 50%)
Nickel strike plating is performed at a current density of 10 A/dm). The plating thickness is, for example, 1 to 8 μm.

(C1 copper plating process: use a normal method (for example, using neutral biroline copper plating melting, 50~60%
Copper plating is performed at a temperature of 8 A/dm (current density: 8 A/dm). The plating thickness is, for example, 2 to 10 μm.

@) Silver plating process: Silver plated on the copper plating layer using the usual method (for example, using cyan solution for bright silver plating, 25"C, m flow @ about 0.5A/am)! I will do it. The plating thickness is determined by considering the skin effect and the skin thickness difference at the transmission frequency (
8kin aepth 1 or more.

Molding process of te+m fiber-reinforced plastic A fiber-reinforced plastic is molded by a conventional method such as lamination and curing of niblipregs. Note that if you apply copper plating on the silver-plated layer in advance in the same manner as in step 10) and then oxidize the copper-plated surface and then mold the fiber-reinforced plastic, the silver-plated layer and the fiber-reinforced plastic will be strong. Glue to. Furthermore, if a primer or adhesive is applied after oxidation treatment, the adhesive strength will increase significantly.

(g) Dissolving and removing the matrix; dissolving and removing the disused matrix with alkali.

(2) Dissolving and removing the nickel plating layer: The nickel plating layer exposed on the inner surface of the tube is dissolved and removed by replacing it with copper. The replacement is performed by immersing the exposed nickel plating layer in a copper nitrate aqueous solution.

(Kan) Process of dissolving and removing deposited copper and copper metal layer:
While oxidizing the copper and copper plating layer deposited on the inner surface of the tube, it is dissolved and removed as ammonia complex ions.

In the conventional method, the (d') gold plating step is performed using a conventional gold plating method (for example, cyan gold plating melting method, 80"c%t
Both steps of dissolving and removing the nickel plating layer and dissolving and removing the h0 steel plating layer are performed with an acid such as nitric acid (or the dissolution and removal of the nickel plating layer). The removal was carried out using acid, and the remaining copper plating layer was dissolved and removed using an etching solution containing ferric chloride as the main component.However, in the present invention, dissolution and removal using acid (or alcohol and acidic liquid) Because it does not include any process!
Silver with low resistance can be used as the conductive layer.

(Example) A carbon fiber reinforced plastic waveguide conforming to EIAJ standard WR, T-260 was manufactured by the following method.

(Using aluminum, cross-sectional dimension 8.61 w
an x 4. A mother mold of an aO seagull was produced.

(b) Nickel strike plating with a thickness of 82 μm was performed on the mother M.

(C) Copper plating with a thickness of 5 μm was performed on the nickel plating layer.

, fdl g plating layer was plated with silver to a thickness of 2 to 3 μm.

+8) Copper plating with a thickness of 7 μm is performed on the silver plating layer, and after the copper plating layer is subjected to black oxidation treatment, 2 plies of carbon fiber unidirectionally reinforced epoxy resin prepreg are applied in the axial direction of the waveguide. Laminated 8 plies in the direction and 21 plies in the tube axis direction,
Heated at 18G"C for 90 minutes to cure (g) Immersed in 10% sodium hydroxide aqueous solution, 6
The matrix was dissolved and removed by heating to 0 to 70°C and stirring. □ Immersed in a 10% nitric WI#74 aqueous solution and treated for 80 minutes while applying ultrasonic waves to dissolve the nickel plating layer.
Removed. At this time, steel precipitates in place of nickel.

(b) Immersed in ammonia water to dissolve and remove the precipitated steel and steel plating layer. Part of the copper 1 had been oxidized by the previous process, but it was occasionally oxidized in the air to promote dissolution.

The transmission loss of the completed waveguide in the 8o GHz band is as shown in Table 1, and the conductive layer made by the conventional method was superior to that made of gold.

Table 1 (Effects of the Invention) As explained above, the waveguide manufacturing method of the present invention includes the following steps in the waveguide manufacturing method using core metal melting and metal surface transfer.
The core metal is made by sequentially applying nickel plating and steel plating to an aluminum or aluminum alloy mother die.The core metal is silver plated, and fiber-reinforced plastic is molded to adhere to this silver plating layer. After that, the mother mold is melted and removed, and the nickel in the nickel plating layer exposed on the inner surface is replaced with copper. Since this is a method of dissolving and removing ions, silver, which has a lower electrical resistance than gold, can be used instead of gold as the metal for the conductive layer, which has the advantage of reducing transmission loss.

[Brief explanation of the drawing]

Figures (a) to (h) are flowcharts showing the manufacturing process of the present invention by changing the cross-sectional shape of a rectangular waveguide. (a)...Mother mold manufacturing process (1))...Nickel plating process (C)...Copper plating process (d)...
・Silver plating process (e)...Fiber-reinforced plastic molding process]...Mother mold melting/removal process Cg)...Nickel plating layer melting/removal process (h)
...Dissolving and removing deposited copper and copper plating layer 1
...Material mold 2...Nickel plating layer 8
...Copper plating layer...Silver plating layer 5...
fiber reinforced plastic

Claims (1)

[Scope of Claims] 1. In the production of fiber-reinforced plastic waveguides by the core melting/metal surface transfer method, as a production method in which the conductive layer metal on the inner surface of the tube is silver, (1) a matrix made of aluminum or aluminum alloy; In the mold
A core metal is made by sequentially applying nickel plating and copper plating. (2) After silver plating is applied to the core metal, fiber-reinforced plastic is molded to adhere to the silver plating layer. (3) The aluminum or aluminum alloy master mold is dissolved and removed with an alkali, (4) the nickel plating layer exposed on the inner surface is removed by immersing it in a copper nitrate aqueous solution and replaced with copper, and (5) the inner surface is coated with copper. A method for manufacturing a waveguide, comprising the steps of oxidizing the deposited copper and the copper in the outer copper plating layer, and dissolving and removing it as ammonia complex ions.