JPS5946771B2 - Molding and electrodeposition method for fiber-reinforced plastic composites - Google Patents

Molding and electrodeposition method for fiber-reinforced plastic composites

Info

Publication number
JPS5946771B2
JPS5946771B2 JP55110648A JP11064880A JPS5946771B2 JP S5946771 B2 JPS5946771 B2 JP S5946771B2 JP 55110648 A JP55110648 A JP 55110648A JP 11064880 A JP11064880 A JP 11064880A JP S5946771 B2 JPS5946771 B2 JP S5946771B2
Authority
JP
Japan
Prior art keywords
fiber
reinforced plastic
mandrel
molding
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55110648A
Other languages
Japanese (ja)
Other versions
JPS5734919A (en
Inventor
康弘 岡村
義憲 高倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55110648A priority Critical patent/JPS5946771B2/en
Publication of JPS5734919A publication Critical patent/JPS5734919A/en
Publication of JPS5946771B2 publication Critical patent/JPS5946771B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Moulding By Coating Moulds (AREA)
  • Chemically Coating (AREA)

Description

【発明の詳細な説明】 この発明は繊維強化型プラスチック複合材の成形と、そ
の成形物への電着の方法に係り、さらに詳しくは、所要
形状の心金に所要の厚さの熱硬化性樹脂を塗布し、密着
良好なめつき膜を得やすくした繊維強化型プラスチック
複合材の成形方法とその成形物へのめつき方法を提案す
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for molding a fiber-reinforced plastic composite material and electrodepositing it onto the molded product, and more specifically, it relates to a method of forming a fiber-reinforced plastic composite material and electrodepositing it onto the molded product, and more particularly, it relates to a method of forming a thermosetting material of a desired thickness onto a mandrel of a desired shape. This paper proposes a method for molding a fiber-reinforced plastic composite material coated with a resin to make it easier to obtain a plated film with good adhesion, and a method for plating the molded product.

従来のこの種の成形方法と電着の方法には所要形状のカ
ーボン系又はホウ素早又はシリカ系の繊維強化型プラス
チックス製の成形物を作成し、蒸着、溶射、導電性塗布
、電気めつき等を行つていた。これらの方法では、密着
の良好な導電性膜を得ることはむずかしく、しかも形状
が複雑な成形物では技術的にできない。この発明はめつ
き膜の密着性の向上を目的とし、繊維強化型プラスチッ
ク複合材の成形時に所要膜厚の熱硬化性樹脂層を表層に
設け、めつき層との接触面積を増すことによつてめつき
膜との密着力(2に9/C7TL)の改善を図るもので
ある。
Conventional molding methods and electrodeposition methods involve creating a molded product made of carbon-based, boron-based or silica-based fiber-reinforced plastic in the desired shape, and then applying vapor deposition, thermal spraying, conductive coating, or electroplating. etc. With these methods, it is difficult to obtain a conductive film with good adhesion, and moreover, it is technically impossible to obtain a molded product with a complicated shape. The purpose of this invention is to improve the adhesion of the plating film, and by providing a thermosetting resin layer with a required thickness on the surface layer during molding of a fiber-reinforced plastic composite material and increasing the contact area with the plating layer. This aims to improve the adhesion (2 to 9/C7TL) with the plating film.

以下、図によつてこの発明の実施例を説明する。第1図
aはこの発明によつて製造された円筒状の導波管を示す
もので1は筒状の心金、2は心金1を溶解又は除去する
ことによつて得られる繊維強化型プラスチック複合材で
強化された導波管である。第1図bは第1図a(1)A
−A’面の断面を示す図であり、上記導波管2の内面に
無電解金めつき7を無電解銀めつき6の変色防止のため
に銀の電導性を損わない程度に薄く施し、導波管の良電
導性を得るために、無電解銀めつき6と無電解銅めつき
5を施している。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1a shows a cylindrical waveguide manufactured according to the present invention, in which 1 is a cylindrical core, and 2 is a fiber-reinforced type obtained by melting or removing the core 1. It is a waveguide reinforced with plastic composite material. Figure 1b is Figure 1a(1)A
- It is a diagram showing a cross section of the A' plane, and the electroless gold plating 7 is applied to the inner surface of the waveguide 2 to prevent discoloration of the electroless silver plating 6, so that it is thin enough not to impair the conductivity of the silver. In order to obtain good conductivity of the waveguide, electroless silver plating 6 and electroless copper plating 5 are applied.

第2図は製造工程を示す図であり、上記心金1に繊維強
化型複合材3を積層成形硬化する前に熱硬化性樹脂4を
所要膜厚塗布することによつて、従来最高で7009/
(V7!のめつき膜の密着強度しか得られなかつたのを
2に9/儂のめつき膜の密着強度を得られるようにして
いる。
FIG. 2 is a diagram showing the manufacturing process. By applying the thermosetting resin 4 to the required thickness before laminating and curing the fiber-reinforced composite material 3 on the mandrel 1, it is possible to achieve /
(While I could only obtain the adhesion strength of the plated film of V7!, I have made it possible to obtain the adhesion strength of 2/9/my plated film.

そして、導波管の強度を得るためと軽量化のために繊維
強化型複合材3を積層成形硬化しているのである。なお
、この発明による実施例を上げると次のとおりである。
The fiber-reinforced composite material 3 is then laminated and cured to increase the strength of the waveguide and to reduce its weight. Examples of the present invention are as follows.

〔実施例〕〔Example〕

以上のように、この発明によると、いかなる形状のもの
でも浸漬するだけでめつきが可能であるので、特にむず
かしい技術を必要としない。
As described above, according to the present invention, any shape can be plated simply by dipping it, so no particularly difficult techniques are required.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aはこの発明によつて製作された導波管を示す図
、第1図bは第1図AO)A−N線断面図、第2図は導
波管の製造工程を示す図である。
Fig. 1a is a diagram showing a waveguide manufactured according to the present invention, Fig. 1b is a cross-sectional view taken along the line AO) AN in Fig. 1, and Fig. 2 is a diagram showing the manufacturing process of the waveguide. It is.

Claims (1)

【特許請求の範囲】[Claims] 1 所要形状の心金に所要の脱脂を行い、上記処理を施
した心金に所要の厚さの熱硬化性樹脂を塗布した後、上
記心金にカーボン系又はホウ素系あるいはシリカ系の繊
維強化型プラスチックスを積層成形硬化させ、上記心金
を溶解するか又は除去したのち、所要形状にめつき面を
レジンリッチとした繊維強化型プラスチック複合材の成
形物を得、上記成形物を所要の脱脂を行い、硫酸−クロ
ム酸混合液によるエッチング、活性化処理した後、上記
処理を施した成形物に無電解銅めつき、無電解銀めつき
および無電解金めつきを施すことを特徴とする繊維強化
型プラスチック複合材の成形ならびに電着方法。
1 After performing the required degreasing on the mandrel of the desired shape and applying a thermosetting resin of the required thickness to the mandrel that has undergone the above treatment, the mandrel is reinforced with carbon-based, boron-based, or silica-based fibers. After curing the mold plastics and melting or removing the mandrel, a fiber-reinforced plastic composite molded product with a resin-rich plating surface is obtained in the desired shape, and the molded material is molded into the desired shape. After degreasing, etching with a sulfuric acid-chromic acid mixture, and activation treatment, the molded product subjected to the above treatment is subjected to electroless copper plating, electroless silver plating, and electroless gold plating. Molding and electrodeposition methods for fiber-reinforced plastic composites.
JP55110648A 1980-08-12 1980-08-12 Molding and electrodeposition method for fiber-reinforced plastic composites Expired JPS5946771B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55110648A JPS5946771B2 (en) 1980-08-12 1980-08-12 Molding and electrodeposition method for fiber-reinforced plastic composites

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55110648A JPS5946771B2 (en) 1980-08-12 1980-08-12 Molding and electrodeposition method for fiber-reinforced plastic composites

Publications (2)

Publication Number Publication Date
JPS5734919A JPS5734919A (en) 1982-02-25
JPS5946771B2 true JPS5946771B2 (en) 1984-11-14

Family

ID=14541003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55110648A Expired JPS5946771B2 (en) 1980-08-12 1980-08-12 Molding and electrodeposition method for fiber-reinforced plastic composites

Country Status (1)

Country Link
JP (1) JPS5946771B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160270U (en) * 1984-04-03 1985-10-24 ミサワホ−ム株式会社 Assembly type small carrier
JPH0434211U (en) * 1990-07-18 1992-03-23
KR20180132526A (en) * 2017-06-02 2018-12-12 에이에스엠 아이피 홀딩 비.브이. Methods for forming low temperature semiconductor layers and related semiconductor device structures

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0759329B1 (en) * 1995-07-26 2006-03-08 Hughes Electronics Corporation Cyanate ester films that promote plating adhesion to cyanate ester graphite composites
CN103674634B (en) * 2012-09-17 2016-03-23 中航惠腾风电设备股份有限公司 A kind of apparatus and method of accurate making fiber reinforced plastic composite material laminate compression performance test block

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160270U (en) * 1984-04-03 1985-10-24 ミサワホ−ム株式会社 Assembly type small carrier
JPH0434211U (en) * 1990-07-18 1992-03-23
KR20180132526A (en) * 2017-06-02 2018-12-12 에이에스엠 아이피 홀딩 비.브이. Methods for forming low temperature semiconductor layers and related semiconductor device structures

Also Published As

Publication number Publication date
JPS5734919A (en) 1982-02-25

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