JPS61137736A - Laminate and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a laminate used as a substrate for a printed wiring board, and a method for manufacturing the same.

[Background technology j Conventionally, NR laminates are made by impregnating a long base material such as glass cloth or paper with a thermosetting resin varnish and drying it to create a prepreg, and then cutting this prepreg into a predetermined size. After that, it is manufactured by stacking multiple sheets of prepreg and metal foil, and heating and pressurizing them between hot platens.

However, this forming method is a so-called batch method and cannot produce laminates continuously, resulting in extremely poor production efficiency. So recently, I have been using 8 in a row without pressurization! A construction method that can remove scrap board is becoming popular.The method involves soaking a long base material in a thermosetting resin 7-varnish, sending multiple sheets of the base material overlapping each other, and then stacking the base material over the long base material. The laminated plate can be manufactured continuously by stacking metal foils of 300 mm in length while feeding them, and by heating and curing the thermosetting υ1 resin while sequentially sending the metal foils to a heat curing furnace.

However, with this kind of continuous construction method, it is difficult to add! Problems will arise due to the absence of balls. In other words, in the conventional construction method that involves pressurization, the thermosetting resin is densely filled into the base material due to pressure, but in the continuous construction method that does not involve pressure, the thermosetting resin is densely filled into the base material. Full 1! It is difficult to fill the base material with the thermosetting resin in a rough state.
In a laminated plate that is not subjected to IE, moisture is easily absorbed into the laminated plate, and the problem arises that the heat resistance (PCT characteristics) decreases after moisture absorption.

[Object of the invention] The present invention has been made in view of the above points, and can improve the heat resistance after moisture absorption of a laminate obtained by a construction method that does not involve pressurization, and can also prevent warping and deformation. The purpose of this is to prevent a decrease in reliability against thermal shock.

[Disclosure 1 of the Invention The laminate according to the present invention is a laminate formed by laminating a plurality of substrates 1 impregnated with a thermosetting resin by heating under no pressure. , is characterized in that a resin layer 5 having a thickness of 20 to 50 μm is formed on the surface of a substrate 4 on which a base material 1 is laminated, and the method for manufacturing a laminated plate according to the present invention includes: A plurality of base materials 1 impregnated with a thermosetting resin are stacked and heated under no pressure to form 91 laminates. After coating 3, the above-mentioned heating is performed under no pressure, and a resin 711 having a thickness of 20 to 50 μm is applied to the surface of the substrate 4 on which the base material 1 is coated with the HI layer.
In producing a laminate by stacking a plurality of substrates 1 impregnated with a thermosetting resin and laminating them by heating under no pressure, After overlapping the metal Tr 12 coated with thermosetting resin 3 on the inner surface on the outer surface of the base material 1, which is the outermost layer, the base material 1 is heated under no pressure, and the base material 1 becomes HtM FL.
r Resin/l with a thickness of 20 to 50 μm on the surface of the knee substrate 4
! 15 is another feature, and the present invention will be described in detail below.

A long piece of glass cloth or paper is used as the base material 1. First, the base material 1 is rolled up into a roll and then continuously rolled out, and the base material 1 is soaked in liquid heat by being immersed in an impregnating bath. Impregnate with curable resin. In the method of the present invention that does not involve pressurization, the thermosetting resin is generally an unsaturated polyester that does not emit evaporated components such as condensed water during curing. The plurality of base materials 1 impregnated with thermosetting resin in this way are continuously fed, and as shown in FIG. 1, they are passed through a squeeze roll 6 to squeeze out the excess thermosetting resin and reduce the thickness. ! ! Can be overlapped while adjusting. The stacked base materials 1 are then sent to a laminating mill, where a long metal foil 2 such as copper foil is fed out from a roll.
2 to the outermost 1f'? The outermost layer of the base material 1 is layered on the outer surface of the materials 1 and 1, but before it is sent to the laminating roll 7, the outermost layer of the base material 1 is
, 1 is coated with the same type of thermosetting resin 3 as above. The thermosetting resin 3 can be applied by applying the thermosetting resin 3 that has been exposed to light Tf4 onto the vat 8 onto the outer surface of the base material 1 using the application roller 9. At this time, the overall thickness will increase due to the application of the thermosetting resin 3, but the above-mentioned scoop; c.

-- By adjusting the thickness using the rule 6, this increase in thickness can be absorbed, and a laminate with the same thickness as before can be manufactured. Then, the laminate in which a plurality of base materials 1 and metal foils 2 are laminated as described above is continuously sent to a heat curing furnace 10, where the thermosetting resin is heat cured. Hardenability υ
(Depending on the fat, multiple base materials 1, 1... and ' belong to M2,
2 are laminated together. The laminate is continuously discharged from the JII thermosetting furnace 10 and cut into predetermined dimensions using a cutting fill, and is then processed into ir, p, which will become a printed wiring board substrate.
This is how an A-clad laminate is obtained. Obtained in this way 4
In the case of ctWi board eight, multiple base materials l are used as shown in FIGS. 2 and 3.

Resin layers 5, 5 made of thermosetting resin 3 are formed on the outer surface of the substrate 4 on which the metal rri2 is laminated, and the metal rri2 is bonded to the substrate 4 via this resin layer 5.

The resin N5 prevents or reduces the absorption of moisture into the laminate A and improves the heat resistance after moisture absorption (PCTN properties), but! (The thickness of fat N5 is 20~150μ
It is set as a sentinel. If the thickness is less than 20 μm, the prevention of moisture absorption will not be sufficient and the improvement of PCT properties will be insufficient, and if the thickness exceeds 150 μm, the H1 layer plate A
This results in large warping deformation and lower reliability against sliding thermal shock, so the thickness needs to be set to 20 to 150 μm.

FIG. 4 shows another method for manufacturing a laminate, in which a thermosetting resin 3 is applied to the inner surface of metal foil 2 that is continuously unwound, and the metal M2 is placed in a drying oven 11. The thermosetting resin 3 is dried by passing it through the metal M2, and the rest is manufactured in the same manner as in FIG. This is what I did.

The invention will now be illustrated by examples.

1 ・3, 1.2 As a thermosetting resin composition, 100 parts by weight of unsaturated bori ester (Takegbo Rimar 6320F) and an initiator (
Using a mixture of 1 part by weight of benzoyl peroxide (BPO) and 20 parts by weight of a filler (hydrated alumina),
In addition, using Lacrosse and 2 Spaper as base materials, and using W4ta with a thickness of 18μ, we made a laminate with a thickness of 1.6011+* using the method shown in Figure 1! ! I left it behind. The temperature of the heating curing furnace was 160°C at the highest and 60'C at the lowest.

Here, the thickness of the resin layer is set to 28 μm as Example 1, and below, the thickness of 67 μm is Example 2. The thickness of 67 μm is Example 3. The thickness of 3 μm is Example 3. The thickness of 17 μm is Comparative Example 1.152
The μ- type was used as Comparative Example 2, and the PCT characteristics, warping deformation, and reliability of these were measured. The results are shown in the following table. In the following table, the p c 'r test was performed by treating a 50 x 501 test piece with the copper foil removed in saturated steam at 133°C (2 Kg/c pupil 2) for a predetermined period of time. After cooling this 2
This was done by immersing the substrate in a solder bath at 60° C. for 20 seconds and observing whether blistering occurred between the substrates, and the evaluation was made based on the minimum processing time in saturated steam at which blistering occurred. Further, the warpage was measured by supporting three end portions of a 1×1 sample and measuring the lifting dimension of the other point that lifted the most. Further reliability testing was conducted by thermal shock testing, in which the sample was immersed in oil at 260°C for 10 seconds, then immersed in water at room temperature for 1 hour.
Immerse for 0 seconds, then soak in trichlorethylene at room temperature for 1 second.
One cycle is immersion for 0 seconds, and by measuring the number of cycles until disconnection occurs in a circuit formed by etching on copper foil, the results shown in the table are as follows: Example 1 of 133μm
．． It is confirmed that the sample No. 2.3 has excellent post-wicking heat resistance (PCT) and no major warping. On the other hand, in Comparative Example 1 where the thickness of the resin layer was 17μ, there was a problem with PCT, and the thickness of the resin layer was 152μ.
Comparative Example 2 of m has large warping deformation and low reliability against thermal shock.

I Effect of the Invention 1 As described above, the present invention solves the problem that the resin layer with a thickness of 20 to 150 μm formed on the surface of the substrate causes large warping deformation and reduces reliability against thermal shock. It is possible to prevent moisture from being absorbed into the laminate in the oil layer and improve the heat resistance after absorption6.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of an apparatus used in one method of the present invention. @ Figure 2 is an enlarged cross-sectional view of a part of the laminate according to the present invention, Figure 3 is an enlarged exploded view of a part of the 81-layer board same as above, and Figure 4
The figure is a schematic diagram of an apparatus used in another method of the same. 1 is a base material, 2 is a metal tube, 3 is a thermosetting If resin, 4 is a substrate, and 5 is a grease layer.

Claims (3)

[Claims] (1) A laminate formed by laminating a plurality of substrates impregnated with a thermosetting resin by heating under no pressure, the surface of the substrate on which the substrates are laminated has a thickness of 20 to 20 mm. 50
A laminate board characterized by being formed with a resin layer of μm. (2) When producing a laminate by stacking multiple base materials impregnated with thermosetting resin and laminating them by heating them under no pressure, the outer surface of the outermost base material is coated with thermosetting resin. After coating, the above-mentioned heating is performed under no pressure, and the surface of the substrate on which the base material is laminated is coated with a thickness of 20 to 50 μm.
A method for manufacturing a laminate, comprising forming a resin layer of m. (3) When producing a laminate by stacking multiple base materials impregnated with thermosetting resin and heating them under no pressure, heat is applied to the inner surface of the outermost base material. Lamination characterized by stacking metal foil coated with a curable resin and then heating under no pressure as described above to form a resin layer with a thickness of 20 to 50 μm on the surface of the substrate on which the base material is laminated. Method of manufacturing the board.