JPS61134093U - - Google Patents

Info

Publication number
JPS61134093U
JPS61134093U JP1747085U JP1747085U JPS61134093U JP S61134093 U JPS61134093 U JP S61134093U JP 1747085 U JP1747085 U JP 1747085U JP 1747085 U JP1747085 U JP 1747085U JP S61134093 U JPS61134093 U JP S61134093U
Authority
JP
Japan
Prior art keywords
high frequency
circuit board
frequency device
circuit components
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1747085U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1747085U priority Critical patent/JPS61134093U/ja
Publication of JPS61134093U publication Critical patent/JPS61134093U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Receivers (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本考案の一実施例を示す平
面図及びA―A線に沿う断面図、第3図及び第4
図は第1図におけるプリント配線体の等価的部品
配置関係を示す概略平面図、及びプリント配線体
洗浄装置の概略側断面図である。第5図及び第6
図は従来の高周波装置の平面図及びB―B線に沿
う断面図、第7図は第5図におけるプリント配線
体の等価的部品配置関係を示す概略平面図である
。 11……プリント配線体、12……プリント基
板、13,14……回路部品、13a,14a…
…調整部品、15……シールドケース。
1 and 2 are a plan view and a sectional view taken along the line A--A of an embodiment of the present invention, and FIGS. 3 and 4 are
The figure is a schematic plan view showing an equivalent component arrangement relationship of the printed wiring body in FIG. 1, and a schematic side sectional view of the printed wiring body cleaning apparatus. Figures 5 and 6
The figures are a plan view and a sectional view taken along line BB of a conventional high-frequency device, and FIG. 7 is a schematic plan view showing an equivalent component arrangement of the printed wiring body in FIG. 5. 11...Printed wiring body, 12...Printed circuit board, 13, 14...Circuit components, 13a, 14a...
...Adjustment parts, 15...Shield case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に複数個の可動部付調整回路部品
が組付けられたプリント配線体を、シールドケー
ス内に収納した高周波装置において、前記調整回
路部品を前記プリント基板の一端側の特定区域に
集合配置したことを特徴とする高周波装置。
In a high frequency device in which a printed wiring body in which a plurality of adjustment circuit components with movable parts are assembled to a printed circuit board is housed in a shield case, the adjustment circuit components are arranged collectively in a specific area on one end side of the printed circuit board. A high frequency device characterized by:
JP1747085U 1985-02-08 1985-02-08 Pending JPS61134093U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1747085U JPS61134093U (en) 1985-02-08 1985-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1747085U JPS61134093U (en) 1985-02-08 1985-02-08

Publications (1)

Publication Number Publication Date
JPS61134093U true JPS61134093U (en) 1986-08-21

Family

ID=30505202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1747085U Pending JPS61134093U (en) 1985-02-08 1985-02-08

Country Status (1)

Country Link
JP (1) JPS61134093U (en)

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