JPS61134073U - - Google Patents
Info
- Publication number
- JPS61134073U JPS61134073U JP178685U JP178685U JPS61134073U JP S61134073 U JPS61134073 U JP S61134073U JP 178685 U JP178685 U JP 178685U JP 178685 U JP178685 U JP 178685U JP S61134073 U JPS61134073 U JP S61134073U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- circuit board
- printed circuit
- view
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP178685U JPS61134073U (tr) | 1985-01-12 | 1985-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP178685U JPS61134073U (tr) | 1985-01-12 | 1985-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61134073U true JPS61134073U (tr) | 1986-08-21 |
Family
ID=30474849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP178685U Pending JPS61134073U (tr) | 1985-01-12 | 1985-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134073U (tr) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58216493A (ja) * | 1982-06-09 | 1983-12-16 | 株式会社フジクラ | プリント回路用積層基板およびこの積層基板を使用したフレキシブル電気回路板の製造方法 |
-
1985
- 1985-01-12 JP JP178685U patent/JPS61134073U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58216493A (ja) * | 1982-06-09 | 1983-12-16 | 株式会社フジクラ | プリント回路用積層基板およびこの積層基板を使用したフレキシブル電気回路板の製造方法 |