JPS61134073U - - Google Patents
Info
- Publication number
- JPS61134073U JPS61134073U JP178685U JP178685U JPS61134073U JP S61134073 U JPS61134073 U JP S61134073U JP 178685 U JP178685 U JP 178685U JP 178685 U JP178685 U JP 178685U JP S61134073 U JPS61134073 U JP S61134073U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- circuit board
- printed circuit
- view
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例にかかるプリント基板
の斜視図、第２図ａはプリント基板折り曲げ前の
溝の状態を示す図、第２図ｂは第１図のＡ―Ａ断
面図であつて、スルーホールの部分拡大断面図、
第３図は本考案にかかるプリント基板の使用状態
を示す側面図、第４図ａ，ｂは溝の形状を示す図
、第５図は反対側に折り曲げた実施例を示す図、
第６図は従来のプリント基板の使用状態を示す側
面図である。
１……プリント基板、１１，１２……溝、２…
…プリント配線パターン、３……液晶パネル、４
……スルーホール、Ａ……表示部、Ｂ……段差部
、Ｃ……操作部。
FIG. 1 is a perspective view of a printed circuit board according to an embodiment of the present invention, FIG. 2 a is a diagram showing the state of the groove before bending the printed circuit board, and FIG. 2 b is a cross-sectional view taken along line AA in FIG. 1. , a partial enlarged cross-sectional view of the through hole,
FIG. 3 is a side view showing how the printed circuit board according to the present invention is used, FIGS. 4a and 4b are views showing the shape of the grooves, and FIG. 5 is a view showing an embodiment bent to the opposite side.
FIG. 6 is a side view showing a conventional printed circuit board in use. 1...Printed circuit board, 11, 12...groove, 2...
...Printed wiring pattern, 3...Liquid crystal panel, 4
...Through hole, A...Display part, B...Step part, C...Operation part.
Claims (1)
に設けられ、前記溝によつて分割された領域のそ
れぞれ所定個所同志を電気的に接続するためのプ
リント配線パターンとを備え、該溝に沿つて折り
曲げ可能にされたことを特徴とするプリント基板
。 a linear groove formed on one surface; and a printed wiring pattern provided on the other surface for electrically connecting predetermined portions of the regions divided by the groove; A printed circuit board characterized by being bendable along a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP178685U JPS61134073U (en) | 1985-01-12 | 1985-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP178685U JPS61134073U (en) | 1985-01-12 | 1985-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61134073U true JPS61134073U (en) | 1986-08-21 |
Family
ID=30474849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP178685U Pending JPS61134073U (en) | 1985-01-12 | 1985-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134073U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58216493A (en) * | 1982-06-09 | 1983-12-16 | 株式会社フジクラ | Laminated substrate for printed circuit and method of producing flexible electric circuit board using same laminated substrate |
-
1985
- 1985-01-12 JP JP178685U patent/JPS61134073U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58216493A (en) * | 1982-06-09 | 1983-12-16 | 株式会社フジクラ | Laminated substrate for printed circuit and method of producing flexible electric circuit board using same laminated substrate |
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