JPS61133674A - Solar battery module - Google Patents
Solar battery moduleInfo
- Publication number
- JPS61133674A JPS61133674A JP59255945A JP25594584A JPS61133674A JP S61133674 A JPS61133674 A JP S61133674A JP 59255945 A JP59255945 A JP 59255945A JP 25594584 A JP25594584 A JP 25594584A JP S61133674 A JPS61133674 A JP S61133674A
- Authority
- JP
- Japan
- Prior art keywords
- resin plate
- sealing resin
- plate
- module assembly
- element sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 230000002093 peripheral effect Effects 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 abstract 2
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は太陽電池モジュールに関するものである。[Detailed description of the invention] [Industrial application field] This invention relates to a solar cell module.
第２図は従来の太陽電池モジュールで実開昭５９−１８
４５０号公報参照）の一部を示す切断端面図であるＯ
図において、（１）は両生面の周縁部にそれぞれ全周に
わたって形成された電極（１ａ）および電極（ｌｂ）を
有し太陽光の照射によって電１ｆＭ （ｌｈ）、（ｌｂ
）間に電圧が発生する複数個の半導体素子、（２）は幅
が３ｍｍ程度で厚さが５０／１ｍ程度である銅箔からな
シ複数個の半導体素子（１）を直列に接続する素子接続
条帯、（３）は透明な樹脂からなシ素子接続条帯（２）
によって直列に接続された複数個の半導体素子（１）を
内部に収容して気密封止した素子封止樹脂板、（４）は
素子封止樹脂板（３）の表面上に接着されたガラス板、
（５）は両面に樹脂シート（６）がラミネートされて気
密性を有し素子封圧樹脂板（３）の裏面上に接着された
気密性金属薄板、（７）は素子封止樹脂板（３）とガラ
ス板（４）と気密性金属薄板（５）とで構成されたモジ
ニール組立体、（８）は弾性を有する樹脂からなシモジ
ュール組立体（７）の端面とその気密性金属薄板（５）
側の裏面の周縁部とを覆うことができるような形状に成
形され接着剤（９）によってモジュール組立体（７）の
端面およびその気密性金属薄板（５）側の裏面の周縁部
に接着されモジュール組立体（７）の端面を保護すると
ともに気密性金属薄板（５）の端面を絶縁する端縁樹脂
板、Ｃ１１は周方向に複数個に分割することができるよ
うに構成された金属筒体からなシ内周面部に設けられた
溝（１０ａ）の内壁面に端縁樹脂板（８）の所要部分お
よびガラス板（４）の周縁の所要部分を接着剤ＯＤによ
って接着しモジュール組立体（７）を保持する金属枠で
ある。Figure 2 shows a conventional solar cell module developed in 1988.
In figure O, which is a cutaway end view showing a part of the amphibious surface (see Publication No. 450), (1) has an electrode (1a) and an electrode (lb) formed around the entire circumference of the amphibious surface, respectively. By irradiating the electric current 1fM (lh), (lb
) A plurality of semiconductor elements between which a voltage is generated, (2) is made of copper foil with a width of about 3 mm and a thickness of about 50/1 m. An element that connects a plurality of semiconductor elements (1) in series. The connecting strip (3) is the element connecting strip (2) made of transparent resin.
(4) is a glass bonded onto the surface of the element-sealing resin plate (3), in which a plurality of semiconductor elements (1) connected in series are housed and hermetically sealed. board,
(5) is an airtight thin metal plate with resin sheets (6) laminated on both sides and bonded to the back side of the element sealing resin plate (3); (7) is an element sealing resin plate ( 3), a modular assembly consisting of a glass plate (4), and an airtight thin metal plate (5), and (8) an end face of the modular assembly (7) made of elastic resin and its airtight thin metal plate. (5)
The end face of the module assembly (7) and its airtight thin metal plate (5) are molded into a shape that can cover the peripheral edge of the back side of the module assembly (7) and are adhered by adhesive (9) to the peripheral edge of the back side of the airtight thin metal plate (5). An edge resin plate C11 protects the end face of the module assembly (7) and insulates the end face of the airtight thin metal plate (5), and C11 is a metal cylinder configured so that it can be divided into a plurality of pieces in the circumferential direction. A required portion of the edge resin plate (8) and a required portion of the periphery of the glass plate (4) are adhered to the inner wall surface of the groove (10a) provided on the inner circumferential surface of the empty shell using adhesive OD to complete the module assembly ( 7) is a metal frame that holds.
従来の太陽電池モジュールでは、上記のように構成され
ているので、弾性を有する端縁樹脂板（８）Ｋよって、
モジュール組立体（７）の溝（１０ａ）内への挿入時の
ガラス板（４）の破損を防止することができるとともＫ
ＩＸ密性金属薄板（５）と金属枠ａ０との短絡を防止す
ることができる。しかも、素子封止樹脂板（３）の表面
上および裏面上にそれぞれガラス板（４）および気密性
金属薄板（５）が接着されているので、素子封止樹脂板
（３）は表面および裏面から外部雰囲気によって影響さ
れることがない。Since the conventional solar cell module is configured as described above, the edge resin plate (8) K having elasticity
It is possible to prevent damage to the glass plate (4) when inserting the module assembly (7) into the groove (10a).
A short circuit between the IX dense metal thin plate (5) and the metal frame a0 can be prevented. Moreover, since the glass plate (4) and the airtight thin metal plate (5) are adhered to the front and back surfaces of the element sealing resin plate (3), respectively, the element sealing resin plate (3) can be attached to the front and back sides. It is not affected by the external atmosphere.
上記のような従来の太陽電池モジュールでは、素子封止
樹脂板（３）、端縁樹脂板（８）および接着剤（９）。The conventional solar cell module as described above includes an element sealing resin plate (3), an edge resin plate (8), and an adhesive (9).
０１）が透湿性および吸湿性があるので、外部雰囲気に
存在する水分が、端縁樹脂板（８）および接着剤（９）
。01) has moisture permeability and hygroscopicity, so moisture present in the external atmosphere can be absorbed by the edge resin plate (8) and the adhesive (9).
.
０◇を通して、素子封止樹脂板（３）の端面から内部へ
浸入する。そして、その水分によって、素子封止樹脂板
（３）の太陽光の透過率が小さくなって半導体素子（１
）の発生電圧が減少したシ、素子接続条帯（２）が腐食
されて断線したシして、太陽電池モジュールの寿命を短
かくするという問題点があった。0◇, and penetrates into the inside from the end face of the element sealing resin plate (3). Then, due to the moisture, the transmittance of sunlight through the element sealing resin plate (3) decreases, and the semiconductor element (1
), the generated voltage of the solar cell module decreased, and the element connecting strip (2) was corroded and disconnected, which shortened the life of the solar cell module.
この発明は、かかる問題点を解決するためになされたも
ので、寿命を長くすることができる太陽電池モジュール
を得ることを目的とする。The present invention was made to solve such problems, and an object of the present invention is to obtain a solar cell module that can have a longer lifespan.
この発明に係る太陽電池モジュールは、素子封止樹脂板
の周縁部の厚さをその他の部分の厚さより薄くしたもの
である。In the solar cell module according to the present invention, the peripheral edge of the element-sealing resin plate is thinner than the other parts.
この発明においては、素子封止樹脂板の周縁部の厚さが
その他の部分の厚さより薄くなっているので、素子封止
樹脂板の端面から内部へ浸入する水分が減少する。In this invention, since the thickness of the peripheral edge of the element-sealing resin plate is thinner than the thickness of other parts, moisture infiltrating into the inside of the element-sealing resin plate from the end face is reduced.
第１図はこの発明の一実施例の一部を示す切断端面図で
ある。FIG. 1 is a cutaway end view showing a part of an embodiment of the present invention.
図において、第２図の符号と同一符号は同等部分を示す
。（至）は同級部の厚さをその他の部分の厚さより薄く
した素子封止樹脂板である。In the figure, the same reference numerals as those in FIG. 2 indicate equivalent parts. (To) is an element-sealing resin plate in which the thickness of the same grade part is thinner than the thickness of other parts.
この実施例の構成は、素子封止樹脂板（７）以外は上記
従来例の構成と同様である。The structure of this embodiment is the same as that of the conventional example described above except for the element sealing resin plate (7).
この実施例では、素子封止樹脂板（１）の周縁部の厚さ
が、上記従来例の素子封止樹脂板（３）の周縁の端面部
の厚さよυ薄いので、端縁樹脂板（３）および接着剤（
９） 、 Ｑｌ）を通して素子封止樹脂板−の端面から
内部へ浸入する水分が、上記従来例の場合よシ減少する
。従って、素子封止樹脂板（至）の内部へ浸入した水分
によって、素子封止樹脂板（至）の太陽光の透過率が小
さくなって半導体素子（１）の発生電圧が減少したり、
素子接続条帯（２）が腐食されて断線したシすることが
、上記従来例の場合より少なくなるので、太陽電池モジ
ュールの寿命を上記従来例の場合よシ長くすることがで
きる。In this embodiment, the thickness of the peripheral edge of the element sealing resin plate (1) is υ thinner than the thickness of the peripheral end face of the element sealing resin plate (3) of the conventional example, so the edge resin plate ( 3) and adhesive (
9) Moisture infiltrating into the interior from the end face of the element sealing resin plate through Ql) is reduced compared to the above conventional example. Therefore, due to the moisture that has entered the inside of the element sealing resin plate (to), the transmittance of sunlight through the element sealing resin plate (to) decreases, and the voltage generated by the semiconductor element (1) decreases.
Since the possibility of the element connection strip (2) being corroded and disconnected is less than in the case of the above-mentioned conventional example, the life of the solar cell module can be made longer than in the case of the above-mentioned conventional example.
この実施例では、気密性金属薄板（５）の両生面に樹脂
シート（６）がラミネートされていたが、必ずしもその
必要はなく、気密性金属薄板のみであっても、この実施
例と同様の効果がある。In this example, the resin sheet (6) was laminated on both sides of the airtight thin metal plate (5), but this is not necessarily necessary, and even if only the airtight thin metal plate is used, the same method as in this example can be used. effective.
この発明は以上説明したとおシ、太陽光の照射によって
電圧を発生し素子接続条帯によって直列に接続された複
数個の半導体素子を内部に収容して気密封止した素子封
止樹脂板の周縁部の厚さをその他の部分より薄くしたの
で、素子封止樹脂板の端面から内部へ浸入する水分を減
少させることができる。従って、素子封止樹脂板の内部
へ浸入した水分によって、素子封止樹脂板の太陽光の透
過率が小さくなって半導体素子の発生電圧が減少したシ
、素子接続条帯が腐食されて断線したシすることが少な
くなるので、太陽電池モジュールの寿命を長くすること
ができる効果がある０As described above, this invention is based on the periphery of an element-sealing resin plate in which a plurality of semiconductor elements, each of which generates a voltage upon irradiation with sunlight and is connected in series by element connection strips, are housed and hermetically sealed. Since the thickness of the portion is made thinner than the other portions, it is possible to reduce moisture infiltrating into the interior from the end face of the element-sealing resin plate. Therefore, moisture that entered the inside of the element sealing resin plate reduced the transmittance of sunlight through the element sealing resin plate, reducing the voltage generated by the semiconductor element, and corroding the element connecting strips and causing wire breakage. This has the effect of extending the life of the solar cell module as there is less
第１図はこの発明の一実施例の一部を示す切断端面図、
第２図は従来の太陽電池モジュールの一部を示す切断端
面図である。
図において、（１）は半導体素子、（２）は素子接続条
帯、（４）はガラス板、（５）は気密性金属薄板、（７
）はモジュール組立体、（８）は端縁樹脂板、α１は金
属枠、（至）は素子封止樹脂板である。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a cutaway end view showing a part of an embodiment of the present invention;
FIG. 2 is a cut-away end view showing a part of a conventional solar cell module. In the figure, (1) is a semiconductor element, (2) is an element connection strip, (4) is a glass plate, (5) is an airtight metal thin plate, and (7) is a thin metal plate.
) is the module assembly, (8) is the edge resin plate, α1 is the metal frame, and (to) is the element sealing resin plate. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
によつて直列に接続された複数個の半導体素子を内部に
収容して気密封止した素子封止樹脂板と、この素子封止
樹脂板の表面上に接着されたガラス板と、上記素子封止
樹脂板の裏面上に接着された気密性金属薄板とで構成さ
れたモジュール組立体、このモジュール組立体の端面を
覆うことができるような形状に成形され接着剤によつて
上記モジュール組立体の端面に接着され弾性を有する端
縁樹脂板、並びにこの端縁樹脂板を介して上記モジュー
ル組立体を保持する金属枠を備えたものにおいて、上記
素子封止樹脂板の周縁部の厚さをその他の部分の厚さよ
り薄くしたことを特徴とする太陽電池モジュール。(1) An element-sealing resin plate in which a plurality of semiconductor elements, which generate voltage through sunlight irradiation and are connected in series by element connection strips, are housed and hermetically sealed; A module assembly composed of a glass plate adhered to the front surface of the sealing resin plate and an airtight metal thin plate adhered to the back side of the element sealing resin plate, and covering the end face of this module assembly. an elastic edge resin plate that is formed into a shape that allows the module assembly to be attached to the end surface of the module assembly using an adhesive; and a metal frame that holds the module assembly via the edge resin plate. 3. A solar cell module according to claim 1, wherein the peripheral edge of the element-sealing resin plate is thinner than other parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59255945A JPS61133674A (en) | 1984-12-03 | 1984-12-03 | Solar battery module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59255945A JPS61133674A (en) | 1984-12-03 | 1984-12-03 | Solar battery module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61133674A true JPS61133674A (en) | 1986-06-20 |
Family
ID=17285757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59255945A Pending JPS61133674A (en) | 1984-12-03 | 1984-12-03 | Solar battery module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61133674A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034323A (en) * | 1997-02-19 | 2000-03-07 | Canon Kabushiki Kaisha | Solar cell module |
| JPWO2013121549A1 (en) * | 2012-02-16 | 2015-05-11 | 三洋電機株式会社 | Solar cell module and manufacturing method thereof |
| JP2016103661A (en) * | 2016-02-19 | 2016-06-02 | パナソニックＩｐマネジメント株式会社 | Solar cell module |
-
1984
- 1984-12-03 JP JP59255945A patent/JPS61133674A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034323A (en) * | 1997-02-19 | 2000-03-07 | Canon Kabushiki Kaisha | Solar cell module |
| JPWO2013121549A1 (en) * | 2012-02-16 | 2015-05-11 | 三洋電機株式会社 | Solar cell module and manufacturing method thereof |
| EP2816611A4 (en) * | 2012-02-16 | 2015-10-07 | Sanyo Electric Co | Solar cell module and method for manufacturing same |
| US9196774B2 (en) | 2012-02-16 | 2015-11-24 | Panasonic Intellectual Property Management Co., Ltd. | Solar module and method for manufacturing the same |
| JP2016103661A (en) * | 2016-02-19 | 2016-06-02 | パナソニックＩｐマネジメント株式会社 | Solar cell module |
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