JPS61131845U - - Google Patents

Info

Publication number
JPS61131845U
JPS61131845U JP1985014974U JP1497485U JPS61131845U JP S61131845 U JPS61131845 U JP S61131845U JP 1985014974 U JP1985014974 U JP 1985014974U JP 1497485 U JP1497485 U JP 1497485U JP S61131845 U JPS61131845 U JP S61131845U
Authority
JP
Japan
Prior art keywords
external connection
electronic component
connection terminal
ground electrode
connection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985014974U
Other languages
English (en)
Other versions
JPH02913Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985014974U priority Critical patent/JPH02913Y2/ja
Priority to US06/826,347 priority patent/US4701723A/en
Publication of JPS61131845U publication Critical patent/JPS61131845U/ja
Application granted granted Critical
Publication of JPH02913Y2 publication Critical patent/JPH02913Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/655—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding   with earth brace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る電子部品の外部接続装置
の一実施例を示す要部斜視図、第２図は第１図に
示す補助基板の斜視図、第３図は第１図の補助基
板の他の実施例を示す正面図、第４図は本考案に
係る電子部品の外部接続装置の他の実施例を示す
斜視図、第５図は本考案において参考となる電子
部品を示す正面図（一部断面で示す）、第６図は
本考案の参考となる電子部品の外部接続装置を示
す要部斜視図である。 １……超高速ＩＣ、３……超高速遅延線、５，
１５……電子部品本体（プリント基板）、７，２
５，２７……外部接続端子（入出力端子、接地端
子）、９，４９……電子部品本体（ケース）、１
１，１７，３５，４７……導線路、１３，３３，
４５……接地電極、２９，４１……補助基板、３
１，４３……誘電体（誘電体板）。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 電子部品本体に外部接続端子を支持させて
    なる電子部品の外部接続装置において、 前記外部接続端子に誘電体を介して接地電極を
    前記外部接続端子に沿つて対向させ、前記外部接
    続端子が所定のインピーダンスの伝送線路を構成
    してなることを特徴とする電子部品の外部接続装
    置。 (2) 片面に接地電極の形成された誘電体板の他
    面を外部接続端子に接触させてなる実用新案登録
    請求の範囲第１項記載の電子部品の外部接続装置
    。 (3) 片面に接地電極の形成された誘電体板の他
    面に前記接地電極に対向する導線路を形成し、外
    部接続端子を前記導線路に接触させてなる実用新
    案登録請求の範囲第２項記載の電子部品の外部接
    続装置。
JP1985014974U 1985-02-05 1985-02-05 Expired JPH02913Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985014974U JPH02913Y2 (ja) 1985-02-05 1985-02-05
US06/826,347 US4701723A (en) 1985-02-05 1986-02-05 Connection construction for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985014974U JPH02913Y2 (ja) 1985-02-05 1985-02-05

Publications (2)

Publication Number Publication Date
JPS61131845U true JPS61131845U (ja) 1986-08-18
JPH02913Y2 JPH02913Y2 (ja) 1990-01-10

Family

ID=11875948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985014974U Expired JPH02913Y2 (ja) 1985-02-05 1985-02-05

Country Status (2)

Country Link
US (1) US4701723A (ja)
JP (1) JPH02913Y2 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353703A (ja) * 1989-07-21 1991-03-07 Elmec Corp 電子部品の端子構造
US5233131A (en) * 1990-12-19 1993-08-03 Vlsi Technology, Inc. Integrated circuit die-to-leadframe interconnect assembly system
FR2771890B1 (fr) * 1997-11-28 2000-02-18 Thomson Csf Procede de montage en surface d'un boitier hyperfrequence sur un circuit imprime et boitier et circuit imprime pour la mise en oeuvre du procede

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574239U (ja) * 1980-06-06 1982-01-09

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686624A (en) * 1969-12-15 1972-08-22 Rca Corp Coax line to strip line end launcher
US3651432A (en) * 1970-04-14 1972-03-21 Amp Inc Impedance matched printed circuit connectors
US4208642A (en) * 1978-10-25 1980-06-17 Raytheon Company Modular microstrip transmission line circuitry
JPS5571498A (en) * 1978-11-24 1980-05-29 Japan Maize Prod Production of finely divided sugar
US4310811A (en) * 1980-03-17 1982-01-12 Sperry Corporation Reworkable multi-layer printed circuit board
US4543544A (en) * 1984-01-04 1985-09-24 Motorola, Inc. LCC co-planar lead frame semiconductor IC package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574239U (ja) * 1980-06-06 1982-01-09

Also Published As

Publication number Publication date
JPH02913Y2 (ja) 1990-01-10
US4701723A (en) 1987-10-20

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