JPS61129899A - Cooling structure of electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a cooling structure for cooling the heat generated by electronic components such as LSI elements, and in particular, the present invention relates to a cooling structure for cooling the heat generated by electronic components such as LSI elements, and in particular, the present invention relates to a cooling structure that cools down the heat generated by electronic components such as LSI elements, and in particular, the present invention relates to a cooling structure that cools down heat generated by electronic components such as LSI elements. The present invention relates to a cooling structure for electronic components that is formed so as to be brought into close contact with the electronic component.

In recent years, electronic components such as LSI elements, which are widely used in the configuration of electronic devices, have become more densely packaged and faster.In order to achieve stable operation, it is important to cool these electronic components efficiently. This is a major issue.

Such a cooling plate is formed to perform cooling by circulating a refrigerant, and is generally used as a refrigerant because it is economical and provides high cooling efficiency.
Cold water is used and the configuration is as shown in the perspective view of FIG.

A cooling plate 1 is arranged so as to be stacked on a printed circuit board 3 on which a plurality of electronic components 4 are mounted, and the surface of the electronic components 4 is brought into close contact with a predetermined location of the cooling plate 1.
Cooling is performed by circulating cold water in the direction of arrow A from one opening of the cooling plate 1 and in the direction of arrow B from the other opening.

In such a cooling structure, in order to obtain a predetermined cooling of the electronic components 4, it is necessary to uniformly distribute the surface of each electronic component 4 at a predetermined location on the cooling plate 1.

Moreover, it is important that the heat transfer coefficient is well maintained.

[Conventional technology]

Conventionally, the structure was as shown in the cross-sectional views of FIGS. 3(a) and 3(b).

As shown in FIG. 3(a), a cooler 7 formed by injecting a refrigerant 6 such as a fluorocarbon liquid into a film-like outer skin 5 is fixed to the cooling plate 1.

The cooler 7 is configured to be in close contact with the surface of the electronic component 4 mounted on the printed circuit board 3.

In addition, as shown in FIG. 3(b), an elastic piece formed of a good heat conductive material has one end fixed to the cooling plate 1 and the (fi! end) pressed against the surface of the electronic component 4 in the direction of arrow P. Some are constructed by providing 8.

In either configuration, the electronic component 4 is cooled via the cooler 7 or the elastic piece 8 by flowing cold water in the direction of arrow C through the flow path IA of the cooling plate 1.

[Problem that the invention seeks to solve]

However, in such a configuration, when an electronic component 4 with a small external shape is mounted as shown by the dotted line in FIG. Even if the cooling element 7 and the elastic pieces 8 are brought into close contact with each other, the absorption of heat by the cooling plate 1 becomes poor.

Therefore, there has been a problem in that cooling efficiency, especially for small electronic components 4, is reduced.

[Means for solving problems]

The above-mentioned problems are solved by the electronic component cooling structure according to the present invention, in which a good heat conductive member is fixed to the outer periphery of the electronic component, and the contact surface of the cooling plate is expanded to be brought into close contact with a predetermined location of the cooling plate.

[Effect]

That is, a good heat conductive member having a wide contact surface that comes into contact with the cooling plate is fixed to the electronic component.

It is formed so that cooling is performed by a cooling plate through the close contact surface.

Therefore, it is possible to prevent a decrease in cooling efficiency for small electronic components having a small surface area, such as the conventional electronic component ψ.

〔Example〕

Hereinafter, a detailed explanation will be given with reference to an embodiment shown in FIG. 1st
Figures (a) and (b) are side sectional views, (c),
(d) is a perspective view. It should be noted that the same reference numerals refer to the same objects throughout the design.

As shown in FIGS. 1(a) and (b), electronic components 4
A member 14 on which a close contact surface 14A having an area larger than the surface of It has the same configuration as .

This member 14 is made of a material with good thermal conductivity such as steel, and has a close contact surface 14A and a side wall 14B as shown in FIG. 1(c).
The electronic component 4 is fixed by inserting the side wall 14B in the direction of the arrow along the outer periphery of the electronic component 4 and adhering it with adhesive paste or the like.

Further, as shown in FIG. 1(d), the electronic components 4A and 4B are held between the member 15 provided with the close contact surface 15A and the tongue piece 15B in the direction of the arrow E and bonded in the same manner as described above. In this case, electronic components 4A and 4B may be fixed together.
There is an advantage that the two can be installed together.

With this configuration, a small electronic component with a small surface area 4
Even though each close contact surface 14A.

15A allows the area of close contact between the cooler 7 and the elastic piece 8 to be expanded, thereby improving cooling efficiency.

〔Effect of the invention〕

As explained above, the present invention is such that a good heat conductive member having a close contact surface with an enlarged close contact area brought into close contact with a cooling plate is fixed to an electronic component.

This prevents a drop in cooling efficiency for small electronic components, improves cooling efficiency even when electronic components with different shapes are mixed together, and provides uniform cooling, which has great practical effects. be.

[Brief explanation of drawings]

1A and 1B are side sectional views, and FIGS. 1C and 1D are perspective views of an embodiment of the present invention. FIG. 2 is a perspective view showing an outline of the cooling structure. FIGS. 3(a) and 3(b) show conventional side sectional views. In fig. 1 is a cooling plate, 4 is an electronic component. 3 is a printed circuit board, 6 is a refrigerant. 5 is the outer skin, 7 is the cooler. 8 is an elastic piece, 14.15 is a member. Kaya 1 GardenCb) <c)Cd)

Claims (1)

[Claims] A cooling structure for an electronic component, comprising a printed circuit board on which an electronic component is mounted, and a cooling plate for cooling the heat generated by the electronic component, wherein the outer periphery of the electronic component is closely attached to a predetermined location of the cooling plate. A cooling structure for electronic components, characterized in that a good heat conductive member is fixed to which the close contact surface is expanded.