JPS61124475A - Method of holding and conveying electronic parts - Google Patents

Abstract

PURPOSE:To reduce the trouble of controlling parts by sticking an electronic parts with a lead wire to a clip having a through hole on its end by means of tape, sticking the adhesive faces of the ends of the tape to each other, and blowing air up from said through hole when tearing off said tape to securely dispose said tape. CONSTITUTION:A rotary head 20 rotates counterclockwise, causing an adhesive tape 12 which is adsorbed by a fixed head 18, to be overlapped with the end part of the tape, providing an on-adhesive surface on a part of the end part. And, a tape feeding device 17 is lowered onto the surface of a set clip 10 and moved laterally while rotating a rolling head 22, to make the adhesive tape 12 fix electronic parts 7 to the clip 10. A used tape 14 can be securely disposed by discharging air from downward into an air blow-up port 11 provided on the clip 10 by means of an air nozzle 16, to float up a holding part 13, and chucking the part with a chuck head 15. Accordingly, the conveying clip can be stably recycled, greatly reducing the trouble of controlling parts.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the transportation of electronic components having lead wires.

Structure of the conventional example and its problems The conventional method of transporting electronic components is as shown in Figure 1, in which an electronic component 2 having an L-shaped lip 1 and a lead wire is used.
was fixed with adhesive tape 3 and transported, but there are only two holding surfaces and the directionality is restricted. In addition, there is a U-shaped slot hole 4 on the end face of the clip 1 to allow for the zipper to escape when removing the tape, but since the adhesive tape 3 is attached to the entire surface of the clip 1, the tape A portion remains during peeling and becomes defective in the subsequent process, and
Since the clip 1 is L-shaped, the conveyance posture is unstable, which poses problems in terms of parts management and conveyance.

OBJECTS OF THE INVENTION The present invention overcomes the above-mentioned drawbacks of the prior art and ensures tape post-processing.

Structure of the Invention The present invention provides a method for attaching an electronic component having a lead wire to a clip using tape, pasting a part of the ends of the tape to each other with adhesive surfaces, providing a hole in the end of the clip, and When the tape is removed, air is blown up from the hole in the clip to ensure that the tape is processed, which is extremely advantageous in terms of managing and transporting parts.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 to 4. FIG. 2 is a process diagram in this example. In FIG. 3, 5 is a lead wire, 6 is an element, and 7 is a semi-finished electronic component obtained by welding the lead wire 5 and the element 6. 8
01Q is a chuck for holding the electronic component 7; 9 is a transporting jig having a plurality of chucks 8; 01Q is a clip for conveying the electronic component 7; 11 is an air blower provided on the end surface of the clip; The punch hole 012 is an adhesive tape for pasting the electronic component 7 and the clip 1o together, and the reference numeral 13 is a hook portion formed by folding together the adhesive end surfaces of the adhesive tape 12. 14 is the waste tape from which the electronic parts have been removed; 15 is a chuck head for winding up the waste tape; and 16 is an air nozzle for ensuring that the chuck head 15 grips the waste tape 14.

This folding function will be explained in detail based on FIG. 4. 17 is a tape supply device, 18 is a fixed head for tape suction, 19 is a suction hole a provided in the fixed head 18, and 20 is a tape suction 21 is a suction hole provided in the rotary head, and 22 is a rolling head for compressing the tape. When the rotary head 2o rotates counterclockwise, the adhesive tape 12 adsorbed by the fixed head 18 overlaps with the leading end of the tape, and a part of the leading end becomes a non-adhesive surface, and the set clip The tape supply device 117 descends to the surface of 10, moves laterally while rotating the rolling head 22,
The clip 10 and the electronic component 7 are fixed with an adhesive tape 12. Further, the waste tape 14' is made by discharging air from the bottom surface from the air nozzle 16 into the air blow-up hole 12 provided in the clip 1o, lifting the claw part 13, and chucking the waste tape with the chuck head 15. It can be processed reliably.

Effects of the Invention As described above, the present invention is characterized in that it is possible to reliably dispose of waste tapes, to stably cycle the removable clips, and to significantly reduce the management of parts.

[Brief explanation of drawings]

Fig. 1 is a perspective view of an L-shaped clamp, Fig. 2 is a flowchart in an embodiment of the present invention, Fig. 3 is an explanatory drawing showing the same process, and Fig. 4 is a schematic explanatory drawing of the holding and conveying device. be. 1... L-shaped lip, 3... Adhesive tape, 8... Chuck, 9... Transfer jig, 1o... Clip, 12...Adhesive tape, 13...Lock portion, 15...Chuck head, 17...Tape supply device, 22...
...rolling head. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure ,? Figure 2 Figure 11i351 Figure 4

Claims (1)

[Claims] a step of folding back a part of one end of the adhesive tape and pasting the adhesive surfaces together; a step of fixing an electronic component to the adhesive tape on a clip having a hole in the end surface; a step of conveying the clip; The process of extracting electronic components,
A method for holding and transporting electronic components comprising the steps of supplying air through a hole in the clip to blow up the folded portion of the adhesive tape, gripping it, and winding it up.