JPH0661697A - Electronic component mounting method and printed board employing the method - Google Patents

Abstract

PURPOSE:To provide an electronic component mounting method realizing high density mounting, and a printed board employing the method, from which the need of lead wire cutting/bending parts is eliminated by inserting an electronic component and securing in place through the use of a holding component. CONSTITUTION:A holding component 19 is inserted into through holes 20 of a printed board 1 while being pinched by a pinching section 18. A specific electronic component 21 is subsequently inserted into a predetermined position while being guided. This method imposes no cutting/bending load on the electronic component which is thereby protected against breakdown. Provision of a groove in the holding component enhances insertion efficiency.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting an electronic component having a lead wire on a printed circuit board, and a printed circuit board on which the electronic component is mounted.

[0002]

2. Description of the Related Art A conventional electronic component mounting method and a printed circuit board on which electronic components are mounted by the method will be described below with reference to the drawings.

In FIG. 10, the insertion hole 1 of the printed circuit board 1
The lead wire 3 of the electronic component 2 is inserted into a and the lead wire 3
The blade part 5a of the die 5 fixed to the lower surface 4a of the cutter 4
Then, the cutter 4 advances in the direction of arrow R, and is bent by the curved upper surface 4b of the cutter 4 with the lower end edge 6 of the insertion hole 1a of the printed board 1 as a fulcrum, and as a result, the lead wire 3 is printed on the printed board. The electronic component 2 is bent in parallel with 1 and fixed to the printed circuit board 1. Reference numeral 7 is a guide on the insertion head side. The above is illustrated by (a), (b), and (c) of FIG. That is, (a) in FIG. 11 immediately before inserting the lead wire 3 of the electronic component 2 into the printed circuit board 1, (b) immediately before cutting the tip of the lead wire 3 with the cutter 4, and (c) in FIG. The bent parts are shown respectively. Further, immediately before the lead wire 3 of the electronic component 2 is inserted into the printed board 1, the protrusion 5b of the die 5 fixed to the main body and the lower surface 7 of the insertion head side guide 7 are provided.
The printed board 1 is held by a, and then the lead wire 3 is inserted into the insertion hole 1a of the printed board 1.

FIG. 12 shows a state in which the axial component 2a and the radial component 2b, which are electronic components having the lead wire 3, are fixed to the printed circuit board 1.

13 and 14 showing another conventional example, first, in FIG. 13 (a), the lead wire 3 of the electronic component 2 is inserted into the printed board 1 and then the lead wire 3 is guided by the guide bodies 8 and 9. 13B, and FIG.
After inserting the lead wire 3 of the above into the printed circuit board 1,
The lead wire 3 is bent by rotating 11 in the direction of the arrow.
In these cases, it is necessary to previously cut the lead wire 3 into an appropriate length. In FIG. 14, the printed circuit board 1
The lead wire 3 of the electronic component 2 which is exposed on the back surface of is cut into an appropriate length, and the remaining portion is bent and fixed.

Further, in the conventional example shown in FIG. 15, as described in detail in Japanese Utility Model Laid-Open No. 61-140542, a plurality of electronic components 2 are provided in many through holes provided in the holder 12. Is inserted and held, and the locking leg 13 of the holding body 12 is inserted into the locking hole 13a of the printed circuit board 1 and locked. The lead wire 3 of the electronic component 2 is held in the long portion by the holding body 12 and the holding hole 15 of the lead terminal guide tool 14 integrated with the holding body 12. Therefore, the lead terminal 3 is not cut on the back surface of the printed board 1 through the insertion hole 1a of the printed board 1 and is not bent to be fixed to the board 1. Reference numeral 16 is a locking hole in which the locking portion 17 of the lead terminal fitting 14 is locked.

[0007]

However, in the conventional structure shown in FIGS. 10 to 14, the printed circuit board 1 is used.
Since the force directed upward is applied to the electronic component 2 when it is fixed to, the lead wire 3 of the axial component 2a or the like must be held. Further, it is necessary to hold the electronic component body with respect to the radial component 2b. In this case, since pressure is applied to the inserted electronic component body, the lead wire 3 may be deformed or the electronic component body may be damaged.

Even when the lead wire 3 is bent and fixed to the printed circuit board 1, the space between adjacent electronic components is reduced due to high-density mounting.
The bending work is becoming difficult.

Further, in the conventional structure shown in FIG. 15, the tip portion of the lead wire 3 is not cut and it is not necessary to bend the lead wire 3 to fix it to the printed circuit board. However, due to the holding body 12 into which the lead wire 3 of the electronic component 2 is inserted and the lead terminal guide tool 14, the height dimension thereof is considerably higher than the height of the electronic component 2 itself, and there is a problem that the overall size becomes large. there were.

The present invention solves the above-mentioned problems of the prior art. When the height of the electronic component is low, the leading end of the lead wire of the electronic component is inserted into the printed circuit board without being cut or bent to damage the electronic component. It is an object of the present invention to provide an electronic component mounting method and a printed circuit board according to the method, which eliminates the need for large-scale equipment.

[0011]

In order to achieve the above object, according to the present invention, a lower holding portion of a holding component having upper and lower engaging portions is inserted into an insertion hole of a printed circuit board to hold the holding component. Inserting the holding component to be inserted into the printed circuit board, inserting the lead wire end of the electronic component into the through hole of the printed circuit board, and the locking portion above the holding component is directly locked to a part of the electronic component. The electronic component mounting method includes an electronic component fixing step of pressing down and fixing the electronic component to the printed circuit board.

Further, the printed circuit board has electronic components directly fixed to predetermined positions by holding components. In addition,
Before the insertion process of the holding component, an insertion hole setting process of providing an insertion hole for inserting the locking portion below the holding component into the printed circuit board, and a transportation process of transporting the printed circuit board to a predetermined position of the electronic component mounting apparatus. Then, it is possible to set a detection step of detecting whether the insertion hole is inserted into a predetermined position of the printed circuit board and a judgment step of determining whether the holding component is inserted in the predetermined position of the printed circuit board. is there.

[0013]

With the above-described structure, the electronic component is directly pressed and fixed to the printed circuit board by the holding component previously inserted, so that the electronic component can be prevented from being damaged. Further, since the mechanism of the electronic component insertion device is simplified, the space for equipment for bending the lead wire is not required.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting method according to an embodiment of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 and 3, in the carrying step, the printed circuit board 1 is carried to a predetermined insertion position, and the holding section 18 holds the rod-shaped holding component 19 from the supply section (not shown) in the holding step. To do. Next, in the insertion step, the holding portion 18 descends, and the holding component 19 is inserted into the predetermined insertion hole 20 on the board 1. After inserting as many holding components 19 as the electronic component 21 can be fixed onto the substrate 1, the electronic component 21 is sucked by the nozzle 22 and a predetermined holding component 1 is attached in the fixing step.
A predetermined electronic component 21 is inserted between the nine. The above movements are graphically displayed as shown in FIGS. 3 (a), (b), (c), and (d).

Further, as shown in FIGS. 2 and 8, the setting conditions of the insertion hole 20 of the holding component 19 and the like are stored in the storage unit 23 in advance. That is, preset conditions such as the type or insertion position of the holding component 19, the type of electronic component, and the insertion state are stored in the storage unit 23, and the insertion work is started by automatically selecting and adapting to the situation. For example, in the case of the axial part 24 as shown in FIG.
The holding component 27 having a groove 26 for guiding the lead wire 25 of the electronic component 24 extending from the side of the electronic component 24.
For the electronic component 29 having the lead wire 28 which is used to maintain the predetermined height, a holding component 30 capable of maintaining a predetermined height is selected as shown in FIG. For the radial component 32 having the lead wire 31 as shown in FIG. 7, the holding component 34 having the protrusion 33 that can be fixed so that the electronic component 32 does not fall off is selected. Further, an appropriate holding component and an inserting method are input and stored in correspondence with respective shapes of adjacent electronic components and mutual distances.

After that, the substrate 1 is conveyed to a predetermined insertion position (conveying step), and the insertion hole 20 on the substrate 1 is detected (detecting step). At that time, each time the camera 35 inserts, the recognition is performed one by one, or the recognition is performed by dividing into blocks or collectively. After recognition, the holding component 19
Is held by the holding unit 18 and transferred onto the substrate (holding step). The holding component 19 is inserted into the recognized insertion hole 20 (insertion step). After that, it is confirmed whether or not the holding component 19 is inserted in a predetermined position for determining the state after the insertion, and whether or not the holding component 19 is inserted is determined to be good or bad. (Judging Step) When it is judged to be good, a predetermined electronic component is inserted into a predetermined position (fixing step). However, if it is determined to be no, it takes a great deal of time to remove the inserted defective holding component 36. Therefore, as shown in FIGS. The portion of the holding component 36 protruding on the substrate 1 is cut into pieces. The lower part of the holding part 36 may remain on the substrate 1, but as shown in FIG. 9 (e), the main body 36a of the holding part 36 is thinner than the insertion hole 20. Or bar 3 from above
Push out at 8. After removing the defective holding part 36,
Insert the holding part again.

As for the shape of the holding component, as shown in FIG. 4A, it has enlarged locking portions 39 and 40 at both ends, and the upper locking portion 39 presses and fixes the electronic component. The shape is suitable for. The lower locking portion 40 has a protruding portion that does not come off after the holding component is screwed into the board. Further, the upper locking portion 39 in FIG. 4A has an umbrella shape. The upper locking portion 41 shown in FIG. 4 (b) has a protrusion on only one side, and FIG. 4 (c) is compatible with axial parts and has a guide groove 42 for the lead wire, and the upper portion has a lead groove. It has a lead wire sandwiching portion 43 for sandwiching the wire, and a lower portion has a protrusion 44 that can be fixed to the substrate. (E) has the same configuration as (c), but has a main body 45 and a small diameter portion 46 so as to be suitable when maintaining the electronic component at a constant height.
There is a difference in thickness so that the holding part does not come off. Here, the length of the small diameter portion 46 corresponds to the substrate thickness.

[0019]

As is apparent from the above description of the embodiments, according to the electronic component mounting method of the present invention, a holding component is inserted in advance in the vicinity of the mounted electronic component on the substrate and is determined by the holding component. By fixing the electronic components, the cutting and bending work of the lead wire is unnecessary. Therefore, the insertion equipment required for cutting and bending is unnecessary, and it can be shared with the mounting machine, and a significant cost reduction can be realized.

Also, the space required for cutting and bending is not required, and it is possible to deal with high-density mounting sufficiently, and the load applied during cutting and bending is eliminated.
It has become possible to reduce the damage to electronic parts and improve the insertion rate. The height of the printed circuit board according to this electronic component mounting method is low because the electronic component is directly fixed to the printed circuit board by a holding component under pressure and does not greatly exceed the height of the electronic component. Further, by previously providing the holding component with the guide groove for guiding the lead wire of the electronic component to the insertion hole of the printed circuit board, the insertion rate of the lead wire is further improved.

[Brief description of drawings]

FIG. 1 is a block diagram showing steps of an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 is a block diagram showing steps of an electronic component mounting method according to another embodiment.

FIG. 3 is a schematic cross-sectional view of essential parts for explaining the operation of the electronic component mounting method according to the embodiment of the present invention.

FIG. 4 (a) is a schematic front view of a holding component of the same radial component; (b) is a schematic front view of a retaining component of the other radial component; (c) is a schematic front view of a retaining component of the same axial component; e) Schematic front view of holding parts for other axial parts (f) Same

FIG. 5 (a) is a front sectional view of the axial electronic component inserted and fixed on a printed circuit board according to another embodiment of the present invention. FIG.

FIG. 6 (a) is a front sectional view of an electronic component inserted in and fixed to a printed circuit board while maintaining the same predetermined height.

FIG. 7 is a front cross-sectional view of the radial electronic component inserted / fixed on the printed circuit board.

FIG. 8 is a perspective view of a holding component insertion device used in the electronic component mounting method according to the embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view of essential parts for explaining the operation of cutting the defective holding component in the electronic component mounting method according to another embodiment of the present invention.

FIG. 10 is an enlarged sectional view showing a main part of a lead wire cutting / bending device of a conventional electronic component mounting method.

11A is a sectional view showing a state immediately before inserting an electronic component for explaining the same step; FIG. 11B is a sectional view showing a state immediately before cutting the lead wire; FIG. 11C is a sectional view showing a state in which the lead wire is bent. Figure

FIG. 12 (a) is a front sectional view of an axial electronic component fixed to the printed circuit board, (b) is a front sectional view of the radial electronic component, and (c) is a front sectional view of a radial electronic component of another conventional example.

FIG. 13 is a front view showing the same lead wire bending method.

FIG. 14 is a sectional view of the same lead wire bending device.

FIG. 15 is an exploded perspective view showing another conventional electronic component and its holder.

[Explanation of symbols]

 1 Printed Circuit Board 13 Clamping Section 14 Holding Material 15 Insertion Hole 16 Electronic Component

Claims (7)

[Claims] 1. An inserting step of a holding component for inserting a holding component into a printed circuit board by inserting a lower engaging part of a holding component having upper and lower engaging parts into an insertion hole of a printed circuit board, and a lead of an electronic component. The wire end is inserted into the through hole of the printed circuit board, and the locking part above the holding part directly locks with a part of the electronic part, and the electronic part is pressed down and fixed to the printed circuit board. An electronic component mounting method having a step. 2. An insertion hole setting step of providing an insertion hole for inserting the locking portion below the holding component into the printed circuit board before the holding component insertion process, and the printed circuit board at a predetermined position of the electronic component mounting apparatus. The following steps are set: a transfer process to transfer to the substrate, a detection process to detect whether the insertion hole has been inserted into a predetermined position on the printed circuit board, and a judgment process to determine whether the holding component has been inserted into the specified position on the printed circuit board. The electronic component mounting method according to claim 1. 3. The electronic component mounting according to claim 1, wherein in the holding component inserting step, the storage unit selects a holding component type corresponding to the electronic component type and sets a holding component insertion condition. Method. 4. When it is determined that the holding component is not properly inserted in the determination step of determining whether the holding component is inserted into a predetermined position of the printed circuit board according to claim 2,
An electronic component mounting method including a step of removing the holding component from the printed circuit board and inserting the holding component into the printed circuit board again. 5. An upper engaging portion of a holding component, which is fixed by inserting a lower engaging portion into an insertion hole of a printed circuit board, is formed on a part of an electronic component in which an end of a lead wire is inserted into a through hole of the printed circuit board. A printed circuit board that is locked and the electronic components are pressed down and fixed to the printed circuit board. 6. The printed circuit board according to claim 5, wherein the upper retaining portion of the holding component retains the upper lateral portion of the lead wire protruding laterally from the axial electronic component. 7. A printed circuit board according to claim 6, further comprising a holding component for forming a guide groove for inserting a lead wire of the axial electronic component into a hole of the printed circuit board.