JPS61124139A - Manufacture of electronical element - Google Patents

Abstract

PURPOSE:To readily and effectively remove an ultrafine foreign material by coating and drying resin paint on a position surrounded by a ring-shaped jig or an annular resin coating film,and then removing the solidified film simultaneously with removal of the jig. CONSTITUTION:Resin paint is coated on the peripheral edge of a transparent conductive film 2 at the center on a light transmission image sensing surface forming plate 1 in such a manner that the surface is a ring shape and the section is formed substantially in a semicircular shape to form a ring-shaped bank- shaped resin ring 5. A ring-shaped jig 6 having an upper open end 6a is contacted and disposed. The paint is coated on the surface 2a to be cleaned of the film 2 of cleaner surrounded by the jig 6 or the ring 5 to form the first resin coating film 7. Then, when the ring 5, the first film 7 and the second resin coating film 8 are dried and the jig 6 and the plate 1 are separated, no foreign materials such as contaminants, fine foreign material nor scratched chips of the film, residue remain on the surface 2a, and the scratching point of the film is not damaged, but entirely cleanly removed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method of manufacturing an electronic device, and particularly to a method of cleaning surface members during the manufacturing process of an electronic device having a thin film structure.

"Background of the Invention" Electronic devices that usually have a thin film laminated structure and in which a large electric field is applied to the thin film include, for example, photoelectric conversion elements or thin film storage batteries that have rectifying junction properties. A process in which layers are sequentially formed by a thin film forming process such as sputtering, vacuum evaporation, or CVD, especially 2
When foreign particles adhere to the thin film interface of different types, the glare element may cause local dielectric breakdown, abnormal rectification, or rectification breakdown.
This may impair the overall device function. For example, in an image pickup tube using a photoconductive film with a rectifying contact interface,
If the next layer is formed with foreign matter attached to the rectifying interface of the photoconductive film, an excessive dark current will flow in the defective part of the imaging screen of the completed image pickup tube due to the accidental destruction of the rectifying property, and the reproduction screen will be affected. This will cause bright spot scratches. Usually, a thin film of i/dium oxide, tin oxide, or a composite thereof is formed on a transparent glass substrate, and a photoconductive film containing Se is formed on this, or between the two, germanium oxide or In a photoconductive film formed with cerium oxide, lithium fluoride, or a composite film thereof as an intermediate layer, a hetero-NP junction is formed with the Se-based photoconductive film as the P layer. In this case, it is unnecessary to define which layer is strictly an N-type conductor, but both the interface between the transparent conductive film and the intermediate layer and the interface between the intermediate layer and the photoconductive film have a rectifying property. This will be collectively referred to as the bonding interface. From a practical standpoint, transparent conductive films are often formed by vapor deposition, sputtering, CVD, or PVD using processes different from photoconductive film deposition, and are separated from the next process. It is often done. For this reason, the chance and probability of foreign matter adhering after film formation is high, and the sputtering method itself tends to generate foreign matter.

Therefore, it is necessary and effective to clean the surface prior to coating formation in the next step.

Conventionally, the methods used were to irradiate ultrasonic waves in the liquid and then pull it out of the steam bath and dry it, or to shake and dry the droplets using the full centrifugal force of the attached cleaning liquid (see ``Paint Handbook''). In principle, it is unavoidable that foreign matter floats in the cleaning solution, and no matter how much you super-clean the cleaning solution, the floating matter in the cleaning solution will not be completely eliminated, and this may re-adhere to the cleaning surface or become extremely dangerous. It has been considered impossible to clean fine foreign particles beyond the level where they adhere to the substrate surface due to an attractive force that cannot be removed by external force such as ultrasonic irradiation or brushing. Although this limit is not clear, it is assumed that the particle size is on the order of about 0.1 μm or less.

To remove such foreign matter from the substrate surface, there is a method of applying a resin solution to the surface to be cleaned, peeling it off after drying, embedding the foreign matter in the dried resin film in the process, and removing it when the resin is peeled off. It has been proposed by the applicant (Japanese Unexamined Patent Publication No. 52
-130810 Publication), the electronic device is small, such as the imaging surface of an image pickup tube, and the area difference between the surface to be cleaned and the surface of the riverside portion that does not need cleaning is small, and at least the portion that is not cleaned is not allowed to be contaminated. In some cases, it has been difficult to apply the resin solution and peel off the dried resin film with high productivity.

[Purpose of the invention]

Therefore, the present invention has been made in view of the above-mentioned conventional problems, and its purpose is to easily and reliably remove minute foreign matter and improve the quality and productivity of electronic devices. An object of the present invention is to provide a method for manufacturing an electronic device.

[Summary of the invention]

In order to achieve such an object, the method for manufacturing an electronic device according to the present invention involves applying a resin paint in a circular manner only to the peripheral area of the thin film forming area on the surface of the object to be cleaned on which a thin film is to be laminated, and then applying this circular resin coating. A ring-shaped jig that follows the shape of the film is placed on the annular resin coating, and then resin paint is applied to the area surrounded by the ring-shaped jig or the annular resin coating, and after drying,
By removing the solidified resin coating film at the same time as removing the ring-shaped jig, the coating film is removed at the same time as the contaminants and fine foreign matter adhering to the surface of the object to be cleaned are incorporated into the coating film. It can be completely removed without leaving any residue, and it can be easily peeled off without damaging the peeling starting point of the coating film or causing any torn remaining parts of the coating film.

[Embodiments of the invention] Next, embodiments of the present invention will be described using the drawings.

FIGS. 1A to 1F are cross-sectional process diagrams for explaining an example of the case where the method for manufacturing an electronic device according to the present invention is applied to forming an image pickup surface of an image pickup tube. Before explaining the present invention, an outline of the configuration of the face plate structure of the image pickup tube will be explained. For example, in the case of a 13 mm type image pickup tube, as shown in a perspective view in FIG. 2, the face plate structure of the image pickup tube has an image pickup surface forming face plate 1 with a diameter of about 13.5 mm, and a transparent conductive film 2 formed in the center thereof. Roughly speaking, a central portion approximately 8.0 mm in diameter is an effective imaging surface forming portion 3, and its outer peripheral portion 4 is a portion for sealing with the electron gun outer tube glass. In such a structure, the outer circumferential portion 4 serving as the sealing portion and the imaging surface forming effective portion 3 are not required to have any degree of cleanliness, but if they are contaminated, the vacuum level of the image pickup tube may deteriorate due to poor sealing. If organic debris remains in areas other than the sealed portion on the vacuum side, contamination is not allowed, as this will also result in poor vacuum quality due to gas generation.

Next, the present invention will be explained in detail with reference to FIG.

First, as shown in FIG. 2(a), fine particles are deposited on the surface to be cleaned 2a on the thin film-forming surface of the transparent conductive film 2 deposited on the central part of the light-transmitting imaging surface-forming face plate 1. If foreign matter is attached, a resin paint is applied to the peripheral edge of the transparent conductive film 2 by, for example, a jetting method so that the plane is ring-shaped and the cross-section is approximately semicircular, as shown in Figure (b). Then, a bank-like resin ring 5 is formed. In this case, in order to obtain appropriate workability for this resin coating, it is preferable to use a single or mixed solvent of methyl ethyl ketone, methyl isobutyl ketone, or a solvent with the addition of toluene. For this purpose, a system with no plasticizer or a polymer plasticizer or a high boiling point solvent added as a plasticizer is desirable.

Next, as shown in FIG. 5C, a ring-shaped jig 6 having an open end 6a having substantially the same shape as the resin ring 5 is placed on the resin ring 5 in contact with it. In this case, the open end 6a of the ring-shaped jig 6 will dig into the resin ring 5 due to its own weight, albeit slightly. Further, the ring-shaped jig 6 used here needs to be made of stainless steel or a resin ring that is not corroded by the aforementioned resin paint. Next, the same figure (
As shown in d), the same resin paint as described above is applied onto the surface 2a to be cleaned of the transparent conductive film 2 as the object to be cleaned, which is surrounded by the ring-shaped jig 6 or bank-shaped resin ring 5. Forms a resin coating. In this case, make sure that the first resin coating 7 completely covers and adheres to the rising part of the inner surface of the ring-shaped jig 6, and if necessary, apply the same resin coating as above as shown in FIG. The second resin coating film 8 is additionally formed by applying sufficient additional coating until it reaches the inner surface of the ring-shaped jig 6. Next, resin ring 5. The first resin coating film 7 and the second resin coating film 8 are dried, and the ring-shaped jig 6 is shaped so that it is fully adhered to the ring-shaped jig 6 as shown in FIG. When the imaging surface forming face plate body 1 and t are peeled off, a resin ring 5. The first resin coating film 7 and the second resin coating film 8 are attached to a ring-shaped jig 6, and the transparent conductive film 2 as an object to be cleaned is
The surface 2a to be cleaned is completely and completely removed without leaving any foreign matter such as dirt, minute foreign matter, or residue from torn paint film, and without damaging the peeling starting point of the paint film. I was able to do that.

In addition, as another embodiment of the present invention, as shown in FIG. 1(b), a cleaning surface 2a of a transparent conductive film 2 as a cleaning object is provided.
After forming the bank-shaped resin ring 5 on top, without placing the ring-shaped jig 6, after drying this resin ring 5, the same resin paint as described above is applied to the area surrounded by this resin ring 5. After forming the first resin coating 7 and drying it slightly, the ring-shaped jig 6 is placed in contact with the bank-shaped resin ring 5. Next, move to the step shown in FIG. 1(e),
The ring-shaped jig 6 is completely coated with the same resin paint as described above on the rising part of the inner surface of the ring-shaped jig 6, and the second resin coating 8 is completely formed.
A method in which the ring-shaped jig 6 is peeled off after strengthening the adhesion between the resin ring 5 and the first resin coating 7 as shown in FIG. I was able to get it.

Further, as still another embodiment of the present invention, FIG.
), after placing the ring-shaped jig 6 on the resin ring 5, the process moves to the step shown in FIG. The same resin paint as described above is applied to the cleaning surface 2a and the inner surface of the ring-shaped jig 6 to form a first resin paint film 7 and a second resin paint film 8, respectively 1- A good result similar to that described above could also be obtained by peeling off the film into a ring-shaped jig 6' as shown in FIG. 1(f) after one drying period.

In addition, in the application of the various types of persimmons described above, the resin paint forming the first resin film 7 has a lower viscosity than the resin paint forming the resin ring 5 during application, and the resin liquid at the time of application is It is also possible to improve the coating workability by making the spread 9 steeper. In addition, the second resin coating film 8
The resin paint forming the resin ring 5 is made to have a higher viscosity during application than the resin paint forming the resin ring 5, thereby increasing the film thickness between the inner surface of the ring-shaped jig 6 and the resin coating film 7. Since the coating strength can be maintained at a high level and the adhesion between the resin coating γ and the ring-shaped jig 6 can be completely strengthened, it becomes easier to peel off the ring-shaped jig 6, and good results can be obtained. Ta.

Further, in any case, the rising portion on the inner surface side of the ring-shaped jig 6 needs to be adhered to the first resin coating 7 applied on the transparent conductive film 2. It is necessary that the first resin paint is applied integrally over the entire circumference of the ring-shaped jig opening end 6a to a height of about 5 to 2 nm or more, and if this is insufficient, the ring-shaped jig 6 When the transparent conductive film 2 is peeled off, this portion of the first resin coating 7 is cut and remains on the transparent conductive film 2.

Furthermore, as another embodiment of the present invention, when the ring-shaped jig 6 is placed on the resin ring 5 of the soil to be cleaned 2a of the transparent conductive film 2, the opening of the ring-shaped jig 6 is opened as shown in FIG. In some cases, it may be better to arrange the ends 6a'z facing the resin ring 5 with a slight distance d between them without contacting or burying the resin ring 5.This is because the resin ring 5 is in a dry state. In other words, this seems to be due to the viscosity, but if the ring-shaped jig 6 is placed on the resin ring 5 when the resin ring 5 has not dried, the ring-shaped jig 6 will sink and sink. p due to the resin coating becoming too small.
There is a tendency for the coating film in this area to break and remain when it is peeled off. Therefore, it is necessary to select whether or not to provide the interval d when arranging the ring-shaped jig 6 depending on the degree of drying of the resin ring 5, and either case can be an application of the present invention.

According to the method of cleaning the surface 2a to be cleaned of the transparent conductive film 2 according to each of the embodiments as explained above, after this, the surface 2a to be cleaned is
The incidence of partial force defects in the hetero n-p junction of the photoconductive film formed on the photoconductive film is drastically reduced, dark current is reduced, and high-quality image pickup tubes with good electrical characteristics can be produced with a simple process. can be obtained at a cost.

In addition, in the above-mentioned embodiment, a case was explained in which the method for manufacturing an electronic device was applied to forming an image pickup surface of an image pickup tube, but the present invention 8A is not limited to this, and is applicable to a heterojunction of a semiconductor device. It goes without saying that the same effects as described above can be obtained even when applied to the formation of insulating thin film parts, etc.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to remove contaminants, minute foreign substances, etc. adhering to the cleaning surface of the object to be cleaned, and to do so easily and reliably without leaving any part of the paint film. Since foreign substances are completely removed without damaging the surface of the cleaning surface, an extremely clean surface can be obtained.
It has extremely excellent effects such as a highly reliable thin film structure that can be obtained with good productivity.

[Brief explanation of the drawing]

FIGS. 1(a) to 1(f) show the method of manufacturing an electronic device according to the present invention applied to the method of forming an image pickup surface of an entire image pickup tube. 2 is a perspective view of the image pickup surface of the image pickup tube. FIG. 3 is a sectional process diagram of the main parts for explaining another embodiment of the present invention. Ru. 1... Imaging surface forming face plate body, 2... Transparent conductive film 1,
2a...surface to be cleaned, 3...imaging surface forming effective part, 4...outer circumferential part, 5...resin ring, 6...
・Ring-shaped jig, 6a...opening end, 7...first
Resin coating film, 8...Figure 1 (Q) a (C) Figure 1 (d) G □ 2o' La (f) ㉟Figure 2 Figure 3

Claims (1)

[Claims] A step of applying an organic resin paint in a ring shape to surround the surface to be cleaned of the object to be cleaned to form a ring-shaped resin part, and applying an organic resin to the inside of the ring-shaped resin part to form a first resin coating film. a step of arranging an annular jig on the annular resin portion; and a step of applying a homogeneous resin paint to the annular jig and the first resin coating to form a second resin coating; A method for manufacturing an electronic device, comprising the step of removing the annular resin portion, the first resin coating film, and the second resin coating together with the annular jig after drying.