JPS61123554U - - Google Patents
Info
- Publication number
- JPS61123554U JPS61123554U JP1985005844U JP584485U JPS61123554U JP S61123554 U JPS61123554 U JP S61123554U JP 1985005844 U JP1985005844 U JP 1985005844U JP 584485 U JP584485 U JP 584485U JP S61123554 U JPS61123554 U JP S61123554U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- diode array
- emitting diode
- optical
- silicone resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985005844U JPS61123554U (enExample) | 1985-01-19 | 1985-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985005844U JPS61123554U (enExample) | 1985-01-19 | 1985-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61123554U true JPS61123554U (enExample) | 1986-08-04 |
Family
ID=30482732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985005844U Pending JPS61123554U (enExample) | 1985-01-19 | 1985-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123554U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231120A (ja) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | 発光装置とその製造方法およびｌｅｄヘッドの製造方法 |
-
1985
- 1985-01-19 JP JP1985005844U patent/JPS61123554U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231120A (ja) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | 発光装置とその製造方法およびｌｅｄヘッドの製造方法 |