JPS61123466A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To assure solder adsorption and to permit easy maintenance in the stage of pressing a soldering iron to an adsorbent material and cleaning automatically the iron by feeding the adsorbent material by a fixed length at every cleaning of the specified number of times to renew the adsorptive surface. CONSTITUTION:A cleaning jig 10 is inserted to the lower part of the soldering iron 8 and the iron 8 is lowered onto the adsorbent material 11 to adsorb the solder 9 sticking to the tip of the iron 8 to the material 11 and thereafter the iron 8 is pulled up and the jig 10 is returned. After the prescribed number of the cleaning is executed by repeating the above-mentioned cleaning operation and using the same spot 15 of the material 11, a take-up reel 13 is rotated by a motor 14 to feed the material 11 by the fixed length and to renew the adsorptive surface of the material 11. The automatic soldering device which assures the adsorption of the solder and permits the easy maintenance is thus obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an automatic soldering device for removing solder adhering to a soldering iron.

Structure of the conventional example and its problems The conventional automatic soldering device uses a cleaning jig 1 made of a sponge-like soft material containing moisture as shown in Figure 1. There is a groove 3 that holds cleaning jig 1.
When the trowel moves forward, insert the tip 4 of the trowel 2 into the groove 3,
Scrape off the solder 6 when retreating.

However, with the above configuration, the solder that could not be removed may fall when the cleaning jig 1 retreats, or the solder e adhering to the placement groove 3 may fall off due to the impact when the cleaning jig moves forward or backward. This has the disadvantage that the solder scatters below the iron 2.

Further, regarding maintenance, it is necessary to handle a product with solder residue on its surface, which also has the disadvantage of being troublesome to handle.

OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides an automatic soldering device that reliably cleans solder adhering to a soldering iron, prevents solder from scattering, and is easy to maintain.

Structure of the Invention The present invention cleans the solder by applying a long solder adsorbent to a soldering iron, and then sends the solder adsorbent one by one to renew the adsorption surface, so that the solder is reliably adsorbed, there is no scattering, and maintenance is also easy. It is an easy automatic soldering device.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the i-plane.

FIG. 2 is a block diagram of an automatic soldering apparatus according to the first embodiment of the present invention, and FIG. 3 is a flowchart. In Fig. 2, 7 is an automatic soldering device, 8 is a soldering iron,
9 is solder attached to the tip of the iron, 1o is a cleaning jig, 11 is an adsorbent, 12 is an adsorbent reel, 13 is an adsorbent take-up reel, and 14 is an adsorbent that rotates the take-up reel 13 intermittently. motor as a driving source, 15 is a iron 8
The solder is more adsorbed to the adsorbent 11.

The operation of the automatic soldering apparatus configured as described above will be described below.

In Figure 2, the cleaning jig 10 is inserted below the iron 8. The iron 8 is lowered onto the adsorbent 11 of the cleaning jig 10, the solder 9 attached to the tip of the iron 8 is adsorbed, and the iron 8 is raised. The cleaning jig 10 is returned to finish cleaning.

The above cleaning operation is repeated a predetermined number of times. Adsorbent 11
After performing cleaning a predetermined number of times using the same point, the motor 14 rotates the take-up reel 13 at a certain angle to feed the adsorbent 11 a certain length, renewing the adsorption surface of the adsorbent 11, and repeating the process in the same manner. Perform cleaning.

Further, as shown in the flowchart of FIG. 3, whether or not to perform soldering iron cleaning 16 is automatically selected by soldering counter 17 and work waiting time timer 18.

As described above, according to this embodiment, the tip of the iron is applied to a long adsorbent to adsorb the solder, and after adsorbing the solder at the same point a certain number of times, the adsorbent is sent a certain length and the solder is removed. By renewing the suction surface that touches the surface and performing subsequent cleaning,
Solder adsorption is reliable, and maintenance can be easily performed by simply replacing the adsorbent reel.

A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 4 is a front view of an automatic soldering apparatus showing a second embodiment of the present invention, and FIG. 5 is a sectional view taken along A in the front view. In FIG. 4, 19 is a iron, 20 is a cleaning jig, 21 is an adsorbent, 22 is an adsorbent reel, 23 is a tension reel, 24 is a take-up reel, and 26 is a motor that rotates the take-up reel 24 intermittently. It is. In FIG. 6, 26 is a iron, 27 is the tip of the iron 26, and 28 is the tip of the iron 26;
The solder attached to y, 29 is a cleaning jig, 30 is an adsorbent, and 31 is a tension roller. This is because the cross-sectional shape of the adsorbent 21 is made the same as the cross-sectional shape of the tip of the iron 19 by inserting the second roller 23.

The operation of the automatic soldering apparatus configured as described above will be described below.

In FIG. 5, a cleaning jig 29 is placed below the iron 26.
Insert. The iron 26 is lowered onto the adsorbent 30 of the cleaning jig 29, the solder 28 adhering to the tip 27 of the iron 26 is adsorbed, and the iron 26 is raised. The cleaning jig 29 is returned to finish cleaning.

After performing the above-mentioned cleaning a predetermined number of times using the same point on the adsorbent 30, a motor (not shown) rotates the take-up reel at a certain angle to feed the adsorbent 30 a certain length.
The suction surface of 0 is updated, and cleaning is performed in the same manner thereafter.

As described above, by making the cross-sectional shape of the adsorbent 30 the same as the cross-sectional shape of the tip of the iron 26, the adhesion between the tip of the iron 26 and the adsorbent 30 is improved, and the tapered surface 27 of the iron 26 is
It can reliably adsorb solder attached to the surface.

Effects of the Invention As described above, in the present invention, the tip of the iron is applied to a long adsorbent to adsorb the solder, and after adsorbing the solder at the same point a certain number of times, the adsorbent is sent a certain length and the solder is removed. By renewing the suction surface that comes into contact with the solder and performing subsequent cleaning, the solder will be reliably adsorbed, and the solder will not scatter to the surrounding area.
In addition, maintenance is easy as it is only necessary to replace the entire reel of adsorbent, and its practical effects are significant.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a conventional automatic soldering device, FIG. 2 is a block diagram of an automatic soldering device according to a first embodiment of the present invention, FIG. 3 is a flowchart showing the operation of the device, and FIG.
The figure is a front view of an automatic soldering apparatus according to a second embodiment of the present invention, and FIG. 5 is a sectional view taken along line A in FIG. 4. 2.8, 19.26... Trowel, 10, 20.2
9...Cleaning jig, 11.21.30...
...Adsorbent material, 12.22...Adsorbent reel,
13.24...take-up reel, 14.25...mountain...
Motor, 23°31...Tension roller. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure ts2 figure

Claims (4)

[Claims] (1) An automatic soldering device that automatically cleans a soldering iron by bringing it into contact with an adsorbent, and is equipped with a drive source for feeding the adsorbent by a fixed length every time a long solder adsorbent is cleaned a certain number of times. Automatic soldering equipment. (2) The automatic soldering device according to claim 1, wherein the adsorbent is wound around a reel and the adsorbent is wound up by another reel. (3) The automatic soldering device according to claim 1, wherein the flat adsorbent material is deformed by a reel to have the same cross-sectional shape as the soldering iron. (4) The automatic soldering device according to claim 1, wherein whether or not to perform cleaning is automatically selected based on the number of soldering operations and the time interval between soldering operations.