JPS6112263U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS6112263U JPS6112263U JP9586784U JP9586784U JPS6112263U JP S6112263 U JPS6112263 U JP S6112263U JP 9586784 U JP9586784 U JP 9586784U JP 9586784 U JP9586784 U JP 9586784U JP S6112263 U JPS6112263 U JP S6112263U
- Authority
- JP
- Japan
- Prior art keywords
- reducing means
- strength reducing
- printed circuit
- circuit board
- assembled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図乃至第3図は本考案の第1の実施例を示し、第1
図はプリント基板の平面図、第2図は第1図のA−A線
に沿う部分を拡大した断面図、第3図は第1図の要部の
拡大斜視図である。
第4図は本考案の第2の実施例を示すプリント基板の要
部断面図、第5図は本考案の第3の実施例を示すプリン
ト基板の平面図である。
第6図及び第7図は従来のプリント基板を示し、第6図
はプリント基板の平面図、第7図は第6図のB−B線に
沿う部分に拡大した断面図である。
第8図は本考案番こ係るプリント基板が使用される電子
機器の一例を示す分解斜視図である。
第9図は耳部の切断によって一部が折損した従来のプリ
ント基板の一例を示す平面図である。
1・・・・・・プリント基板〔主要部〕、2・・・・・
・耳部、4・・・・・・打抜き孔、S・・・・・・切断
予定位置、a・・・・・・第1の強度低下手段、b・・
・・・・第2の強度低下手段。1 to 3 show a first embodiment of the present invention.
2 is a plan view of the printed circuit board, FIG. 2 is an enlarged cross-sectional view of a portion taken along line A--A in FIG. 1, and FIG. 3 is an enlarged perspective view of the main part of FIG. 1. FIG. 4 is a sectional view of a main part of a printed circuit board showing a second embodiment of the present invention, and FIG. 5 is a plan view of a printed circuit board showing a third embodiment of the present invention. 6 and 7 show conventional printed circuit boards, FIG. 6 is a plan view of the printed circuit board, and FIG. 7 is an enlarged cross-sectional view of a portion taken along line BB in FIG. 6. FIG. 8 is an exploded perspective view showing an example of an electronic device in which the printed circuit board of the present invention is used. FIG. 9 is a plan view showing an example of a conventional printed circuit board that is partially broken due to cutting of the ears. 1...Printed circuit board [main part], 2...
・Ear portion, 4...Punching hole, S...Planned cutting position, a...First strength reducing means, b...
...Second strength reducing means.
Claims (1)
断除去される保持用耳部と、切断容易のため前記主要部
と耳部の切断予定位置に形成された第1の強度低下手段
と、第1の強度低下手段に近接して前記主要部に穿設さ
れた打抜き孔と、前記打抜き孔と近接する部分に前記切
断予定位置に前記第1の強度低下手段に重ねて形成され
た第2の強度低下手段とを有することを特徴とするプリ
ント基板。A main part to which an electronic component is assembled, a holding ear part to be cut and removed after the electronic part is assembled, and a first strength reducing means formed at a planned cutting position of the main part and the ear part to facilitate cutting. , a punched hole bored in the main portion adjacent to the first strength reducing means, and a first strength reducing means formed in a portion adjacent to the punched hole at the planned cutting position overlapping the first strength reducing means. 2. A printed circuit board comprising: 2 strength reducing means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9586784U JPS6112263U (en) | 1984-06-25 | 1984-06-25 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9586784U JPS6112263U (en) | 1984-06-25 | 1984-06-25 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6112263U true JPS6112263U (en) | 1986-01-24 |
Family
ID=30655119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9586784U Pending JPS6112263U (en) | 1984-06-25 | 1984-06-25 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6112263U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010258251A (en) * | 2009-04-27 | 2010-11-11 | Keihin Corp | Aggregate substrate |
JP2011233687A (en) * | 2010-04-27 | 2011-11-17 | Kyocera Corp | Multipiece wiring board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5931091A (en) * | 1982-08-12 | 1984-02-18 | 三菱電機株式会社 | Hybrid integrated circuit device |
-
1984
- 1984-06-25 JP JP9586784U patent/JPS6112263U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5931091A (en) * | 1982-08-12 | 1984-02-18 | 三菱電機株式会社 | Hybrid integrated circuit device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010258251A (en) * | 2009-04-27 | 2010-11-11 | Keihin Corp | Aggregate substrate |
JP2011233687A (en) * | 2010-04-27 | 2011-11-17 | Kyocera Corp | Multipiece wiring board |
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