JPS6112263U - Printed board - Google Patents

Printed board

Info

Publication number
JPS6112263U
JPS6112263U JP9586784U JP9586784U JPS6112263U JP S6112263 U JPS6112263 U JP S6112263U JP 9586784 U JP9586784 U JP 9586784U JP 9586784 U JP9586784 U JP 9586784U JP S6112263 U JPS6112263 U JP S6112263U
Authority
JP
Japan
Prior art keywords
reducing means
strength reducing
printed circuit
circuit board
assembled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9586784U
Other languages
Japanese (ja)
Inventor
芳孝 中馬
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP9586784U priority Critical patent/JPS6112263U/en
Publication of JPS6112263U publication Critical patent/JPS6112263U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第3図は本考案の第1の実施例を示し、第1
図はプリント基板の平面図、第2図は第1図のA−A線
に沿う部分を拡大した断面図、第3図は第1図の要部の
拡大斜視図である。 第4図は本考案の第2の実施例を示すプリント基板の要
部断面図、第5図は本考案の第3の実施例を示すプリン
ト基板の平面図である。 第6図及び第7図は従来のプリント基板を示し、第6図
はプリント基板の平面図、第7図は第6図のB−B線に
沿う部分に拡大した断面図である。 第8図は本考案番こ係るプリント基板が使用される電子
機器の一例を示す分解斜視図である。 第9図は耳部の切断によって一部が折損した従来のプリ
ント基板の一例を示す平面図である。 1・・・・・・プリント基板〔主要部〕、2・・・・・
・耳部、4・・・・・・打抜き孔、S・・・・・・切断
予定位置、a・・・・・・第1の強度低下手段、b・・
・・・・第2の強度低下手段。
1 to 3 show a first embodiment of the present invention.
2 is a plan view of the printed circuit board, FIG. 2 is an enlarged cross-sectional view of a portion taken along line A--A in FIG. 1, and FIG. 3 is an enlarged perspective view of the main part of FIG. 1. FIG. 4 is a sectional view of a main part of a printed circuit board showing a second embodiment of the present invention, and FIG. 5 is a plan view of a printed circuit board showing a third embodiment of the present invention. 6 and 7 show conventional printed circuit boards, FIG. 6 is a plan view of the printed circuit board, and FIG. 7 is an enlarged cross-sectional view of a portion taken along line BB in FIG. 6. FIG. 8 is an exploded perspective view showing an example of an electronic device in which the printed circuit board of the present invention is used. FIG. 9 is a plan view showing an example of a conventional printed circuit board that is partially broken due to cutting of the ears. 1...Printed circuit board [main part], 2...
・Ear portion, 4...Punching hole, S...Planned cutting position, a...First strength reducing means, b...
...Second strength reducing means.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品が組付けられる主要部と、電子部品組付後に切
断除去される保持用耳部と、切断容易のため前記主要部
と耳部の切断予定位置に形成された第1の強度低下手段
と、第1の強度低下手段に近接して前記主要部に穿設さ
れた打抜き孔と、前記打抜き孔と近接する部分に前記切
断予定位置に前記第1の強度低下手段に重ねて形成され
た第2の強度低下手段とを有することを特徴とするプリ
ント基板。
A main part to which an electronic component is assembled, a holding ear part to be cut and removed after the electronic part is assembled, and a first strength reducing means formed at a planned cutting position of the main part and the ear part to facilitate cutting. , a punched hole bored in the main portion adjacent to the first strength reducing means, and a first strength reducing means formed in a portion adjacent to the punched hole at the planned cutting position overlapping the first strength reducing means. 2. A printed circuit board comprising: 2 strength reducing means.
JP9586784U 1984-06-25 1984-06-25 Printed board Pending JPS6112263U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9586784U JPS6112263U (en) 1984-06-25 1984-06-25 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9586784U JPS6112263U (en) 1984-06-25 1984-06-25 Printed board

Publications (1)

Publication Number Publication Date
JPS6112263U true JPS6112263U (en) 1986-01-24

Family

ID=30655119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9586784U Pending JPS6112263U (en) 1984-06-25 1984-06-25 Printed board

Country Status (1)

Country Link
JP (1) JPS6112263U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258251A (en) * 2009-04-27 2010-11-11 Keihin Corp Aggregate substrate
JP2011233687A (en) * 2010-04-27 2011-11-17 Kyocera Corp Multipiece wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931091A (en) * 1982-08-12 1984-02-18 三菱電機株式会社 Hybrid integrated circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931091A (en) * 1982-08-12 1984-02-18 三菱電機株式会社 Hybrid integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258251A (en) * 2009-04-27 2010-11-11 Keihin Corp Aggregate substrate
JP2011233687A (en) * 2010-04-27 2011-11-17 Kyocera Corp Multipiece wiring board

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