JPS61121779U - - Google Patents
Info
- Publication number
- JPS61121779U JPS61121779U JP487685U JP487685U JPS61121779U JP S61121779 U JPS61121779 U JP S61121779U JP 487685 U JP487685 U JP 487685U JP 487685 U JP487685 U JP 487685U JP S61121779 U JPS61121779 U JP S61121779U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flat pack
- hybrid integrated
- utility
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP487685U JPS61121779U (sl) | 1985-01-18 | 1985-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP487685U JPS61121779U (sl) | 1985-01-18 | 1985-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61121779U true JPS61121779U (sl) | 1986-07-31 |
Family
ID=30480870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP487685U Pending JPS61121779U (sl) | 1985-01-18 | 1985-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121779U (sl) |
-
1985
- 1985-01-18 JP JP487685U patent/JPS61121779U/ja active Pending
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