JPS61121739U - - Google Patents
Info
- Publication number
- JPS61121739U JPS61121739U JP337685U JP337685U JPS61121739U JP S61121739 U JPS61121739 U JP S61121739U JP 337685 U JP337685 U JP 337685U JP 337685 U JP337685 U JP 337685U JP S61121739 U JPS61121739 U JP S61121739U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafers
- jig
- grooves
- jig body
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 3
- 238000009434 installation Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Warehouses Or Storage Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP337685U JPS61121739U (ko) | 1985-01-14 | 1985-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP337685U JPS61121739U (ko) | 1985-01-14 | 1985-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61121739U true JPS61121739U (ko) | 1986-07-31 |
Family
ID=30477944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP337685U Pending JPS61121739U (ko) | 1985-01-14 | 1985-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121739U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015173171A (ja) * | 2014-03-11 | 2015-10-01 | セイコーインスツル株式会社 | ウェハキャリア及びウェハキャリアからウェハを取り出す方法 |
-
1985
- 1985-01-14 JP JP337685U patent/JPS61121739U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015173171A (ja) * | 2014-03-11 | 2015-10-01 | セイコーインスツル株式会社 | ウェハキャリア及びウェハキャリアからウェハを取り出す方法 |