JPS61119004A - Resistance value correction for thick film resistor - Google Patents
Resistance value correction for thick film resistorInfo
- Publication number
- JPS61119004A JPS61119004A JP59241536A JP24153684A JPS61119004A JP S61119004 A JPS61119004 A JP S61119004A JP 59241536 A JP59241536 A JP 59241536A JP 24153684 A JP24153684 A JP 24153684A JP S61119004 A JPS61119004 A JP S61119004A
- Authority
- JP
- Japan
- Prior art keywords
- resistance value
- thick film
- film resistor
- resistor
- value correction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板上に形成した厚膜抵抗体の抵抗値修正方
法に係り、とくに設計値より高い厚膜抵抗体上に抵抗体
材料を印刷形成して、抵抗値を低下せしめるようにした
厚膜抵抗体の抵抗値修正方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for modifying the resistance value of a thick film resistor formed on a substrate, and particularly relates to a method for modifying the resistance value of a thick film resistor formed on a substrate. The present invention relates to a method for modifying the resistance value of a thick film resistor that is printed and formed to lower the resistance value.
一般に基板上に印刷形成された厚膜抵抗体は、抵抗値が
設計値より低い場合はトリミングにより抵抗値を上げる
ことは可能であるが、抵抗値が設計値より高い場合は修
正が不可能である。In general, for thick film resistors printed on a substrate, if the resistance value is lower than the design value, it is possible to increase the resistance value by trimming, but if the resistance value is higher than the design value, it cannot be corrected. be.
第３図は、従来の厚膜抵抗体形成方法の順序を説明する
ための（ａｌは電極導体形成の側面図、（ｂ）は厚膜抵
抗体形成の側面図、（Ｃ）は抵抗測定側面図で、第４図
は、従来の厚膜抵抗体形成方法の作業工程図である。Figure 3 is a diagram for explaining the order of the conventional thick film resistor forming method (al is a side view of electrode conductor formation, (b) is a side view of thick film resistor formation, and (C) is a side view of resistance measurement. In the figure, FIG. 4 is a work process diagram of a conventional thick film resistor forming method.
第３図の厚膜抵抗体形成方法を第４図の作業工程図を参
照しながら説明する。第３図（ａｌは、アルミナ等から
なる基板１上に、導体たとえば銅等の電極導体２を所定
の距離を隔てて形成（第４図の工程１１）シ、次に第３
図中）の如く電極導体２の間に抵抗体材料を厚膜印刷し
て乾燥、焼成をして厚膜抵抗体３を形成（第４図の工程
１２）する。そして第３図（Ｃ１に示すように厚膜抵抗
３を形成した両端の電極導体２間の抵抗を抵抗測定器４
で測定（第４図の工程１３）シて、その測定した抵抗値
が所定抵抗値より低い時は、第４図のトリミング工程１
４により抵抗値を調整するが、測定した抵抗値が所定抵
抗値より高い時は抵抗値の調整が不可能であるので、第
４図の工程１５により廃却する。The method for forming the thick film resistor shown in FIG. 3 will be explained with reference to the work process diagram shown in FIG. 4. FIG. 3 (al) is a substrate 1 made of alumina or the like, on which electrode conductors 2 made of copper or the like are formed at a predetermined distance (step 11 in FIG. 4);
As shown in the figure), a resistor material is printed in a thick film between the electrode conductors 2, dried and fired to form a thick film resistor 3 (step 12 in Figure 4). Then, as shown in FIG.
(step 13 in Figure 4), and if the measured resistance value is lower than the predetermined resistance value, proceed to the trimming step 1 in Figure 4.
However, if the measured resistance value is higher than a predetermined resistance value, it is impossible to adjust the resistance value, so the resistance value is discarded in step 15 of FIG.
上記厚膜抵抗体形成方法にあっては、形成した厚膜抵抗
体３の抵抗値の測定結果が回路設計に基づく所定抵抗値
より高い時は抵抗値の調整が不可能であるので、不良品
として廃却を余儀なくされ不経済であるという問題点が
あった。In the method for forming a thick film resistor described above, when the measurement result of the resistance value of the formed thick film resistor 3 is higher than a predetermined resistance value based on the circuit design, it is impossible to adjust the resistance value. The problem was that it was uneconomical and forced to be scrapped.
本発明は、上記の問題点を解決するために抵抗値の修正
を企図した厚膜抵抗体の抵抗値修正方法を提供するもの
で、その手段は、基板上の電極間に形成されてなる厚膜
抵抗体の抵抗値修正方法において、前記厚膜抵抗体上に
任意の抵抗率を有する抵抗体材料を印刷形成したことに
よって達成される。The present invention provides a method for modifying the resistance value of a thick film resistor intended to modify the resistance value in order to solve the above-mentioned problems. In the method for modifying the resistance value of a film resistor, this is achieved by printing a resistor material having an arbitrary resistivity on the thick film resistor.
上記厚膜抵抗体の抵抗値修正方法は、基板上に既に形成
されている厚膜抵抗体の上に重畳して、任意の抵抗体材
料を印刷形成して、乾燥、焼成して抵抗値を低くし、ト
リミング工程により抵抗値を調整できるようにした経済
的なものである。The above method for modifying the resistance value of a thick film resistor is to print a desired resistor material on top of the thick film resistor already formed on the substrate, dry it, and bake it to adjust the resistance value. This is an economical method in which the resistance value can be adjusted by a trimming process.
以下図面を参照しながら本発明に係る厚膜抵抗体の抵抗
値修正方法の実施例について詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the method for modifying the resistance value of a thick film resistor according to the present invention will be described in detail below with reference to the drawings.
第１図および第２図は、本発明に係る厚膜抵抗体の抵抗
値修正方法の一実施例を説明するための第１図は厚膜抵
抗形成方法の順序を説明するための図、第２図は厚膜抵
抗形成方法の作業工程図である。第１図および第２図に
おいて、この発明の厚膜抵抗体の抵抗値修正方法は第３
図および第４図と同様、電極導体形成、抵抗体形成、抵
抗値測定ならびにトリミング工程等を行なっているが、
該抵抗値測定工程とトリミング工程間に抵抗値修正工程
１６を追加した点に特徴を有する。したがワて抵抗値修
正工程１６以外の部分には第３図および第４図と同じ符
号を付しており、ここではこれらの部分の説明は省略す
るものとする。1 and 2 are diagrams for explaining an embodiment of the method for modifying the resistance value of a thick film resistor according to the present invention, and FIG. FIG. 2 is a work process diagram of the thick film resistor forming method. 1 and 2, the method for correcting the resistance value of a thick film resistor according to the present invention is shown in the third example.
As shown in Figures and Figure 4, electrode conductor formation, resistor formation, resistance value measurement, trimming process, etc. are performed.
The present invention is characterized in that a resistance value correction step 16 is added between the resistance value measurement step and the trimming step. However, the parts other than the wire resistance value correction step 16 are given the same reference numerals as in FIGS. 3 and 4, and the explanation of these parts will be omitted here.
本発明を特徴づける抵抗値修正工程１６は、基板１上に
既に形成されている厚膜抵抗体３の、抵抗値測定結果が
設計値より高いときに、厚膜抵抗体３の上に任意の抵抗
体材料を印刷形成して、２層目の厚膜抵抗体５を形成し
て抵抗値を低くしたるのち、トリミング工程１４で調整
を行なう構成としたものである。In the resistance value correction step 16 that characterizes the present invention, when the resistance value measurement result of the thick film resistor 3 already formed on the substrate 1 is higher than the design value, an arbitrary The configuration is such that after the resistor material is printed and formed to form the second layer of thick film resistor 5 to lower the resistance value, adjustment is performed in the trimming step 14.
以上の説明から明らかなように本発明に係る厚膜抵抗体
の抵抗値修正方法によれば、いままで不良として廃却し
ていた部品を良品とすることが可能となり、歩留°りが
向上するので経済的にきわめて有効である。As is clear from the above explanation, according to the method for correcting the resistance value of a thick film resistor according to the present invention, parts that were previously discarded as defective can be made into good parts, and the yield is improved. Therefore, it is extremely effective economically.
第１図および第２図は、本発明に係る厚膜抵抗体の抵抗
値修正方法の一実施例を説明するための第１図は厚膜抵
抗形成方法の順序を説明するための図、第２図は厚膜抵
抗形成方法の作業工程図、第３図は、従来の厚膜抵抗体
形成方法の順序を説明するための（ａ）は電極導体形成
の側面図、 （ｂｌは厚膜抵抗体形成の側面図、（Ｃ）
は抵抗測定側面図、第４図は、従来の厚膜抵抗体形成方
法のの作業工程図である。
図中、１は基板、２は電極導体、３は厚膜抵抗体、４は
抵抗値測定器、５は２層目の厚膜抵抗体、１１は電極導
体形成工程、１２は厚膜抵抗体形成工程、１３は抵抗値
測定工程、１４はトリミング工程、１５は廃却工程、１
６は抵抗体修正工程、をそれぞれ示す。1 and 2 are diagrams for explaining an embodiment of the method for modifying the resistance value of a thick film resistor according to the present invention, and FIG. Figure 2 is a working process diagram of the thick film resistor forming method, Figure 3 is a side view of electrode conductor formation for explaining the order of the conventional thick film resistor forming method, (bl is the thick film resistor) Side view of body formation, (C)
4 is a side view of resistance measurement, and FIG. 4 is a work process diagram of a conventional thick film resistor forming method. In the figure, 1 is a substrate, 2 is an electrode conductor, 3 is a thick film resistor, 4 is a resistance value measuring device, 5 is a second layer thick film resistor, 11 is an electrode conductor forming process, and 12 is a thick film resistor 1 is a forming process, 13 is a resistance value measurement process, 14 is a trimming process, 15 is a disposal process, 1
6 shows a resistor modification process.
Claims (1)
正方法において、前記厚膜抵抗体上に任意の抵抗率を有
する抵抗体材料を印刷形成したことを特徴とする厚膜抵
抗体の抵抗値修正方法。A method for modifying the resistance value of a thick film resistor formed between electrodes on a substrate, characterized in that a resistor material having an arbitrary resistivity is printed on the thick film resistor. How to correct the resistance value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59241536A JPS61119004A (en) | 1984-11-14 | 1984-11-14 | Resistance value correction for thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59241536A JPS61119004A (en) | 1984-11-14 | 1984-11-14 | Resistance value correction for thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61119004A true JPS61119004A (en) | 1986-06-06 |
Family
ID=17075809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59241536A Pending JPS61119004A (en) | 1984-11-14 | 1984-11-14 | Resistance value correction for thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61119004A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10109398B2 (en) | 2014-09-25 | 2018-10-23 | Koa Corporation | Chip resistor and method for producing same |
-
1984
- 1984-11-14 JP JP59241536A patent/JPS61119004A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10109398B2 (en) | 2014-09-25 | 2018-10-23 | Koa Corporation | Chip resistor and method for producing same |
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