JPS61114834U - - Google Patents

Info

Publication number
JPS61114834U
JPS61114834U JP1984199366U JP19936684U JPS61114834U JP S61114834 U JPS61114834 U JP S61114834U JP 1984199366 U JP1984199366 U JP 1984199366U JP 19936684 U JP19936684 U JP 19936684U JP S61114834 U JPS61114834 U JP S61114834U
Authority
JP
Japan
Prior art keywords
frame
heater block
moving body
mounting surface
linked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984199366U
Other languages
English (en)
Other versions
JPH029557Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984199366U priority Critical patent/JPH029557Y2/ja
Publication of JPS61114834U publication Critical patent/JPS61114834U/ja
Application granted granted Critical
Publication of JPH029557Y2 publication Critical patent/JPH029557Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図および第２図は本考案の一実施例を示し
、第１図はヒータブロツクの退避状態を示す正面
図、第２図はフレームの固定状態を示す連係部の
断面図、第３図は従来のフレーム押え装置を示す
正面図である。 ５……ヒータブロツク、１９，２７……フレー
ム押え、２９……移動体、３０……作動片、３２
……ばね板、３３……送りねじ、３６……制御モ
ータ、３９……送の機構。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) フレームをボンデイングステーシヨンの載
    置面に固定および固定解除を行うボンダのフレー
    ム固定装置において、ヒータブロツクの載置面に
    対向されこの載置面と一定の間隙を介して固定配
    設されたフレーム押えと、ヒータブロツクに連係
    してヒータブロツクをフレーム押え側およびその
    反対側に往復連動させる移動体と、この移動体の
    移動量および移動速度を制御可能な移動体の送り
    機構とを含み、前記移動体は、フレーム押え側に
    移動するときにヒータブロツクに連係するばね体
    と、その反対側に移動するときにヒータブロツク
    に連係する作動片とを有することを特徴とするボ
    ンダのフレーム固定装置。 (2) 送り機構が、移動体に螺合する送りねじと
    、この送りねじを回転制御する制御モータとから
    なることを特徴とする実用新案登録請求の範囲第
    (1)項記載のボンダのフレーム固定装置。
JP1984199366U 1984-12-28 1984-12-28 Expired JPH029557Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984199366U JPH029557Y2 (ja) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984199366U JPH029557Y2 (ja) 1984-12-28 1984-12-28

Publications (2)

Publication Number Publication Date
JPS61114834U true JPS61114834U (ja) 1986-07-19
JPH029557Y2 JPH029557Y2 (ja) 1990-03-09

Family

ID=30759222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984199366U Expired JPH029557Y2 (ja) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPH029557Y2 (ja)

Also Published As

Publication number Publication date
JPH029557Y2 (ja) 1990-03-09

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