JPS61114834U - - Google Patents

Info

Publication number
JPS61114834U
JPS61114834U JP1984199366U JP19936684U JPS61114834U JP S61114834 U JPS61114834 U JP S61114834U JP 1984199366 U JP1984199366 U JP 1984199366U JP 19936684 U JP19936684 U JP 19936684U JP S61114834 U JPS61114834 U JP S61114834U
Authority
JP
Japan
Prior art keywords
frame
heater block
moving body
mounting surface
linked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984199366U
Other languages
English (en)
Japanese (ja)
Other versions
JPH029557Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984199366U priority Critical patent/JPH029557Y2/ja
Publication of JPS61114834U publication Critical patent/JPS61114834U/ja
Application granted granted Critical
Publication of JPH029557Y2 publication Critical patent/JPH029557Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1984199366U 1984-12-28 1984-12-28 Expired JPH029557Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984199366U JPH029557Y2 (en:Method) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984199366U JPH029557Y2 (en:Method) 1984-12-28 1984-12-28

Publications (2)

Publication Number Publication Date
JPS61114834U true JPS61114834U (en:Method) 1986-07-19
JPH029557Y2 JPH029557Y2 (en:Method) 1990-03-09

Family

ID=30759222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984199366U Expired JPH029557Y2 (en:Method) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPH029557Y2 (en:Method)

Also Published As

Publication number Publication date
JPH029557Y2 (en:Method) 1990-03-09

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