JPS6111479B2 - - Google Patents
Info
- Publication number
- JPS6111479B2 JPS6111479B2 JP4498380A JP4498380A JPS6111479B2 JP S6111479 B2 JPS6111479 B2 JP S6111479B2 JP 4498380 A JP4498380 A JP 4498380A JP 4498380 A JP4498380 A JP 4498380A JP S6111479 B2 JPS6111479 B2 JP S6111479B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- adhesive layer
- printed
- producing
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000002788 crimping Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000009702 powder compression Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4498380A JPS5720493A (en) | 1980-04-04 | 1980-04-04 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4498380A JPS5720493A (en) | 1980-04-04 | 1980-04-04 | Method of producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5720493A JPS5720493A (en) | 1982-02-02 |
| JPS6111479B2 true JPS6111479B2 (US20050075337A1-20050407-C00081.png) | 1986-04-03 |
Family
ID=12706692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4498380A Granted JPS5720493A (en) | 1980-04-04 | 1980-04-04 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5720493A (US20050075337A1-20050407-C00081.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345382U (US20050075337A1-20050407-C00081.png) * | 1989-09-12 | 1991-04-26 |
-
1980
- 1980-04-04 JP JP4498380A patent/JPS5720493A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345382U (US20050075337A1-20050407-C00081.png) * | 1989-09-12 | 1991-04-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5720493A (en) | 1982-02-02 |
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