JPS61112646U - - Google Patents

Info

Publication number
JPS61112646U
JPS61112646U JP19840784U JP19840784U JPS61112646U JP S61112646 U JPS61112646 U JP S61112646U JP 19840784 U JP19840784 U JP 19840784U JP 19840784 U JP19840784 U JP 19840784U JP S61112646 U JPS61112646 U JP S61112646U
Authority
JP
Japan
Prior art keywords
cooling
wind cylinder
attached
semiconductor device
cooling fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19840784U
Other languages
English (en)
Other versions
JPH0333076Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984198407U priority Critical patent/JPH0333076Y2/ja
Publication of JPS61112646U publication Critical patent/JPS61112646U/ja
Application granted granted Critical
Publication of JPH0333076Y2 publication Critical patent/JPH0333076Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の実施例の半導体素子スタツク
の部分正面図、第２図は第１図の―矢視断面
図、第３図は従来の半導体素子スタツクの正面図
、第４図は第３図の―矢視断面図、第５図は
プリント板基板に取付けた従来の半導体素子スタ
ツクの断面図である。 １：半導体素子、２：冷却体、４：フアン、５
：プリント板基板、６：絶縁間座。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を取付けた２個の冷却体を、素子取
    付面を平行させ、冷却フインを対向させて突合わ
    せるように配置して、冷却フインで風胴を形成し
    、その風胴に冷却風を送るフアンを冷却体の端部
    に取付けたことを特徴とする半導体素子スタツク
    。
JP1984198407U 1984-12-26 1984-12-26 Expired JPH0333076Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984198407U JPH0333076Y2 (ja) 1984-12-26 1984-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984198407U JPH0333076Y2 (ja) 1984-12-26 1984-12-26

Publications (2)

Publication Number Publication Date
JPS61112646U true JPS61112646U (ja) 1986-07-16
JPH0333076Y2 JPH0333076Y2 (ja) 1991-07-12

Family

ID=30757374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984198407U Expired JPH0333076Y2 (ja) 1984-12-26 1984-12-26

Country Status (1)

Country Link
JP (1) JPH0333076Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216155A (ja) * 2014-05-08 2015-12-03 株式会社三社電機製作所 電子機器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322371A (en) * 1976-08-13 1978-03-01 Hitachi Ltd Wind coller for semiconductor stacks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322371A (en) * 1976-08-13 1978-03-01 Hitachi Ltd Wind coller for semiconductor stacks

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216155A (ja) * 2014-05-08 2015-12-03 株式会社三社電機製作所 電子機器

Also Published As

Publication number Publication date
JPH0333076Y2 (ja) 1991-07-12

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