JPS61111158U - - Google Patents

Info

Publication number
JPS61111158U
JPS61111158U JP1984070597U JP7059784U JPS61111158U JP S61111158 U JPS61111158 U JP S61111158U JP 1984070597 U JP1984070597 U JP 1984070597U JP 7059784 U JP7059784 U JP 7059784U JP S61111158 U JPS61111158 U JP S61111158U
Authority
JP
Japan
Prior art keywords
connecting plate
resin
semiconductor device
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984070597U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984070597U priority Critical patent/JPS61111158U/ja
Publication of JPS61111158U publication Critical patent/JPS61111158U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/076Connecting or disconnecting of strap connectors
    • H10W72/07651Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/076Connecting or disconnecting of strap connectors
    • H10W72/07651Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/60Strap connectors, e.g. thick copper clips for grounding of power devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984070597U 1984-05-15 1984-05-15 Pending JPS61111158U (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984070597U JPS61111158U (https=) 1984-05-15 1984-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984070597U JPS61111158U (https=) 1984-05-15 1984-05-15

Publications (1)

Publication Number Publication Date
JPS61111158U true JPS61111158U (https=) 1986-07-14

Family

ID=30607318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984070597U Pending JPS61111158U (https=) 1984-05-15 1984-05-15

Country Status (1)

Country Link
JP (1) JPS61111158U (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939229A (https=) * 1972-08-22 1974-04-12
JPS5348465A (en) * 1976-10-15 1978-05-01 Hitachi Ltd Connecting method of lead frame utilizing through-holes
JPS5625238U (https=) * 1979-08-04 1981-03-07
JPS56142659A (en) * 1980-04-07 1981-11-07 Nec Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939229A (https=) * 1972-08-22 1974-04-12
JPS5348465A (en) * 1976-10-15 1978-05-01 Hitachi Ltd Connecting method of lead frame utilizing through-holes
JPS5625238U (https=) * 1979-08-04 1981-03-07
JPS56142659A (en) * 1980-04-07 1981-11-07 Nec Corp Semiconductor device

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