JPS61109169U - - Google Patents
Info
- Publication number
- JPS61109169U JPS61109169U JP1984195064U JP19506484U JPS61109169U JP S61109169 U JPS61109169 U JP S61109169U JP 1984195064 U JP1984195064 U JP 1984195064U JP 19506484 U JP19506484 U JP 19506484U JP S61109169 U JPS61109169 U JP S61109169U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- wiring board
- multilayer printed
- interior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984195064U JPH0132374Y2 (es) | 1984-12-22 | 1984-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984195064U JPH0132374Y2 (es) | 1984-12-22 | 1984-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61109169U true JPS61109169U (es) | 1986-07-10 |
| JPH0132374Y2 JPH0132374Y2 (es) | 1989-10-03 |
Family
ID=30752554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984195064U Expired JPH0132374Y2 (es) | 1984-12-22 | 1984-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0132374Y2 (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333898A (ja) * | 1986-07-28 | 1988-02-13 | 新神戸電機株式会社 | 電磁シ−ルド両面印刷回路板の製造法 |
-
1984
- 1984-12-22 JP JP1984195064U patent/JPH0132374Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333898A (ja) * | 1986-07-28 | 1988-02-13 | 新神戸電機株式会社 | 電磁シ−ルド両面印刷回路板の製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0132374Y2 (es) | 1989-10-03 |