JPS611070A - Mounting method of light emitting diode - Google Patents
Mounting method of light emitting diodeInfo
- Publication number
- JPS611070A JPS611070A JP60105808A JP10580885A JPS611070A JP S611070 A JPS611070 A JP S611070A JP 60105808 A JP60105808 A JP 60105808A JP 10580885 A JP10580885 A JP 10580885A JP S611070 A JPS611070 A JP S611070A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- bracket
- emitting diode
- light emitting
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 210000000078 claw Anatomy 0.000 claims description 9
- 239000013013 elastic material Substances 0.000 claims description 2
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は発光ダイオードの取付構造に係り、さらに詳し
く述べると、ゴム製などの弾性体よりなるブラケットに
発光ダイオードを挿入自立サソーそのブラケットにプリ
ント板を載重し、前記発光ダイオードをプリント板の配
線回路に接続すべくなした発光ダイオードの取付構造の
改９に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting structure for a light emitting diode, and more specifically, a light emitting diode is inserted into a bracket made of an elastic material such as rubber, and a printed board is placed on the bracket. This invention relates to a modification 9 of a light emitting diode mounting structure for connecting the diode to a wiring circuit of a printed board.
従来の前記の如き発光ダイオードの取付けは、第１図１
及び第２図に示すように、ブラケット１の内部の凹部６
に下方より発光ダイオード９を嵌入して自立させ、かつ
該発光ダイオード９のリード線１０をブラケット１の引
出用孔８に挿通し、ブラケット１上に突出したリード線
１０をプリント板１１に挿通すると共に、そのプリント
板１１をブラケット１上に載１１し、プリント板１１の
配線回路とリード線１０とをハンダ付して接続すること
によりプリント板１１をブラケット１に同市している。The conventional installation of a light emitting diode as described above is shown in Fig. 1.
and a recess 6 inside the bracket 1, as shown in FIG.
The light emitting diode 9 is fitted from below to stand on its own, the lead wire 10 of the light emitting diode 9 is inserted into the extraction hole 8 of the bracket 1, and the lead wire 10 protruding above the bracket 1 is inserted into the printed board 11. At the same time, the printed board 11 is placed on the bracket 1, and the wiring circuit of the printed board 11 and the lead wire 10 are connected by soldering, thereby attaching the printed board 11 to the bracket 1.
なお、第１図および第２図において、２はブラケットの
上端に形成したフランジ部、ろはブラケットの側面に設
けた爪、４は前記フランジ部２と爪３との間に形成した
すき間、５はフランク部２の下方に設けたブラケット１
０回転防止用の突起であって−パネル１４には図示しな
いが前記の回転防止用突起５の嵌合部を有する変形丸孔
を穿設しておき、第２図に示す如く、フランジ部２と爪
３ （複数）との間にパネル１４を挾んでブラケット１
をパネル１Ａに組付ける。７はリード線引出用孔８の隔
壁、１２はプリント板１１に穿設したリード線挿通孔、
１３は外部回路との接続用リード線である。In FIGS. 1 and 2, 2 is a flange formed at the upper end of the bracket, the filter is a claw provided on the side surface of the bracket, 4 is a gap formed between the flange 2 and the claw 3, and 5 is a gap formed between the flange 2 and the claw 3. is the bracket 1 installed below the flank part 2.
Although not shown in the panel 14, a deformed round hole having a fitting portion for the rotation prevention projection 5, which is a projection for preventing zero rotation, is drilled in the panel 14, and as shown in FIG. and the bracket 1 with the panel 14 sandwiched between the nails 3 (plurality).
Assemble to panel 1A. 7 is a partition wall of the lead wire drawing hole 8; 12 is a lead wire insertion hole drilled in the printed board 11;
13 is a lead wire for connection with an external circuit.
従来の発光ダイオード取付構造は、前記の如く、発光ダ
イオード９をブラケット１に取付けると共に、そのリー
ド線１０をプリント板１１に押通し、その状態でプリン
ト板１１が外れないようにして直ちにハンダ付作業を行
なわなければならない。In the conventional light emitting diode mounting structure, as described above, the light emitting diode 9 is mounted on the bracket 1, and its lead wire 10 is pushed through the printed board 11, and in this state, the printed board 11 is prevented from coming off, and the soldering work is immediately performed. must be carried out.
このため−発光ダイオード９の取付、リード線１０のハ
ンダ付けなどの各々の作業を単一作業毎に分けて行なう
ことができないので、作業全体の効率が悪い問題がめる
ｏまた、発光ダイオード９は一般に外径寸法が３φ、管
長５．５Ｕなどと極めて小型であり、これを取付けるブ
ラケット１やプリント板１１も小型であるので、組立上
その取扱いがすこぶる不便である。For this reason, each work such as mounting the light emitting diode 9 and soldering the lead wire 10 cannot be performed separately for each task, resulting in a problem of poor overall work efficiency.In addition, the light emitting diode 9 is generally It is extremely small with an outer diameter of 3φ and a pipe length of 5.5U, and the bracket 1 and printed board 11 to which it is attached are also small, making it very inconvenient to handle when assembling it.
本発明は前記従来の問題点に鑑み、複数個のプリント板
を一連に連接させておき、その各プリント板とブラケッ
トとを外れないように組付けられるようにし、かぐして
発光ダイオードの取付、ハンダ付けなどの作業を単一作
業毎に分けて能率的に行ない、最後に各プリント板を分
割することにより能率的にかつ容易に組付は得る如くし
た発光ダイオードの取付構造を提供せんとするものであ
る０
次に、本発明の実施の一例を第３図乃至第６（支）につ
いて説明する。第３図及び第４図は本弁明のブラケット
を示す図−第５図はブラケットとプリント板との取付状
態を示す図、第６図はパネルに取付けた状態の断面［ン
１である。In view of the above-mentioned conventional problems, the present invention connects a plurality of printed boards in a series, allows each printed board and bracket to be assembled without coming off, and attaches a light emitting diode by sniffing. To provide a light emitting diode mounting structure in which work such as soldering is efficiently performed by dividing each work into single work, and finally assembly can be achieved efficiently and easily by dividing each printed board. Next, an example of the implementation of the present invention will be described with reference to FIGS. 3 to 6 (subsection). 3 and 4 are views showing the bracket of the present invention, FIG. 5 is a view showing how the bracket is attached to a printed board, and FIG. 6 is a cross-sectional view of the bracket when it is attached to a panel.
本発明は、ブラケット１にプリント板１１の位置決め突
起１５ａ％ １５１）を少なくとも２個突設すると共に
、その位置決め突起に内方に向う係止爪１６ａ、１６ｂ
を設け、これによりブラケット１にプリント板１１をず
れることがないように組付けられるようにし、かつ複数
個のプリント板１１を一連に連接した状態で一体に成形
し〜この一連のプリント板に前記ブラケット１を夫々組
付け、発光ダイオードを各ブラケットに取付けた後、前
記一連のプリント板を夫々１個毎に分離するようにした
ものである〇
すなわち、本発明においては、第３図及び第４図に示す
ように、ブラケット１のフランク部２の四隅に上方に向
って突出する位置決め突起１５ａ。In the present invention, at least two protrusions 15a, 151) for positioning the printed board 11 are protruded from the bracket 1, and locking claws 16a, 16b facing inward are provided on the positioning protrusions.
This allows the printed board 11 to be assembled to the bracket 1 without shifting, and a plurality of printed boards 11 are connected in a series and integrally molded. After the brackets 1 are assembled and the light emitting diodes are attached to each bracket, the series of printed boards are separated one by one. That is, in the present invention, FIGS. As shown in the figure, positioning projections 15a project upward at the four corners of the flank portion 2 of the bracket 1.
１５ｂを夫々形成し、かつ該各位置決め突起１５ａ、１
５ｂに内方に向う係止爪１６ａ、１６ｂを設ける○そし
て前記位置決め突起１５ａ、１５ｂに対応する切欠部１
７ａ、１７ｂをプリント板１１に形成し、該プリント板
１１の切欠部１７ａ、１７ｂを前記ブラケット１の位置
決め突起１５ａ、１５ｂに適合させることによジブラケ
ット１に対するプリント板１１の位置決めを行い、かつ
前記係止爪１６ａ、１６ｂによってプリント板１１を押
えつけてブラケット１とプリント板１１とを組付けられ
るようにする。15b, and each positioning protrusion 15a, 1
5b is provided with locking claws 16a, 16b facing inward; and notches 1 corresponding to the positioning protrusions 15a, 15b.
7a and 17b are formed on the printed board 11, and the notches 17a and 17b of the printed board 11 are adapted to the positioning protrusions 15a and 15b of the bracket 1, thereby positioning the printed board 11 with respect to the bracket 1, and The printed board 11 is pressed down by the locking claws 16a and 16b so that the bracket 1 and the printed board 11 can be assembled.
また、プリント板１１け〜第５図に示すように、複数個
を一連に連接させて一体成形し、その各プリント板１１
とこれに隣接するプリント板との間にミシン目孔などの
分割線２０を設け、該分割線２０より折曲げることによ
り各プリント板１１を分離できるようにする。In addition, as shown in FIG.
A dividing line 20 such as a perforation is provided between the printed board 11 and an adjacent printed board, and each printed board 11 can be separated by bending from the dividing line 20.
２２はプリント板１１に設けた発光ダイオードのリード
線挿通孔〜２３は同じく外部回路接続用リード線挿通孔
−２４は同じくランドであって、これらは符号２〜５と
共に従来と同様である。22 is a lead wire insertion hole for a light emitting diode provided on the printed board 11, and 23 is a land, and a lead wire insertion hole 24 for connecting an external circuit is a land, and these are the same as the conventional ones along with numerals 2 to 5.
本発明の発光ダイオード取付構造は〜前記の如き構成で
あるから、一連に連接された多数個のプリント板を夫々
のブラケット１に対し位置決め突起１５ａ、１５ｂによ
り位置決めすると共に、係止爪１６ａ、１６ｂにより押
えつけて組付けていき、その後−発光ダイオード９を取
付け、リード線１０のハンダ付作業を行ない、最後に各
プリント板１１をその分割線２０より分離することによ
り個々の発光ダイオード組立体を得ることができるＯ
このように、本発明においては、ブラケット１とプリン
ト板１１との組付作業、ブラケット１に対する発光ダイ
オード９の組付作業−発光ダイオードのリード線１０の
ハンダ付作業などケ各作業毎の単一作業として行なうこ
とができるため、全体の作業能率を向上させることがで
き、かつ、複数個のプリント板１１が一連に連接された
状態でこれらの作業を行なうので、その１個１個は極め
て小さい部品であっても、組付作業時の取扱い性を顕著
に向上させることができる＠半がある。Since the light emitting diode mounting structure of the present invention has the configuration as described above, a large number of printed boards connected in series are positioned with respect to each bracket 1 by the positioning protrusions 15a, 15b, and the locking claws 16a, 16b After that, the light emitting diode 9 is attached, the lead wire 10 is soldered, and finally each printed board 11 is separated from its dividing line 20 to separate the individual light emitting diode assemblies. As described above, in the present invention, various tasks such as assembling the bracket 1 and the printed board 11, assembling the light emitting diode 9 to the bracket 1, and soldering the lead wire 10 of the light emitting diode are performed. Since each work can be performed as a single work, the overall work efficiency can be improved, and since these works are performed with a plurality of printed boards 11 connected in series, one of them Even if one part is extremely small, there is a @half part that can significantly improve handling during assembly work.
第１図は従来のブラケットを示す正面図、第２図は従来
の取付構造を示す断面図である。第６図乃至第６図は本
発明の一実施例を示し、第３図はブラケットの正面図、
第４図は同じく平面図、第５図はブラケットとプリント
板との取付状態を示す平面図、第６図はパネルに取付け
た状態の断面図である。
１・・・ブラケット、９・・・発光ダイオード、１０・
・発光ダイオードのリード線、１１・・プリント板、１
５ａ、１５ｂ・位置決め突起−１６ａ、１６ｂ・・係止
爪、１７ａ、１７ｂ・・・切欠部−２０・・・分割線
阜 １ 目
＄ ３ 図
／６ａ
＄ ５ 図
芥４図
第 ６ｔ２１１FIG. 1 is a front view of a conventional bracket, and FIG. 2 is a sectional view of a conventional mounting structure. 6 to 6 show one embodiment of the present invention, and FIG. 3 is a front view of the bracket;
FIG. 4 is a plan view, FIG. 5 is a plan view showing how the bracket and printed board are attached, and FIG. 6 is a cross-sectional view of the bracket attached to the panel. 1... Bracket, 9... Light emitting diode, 10.
・Light-emitting diode lead wire, 11...Printed board, 1
5a, 15b・Positioning projections-16a, 16b・Latching claws, 17a, 17b・Notches-20・Parting line 1st item $3 Figure/6a $5 Figure 4 Figure 6t211
Claims (1)
嵌入して自立させ、そのブラケットにプリント板を載置
し、前記発光ダイオードのリード線をプリント板配線回
路に接続すべくなした発光ダイオードの取付構造におい
て、前記ブラケットの上端に少なくとも２個のプリント
板用位置決め突起を対応させて突設すると共に、該位置
決め突起に内方に向う係止爪を突設し、前記プリント板
は複数個を一連に連接させて一体に形成し、かつ該各プ
リント板に前記位置決め突起に対応する切欠部を形成す
ると共に、各プリント板とプリント板との間に分割線を
設け、前記ブラケットの位置決め突起にプリント板の切
欠部を適合させてプリント板を前記係止爪によりブラケ
ットに組付け、発光ダイオードをプリント板に接続した
後前記分割線より各プリント板を分離すべくなしたこと
を特徴とする発光ダイオードの取付構造。A light emitting diode mounting structure in which a light emitting diode is fitted into a bracket made of an elastic material such as rubber so as to stand on its own, a printed board is placed on the bracket, and the lead wire of the light emitting diode is connected to a printed board wiring circuit. At least two printed board positioning protrusions are protruded from the upper end of the bracket in correspondence with each other, and the positioning protrusions are provided with inwardly projecting locking claws, and the printed board is arranged in a series. The printed boards are connected and integrally formed, and each printed board is formed with a notch corresponding to the positioning protrusion, and a dividing line is provided between each printed board, and the printed board is connected to the positioning protrusion of the bracket. The light-emitting diode is characterized in that the printed board is assembled to the bracket by the locking pawl by matching the cutout part, and after the light-emitting diode is connected to the printed board, each printed board is separated from the parting line. Mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105808A JPS611070A (en) | 1985-05-20 | 1985-05-20 | Mounting method of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105808A JPS611070A (en) | 1985-05-20 | 1985-05-20 | Mounting method of light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS611070A true JPS611070A (en) | 1986-01-07 |
| JPH0422347B2 JPH0422347B2 (en) | 1992-04-16 |
Family
ID=14417403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60105808A Granted JPS611070A (en) | 1985-05-20 | 1985-05-20 | Mounting method of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611070A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5414180U (en) * | 1977-07-01 | 1979-01-30 | ||
| JPS5431318U (en) * | 1977-08-05 | 1979-03-01 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51118870A (en) * | 1975-04-10 | 1976-10-19 | Kenji Murakami | Apparatus for producing boiled noodle |
-
1985
- 1985-05-20 JP JP60105808A patent/JPS611070A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5414180U (en) * | 1977-07-01 | 1979-01-30 | ||
| JPS5431318U (en) * | 1977-08-05 | 1979-03-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0422347B2 (en) | 1992-04-16 |
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