JPS61104547U - - Google Patents

Info

Publication number
JPS61104547U
JPS61104547U JP18815984U JP18815984U JPS61104547U JP S61104547 U JPS61104547 U JP S61104547U JP 18815984 U JP18815984 U JP 18815984U JP 18815984 U JP18815984 U JP 18815984U JP S61104547 U JPS61104547 U JP S61104547U
Authority
JP
Japan
Prior art keywords
permanent magnet
brought
fixed arm
wire
bonding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18815984U
Other languages
English (en)
Other versions
JPH0222993Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984188159U priority Critical patent/JPH0222993Y2/ja
Publication of JPS61104547U publication Critical patent/JPS61104547U/ja
Application granted granted Critical
Publication of JPH0222993Y2 publication Critical patent/JPH0222993Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す要部の斜視図
、第２図は第１図の一部切断平面図で、第３図は
従来例を示す要部の斜視図、第４図は第３図の平
面図である。 １…固定アーム、２…可動片、３…可動アーム
、４…挟持部、５…永久磁石、６…コイル、７…
磁芯、８…電磁石。

Claims (1)

    【実用新案登録請求の範囲】
  1. 固定アーム端部に可動片端部を接離させるワイ
    ヤボンデイング装置におけるワイヤクランパにお
    いて、前記可動片端部を前記固定アーム端部に圧
    接せしめ、該圧接面の背面に永久磁石を設けると
    共に該永久磁石に対向させて電磁石を配備したこ
    とを特徴とするワイヤボンデイング装置における
    ワイヤクランパ。
JP1984188159U 1984-12-13 1984-12-13 Expired JPH0222993Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984188159U JPH0222993Y2 (ja) 1984-12-13 1984-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984188159U JPH0222993Y2 (ja) 1984-12-13 1984-12-13

Publications (2)

Publication Number Publication Date
JPS61104547U true JPS61104547U (ja) 1986-07-03
JPH0222993Y2 JPH0222993Y2 (ja) 1990-06-21

Family

ID=30745629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984188159U Expired JPH0222993Y2 (ja) 1984-12-13 1984-12-13

Country Status (1)

Country Link
JP (1) JPH0222993Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5570040A (en) * 1978-11-20 1980-05-27 Matsushita Electronics Corp Wire bonding device
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS59112631A (ja) * 1982-12-17 1984-06-29 Matsushita Electric Ind Co Ltd ワイヤボンデイング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5570040A (en) * 1978-11-20 1980-05-27 Matsushita Electronics Corp Wire bonding device
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS59112631A (ja) * 1982-12-17 1984-06-29 Matsushita Electric Ind Co Ltd ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPH0222993Y2 (ja) 1990-06-21

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